Journal of the Korean Ceramic Society (한국세라믹학회지)

The Korean Ceramic Society (한국세라믹학회)
권호 표지
DOI QR코드

DOI QR Code

Electrical Properties of DC Sputtered Titanium Nitride Films with Different Processing Conditions and Substrates

  • Jin, Yen (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, Young-Gu (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, Jong-Ho (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, Do-Kyung (Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology)
  • Published : 2005.07.01
Download PDF
⟨ Previous Next ⟩

Abstract

Deposition of TiN$_{x}$ film was conducted with a DC sputtering technique. The effect of the processing parameters such as substrate temperature, deposition time, working pressure, bias power, and volumetric flowing rate ratio of Ar to N$_{2}$ gas on the resistivity of TiN$_{x}$ film was systematically investigated. Three kinds of substrates, soda-lime glass, (100) Si wafer, and 111m thermally grown (111) SiO$_{2}$ wafer were used to explore the effect of substrate. The phase of TiN$_{x}$ film was analyzed by XRD peak pattern and deposition rate was determined by measuring the thickness of TiNx film through SEM cross-sectional view. Resistance was obtained by 4 point probe method as a function of processing parameters and types of substrates. Finally, optimum condition for synthesizing TiN$_{x}$ film having lowest resistivity was discussed.

Keywords

References

  1. B. F. Chen, J. Hwang, G. P. Yu, and J. H. Huang, ' In Situ Observation of the Cracking Behavior of TiN Coating on 304 Stainless Steel Subjected to Tensile Strain,' Thin Solid Films, 352 173-78 (1999) https://doi.org/10.1016/S0040-6090(99)00342-9
  2. P. LeClair, G. P. Berera, and J. S. Moodera, ' Titanium Nitride Thin Films Obtained by a Modified Physical Vapor Deposition Process,' Thin Solid Films, 376 [1-2] 9-15 (2000) https://doi.org/10.1016/S0040-6090(00)01192-5
  3. R. H. Dauskardt, M. Lane, Q. Ma, and N. Krishna, ' Adhesion and Debonding of Multi-Layer Thin Film Structures,' Eng. Fract. Mech., 61 [141] 141-62 (1998) https://doi.org/10.1016/S0013-7944(98)00052-6
  4. V. Talyansky, R. D. Vispute, R. Ramesh, R. P. Sharma, T. Venkatesan, Y. X. Li, L. G. Salamanca-Riba, M. C. Wood, R. T. Lareau, K. A. Jones, and A. A. Iliadis, ' Fabrication and Characterization of Epitaxial AlN/TiN Bilayers on Sapphire,' Thin Solid Films, 323 [1-2] 37-41 (1998) https://doi.org/10.1016/S0040-6090(97)00902-4
  5. B. Straumal, N. Vershinin, K. Filonov, R. Dimitriou, and W. Gust, ' Masked Deposition of Decorative on Large Area Glass and Plastic Sheet,' Thin Solid Films, 351 [1-2] 204-08 (1999) https://doi.org/10.1016/S0040-6090(99)00204-7
  6. R. Gordon, ' Chemical Vapor Deposition of Coatings on Glass,' J. Non-Cryst. Solids, 218 81-91 (1997) https://doi.org/10.1016/S0022-3093(97)00198-1
  7. F. Vaz, J. Ferreira, E. Ribeiro, L. Rebouta, S. Lanceros-Mendez, J. A. Mendes, E. Alves, P. Goudeau, J. P. Reviere, F. Ribeiro, I. Mountinho, K. Pischow, and J. de Rijk, ' Influence of Nitrogen Content on the Structural, Mechanical and Electrical Properties of TiN Thin Films,' Surf. and Coat. Tech., 191 [2-3] 317-23 (2005) https://doi.org/10.1016/j.surfcoat.2004.01.033
  8. J. M. Wang, W. G. Liu, and T. Mei, ' The Effect of Thermal Treatment on the Electrical Properties of Titanium Nitride Thin Films by Filtered Arc Plasma Method,' Ceramics International, 30 [7] 1921-24 (2004) https://doi.org/10.1016/j.ceramint.2003.12.042
  9. H. Z. Durusoy, O. Duyar, A. Aydinli, and F. Ay, ' Influence of Substrate Temperature and Bias Voltage on the Optical Transmittance of TiN Films,' Vacuum, 70 [1] 21-8 (2003) https://doi.org/10.1016/S0042-207X(02)00663-2

Cited by

  1. Structural and electrical characterization of CoTiN metal gates vol.117, pp.7, 2015, https://doi.org/10.1063/1.4908547