• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.2
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• pp.93-100
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• 2009

This paper presents a step up four channel DC-DC converter using charge pump voltage doubler structure. Our goal is to design and implement DC-DC converter for capacitive SP4T RF MEMS switch in front end module in wireless transceiver system. Charge pump structure is small and consume low power 3.3V input voltage is boosted by DC-DC Converter to $11.3{\pm}0.1V$, $12.4{\pm}0.1V$, $14.1{\pm}0.2V$ output voltage With 10MHz switching frequency. By using voltage level shifter structure, output of DC-DC converter is selected by 3.3V four channel selection signals and transferred to capacitive MEMS devices. External passive devices are not used for driving DC-DC converter. The total chip area is $2.8{\times}2.1mm^2$ including pads and the power consumption is 7.52mW, 7.82mW, 8.61mW.

• KEPCO Journal on Electric Power and Energy
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• v.6 no.4
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• pp.405-411
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• 2020

In this paper, we designed the COS MEMS system for sensing the falling detection and explosive noise of fuse link in COS (Cut Out Switch) installing on the power distribution. This system analyzed the failure characteristics and an instantaneous breakdown of power distribution. Therefore, our system strengths the industrial competence and guaranties the stable power supply. In this paper, we applied BLE (Bluetooth Low Energy) technology which is suitable protocol for low data rate, low power consumption and low-cost sensor applications. We experimented with LSM6DSOX which is system-in-module featuring 3 axis digital accelerometer and gyroscope boosting in high-performance mode and enabling always-on low-power features for an optimal motion for the COS fuse holder. Also, we used the MP34DT05-A for gathering an ultra-compact, low power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The proposed COS MEMS system is developed based on nRF52 SoC (System on Chip), and contained a 3-axis digital accelerometer, a digital microphone, and a SD card. In this paper of experiment steps, we analyzed the performance of COS MEMS system with gathering the accelerometer raw data and the PDM (Pulse Data Modulation) data of MEMS microphone for broadcasting the failure of COS status.

• Journal of Mechanical Science and Technology
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• v.20 no.4
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• pp.554-560
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• 2006

This paper describes the demonstration of successful fabrication and initial characterization of micromachined pressure sensors and micromachined jets (microjets) fabricated for use in macro flow control and other applications. In this work, the microfabrication technology was investigated to create a micromachined fluidic control system with a goal of application in practical fluids problems, such as UAV (Unmanned Aerial Vehicle)-scale aerodynamic control. Approaches of this work include: (1) the development of suitable micromachined synthetic jets (microjets) as actuators, which obviate the need to physically extend micromachined structures into an external flow; and (2) a non-silicon alternative micromachining fabrication technology based on metallic substrates and lamination (in addition to traditional MEMS technologies) which will allow the realization of larger scale, more robust structures and larger array active areas for fluidic systems. As an initial study, an array of MEMS pressure sensors and an array of MEMS modulators for orifice-based control of microjets have been fabricated, and characterized. Both pressure sensors and modulators have been built using stainless steel as a substrate and a combination of lamination and traditional micromachining processes as fabrication technologies.

• Transactions on Electrical and Electronic Materials
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• v.16 no.4
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• pp.173-178
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• 2015

In lieu of the excellent radio frequency (RF) performance of microelectromechanical system ( MEMS) switches, these micro switches need higher actuation voltage for their operation. This requirement is secondary to concerns over the swtiches’ reliability. This paper reports high reliability operation of RF MEMS switches with low voltage requirements. The proposed switch is optimised to perform in the Q-band, which results in actuation voltage of just 16.4 V. The mechanical stress gradient in the thin micro membrane is computed by simulating von Mises stress in a multi-physics environment that results in 90.4 MPa stress. The computed spring constant for the membrane is 3.02 N/m. The switch results in excellent RF performance with simulated isolation of above 38 dB, insertion loss of less than 0.35 dB and return loss of above 30 dB in the Q-band.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of Sensor Science and Technology
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• v.23 no.5
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• pp.326-331
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• 2014

In this study, a MEMS microphone that uses $Si_3N_4$ as the vibration membrane was produced for application as an auditory device using a sound visualization technique (sound visualization) for the hearing impaired. Two sheets of 6-inch silicon wafer were each fabricated into a vibration membrane and back plate, after which, wafer bonding was performed. A certain amount of charge was created between the bonded vibration membrane and the back plate electrodes, and a MEMS microphone that functioned through the capacitive method that uses change in such charge was fabricated. In order to evaluate the characteristics of the prepared MEMS microphone, the frequency flatness, frequency response, properties of phase between samples, and directivity according to the direction of sound source were analyzed. The MEMS microphone showed excellent flatness per frequency in the audio frequency (100 Hz-10 kHz) and a high response of at least -42 dB (sound pressure level). Further, a stable differential phase between the samples of within -3 dB was observed between 100 Hz-6 kHz. In particular, excellent omnidirectional properties were demonstrated in the frequency range of 125 Hz-4 kHz.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.3
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• pp.166-176
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• 2007

Radio frequency (RF) microelectromechanical systems (MEMS) have been pursued for more than a decade as a solution of high-performance on-chip fixed, tunable and reconfigurable circuits. This paper reviews our research work on RF MEMS switches and switching circuits in the past five years. The research work first concentrates on the development of lateral DC-contact switches and capacitive shunt switches. Low insertion loss, high isolation and wide frequency band have been achieved for the two types of switches; then the switches have been integrated with transmission lines to achieve different switching circuits, such as single-pole-multi-throw (SPMT) switching circuits, tunable band-pass filter, tunable band-stop filter and reconfigurable filter circuits. Substrate transfer process and surface planarization process are used to fabricate the above mentioned devices and circuits. The advantages of these two fabrication processes provide great flexibility in developing different types of RF MEMS switches and circuits. The ultimate target is to produce more powerful and sophisticated wireless appliances operating in handsets, base stations, and satellites with low power consumption and cost.

• Journal of Mechanical Science and Technology
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• v.20 no.4
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• pp.505-512
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• 2006

This paper presents an integrated multifunctional sensor based on MEMS technology, which can be used or embedded in mobile devices for environmental monitoring. An absolute pressure sensor, a temperature sensor and a humidity sensor are integrated in one silicon chip of which the size is $5mm\times5mm$. The pressure sensor uses a bulk-micromachined diaphragm structure with the piezoresistors. For temperature sensing, a silicon temperature sensor based on the spreading-resistance principle is designed and fabricated. The humidity sensor is a capacitive humidity sensor which has the polyimide film and interdigitated capacitance electrodes. The different piezoresistive orientation is used for the pressure and temperature sensor to avoid the interference between sensors. Each sensor shows good sensor characteristics except for the humidity sensor. However, the linearity and hysteresis of the humidity sensor can be improved by selecting the proper polymer materials and structures.

• Transactions on Electrical and Electronic Materials
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• v.14 no.5
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• pp.225-230
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• 2013

This paper presents a novel shunt radio frequency microelectromechanical system switch on a quartz substrate with stiff ribs around the membrane. The buckling effects in the switch membrane and stiction problem are the primary concerns with RF MEMS switches. These effects can be reduced by the proposed design approach due to the stiffness of the ribs around the membrane. A lower mass of the beam and a reduction in the squeeze film damping is achieved due to the slots and holes in the membrane, which further aid in attaining high switching speeds. The proposed switch is optimized to operate in the k-band, which results in a high isolation of -40 dB and low insertion loss of -0.047 dB at 21 GHz, with a low actuation voltage of only 14.6 V needed for the operation the switch. The membrane does not bend with this membrane design approach. Finite element modeling is used to analyze the stress and pull-in voltage.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.11
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• pp.1-8
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• 2005

In this paper, we present design and prototyping of a low-cost, integrated multi-functional micro health sensor chip that can be used or embedded in widely consumer devices, such as cell phone and PDA, for monitoring environmental condition including air pressure, temperature and humidity. This research's scope includes basic individual sensor study, architecture for integrating sensors on a chip, fabrication process compatibility and test/evaluation of prototype sensors. The results show that the integrated TPH sensor has good characteristics of ${\pm}\;1\%FS$ of linearity and hysteresis for pressure sensor and temperature sensor and of ${\pm}\;5\%FS$ of linearity and hysteresis But if we use 3rd order approximation for humidity sensor, full scale error becomes much smaller and this will be one of our future study.