1 |
C. Ding, X. Huang, G. Gregori, E. R. Parker, M. P. Rao, D. R. Clarke, and N. C. MacDon- ald, Proc. of the 2005 ASME International Mechanical Engineering Congress and Exposition (Orlando, 2005) p. 1-4.
|
2 |
T. Singh, Journal of Computational Electronics, 14, 167 (2015).
DOI
|
3 |
M. F. Aimi, M. P. Rao, N. C. MacDonald, A. S. Zuruhi, and D. P. Bothman, Nature Materials (Letters), 3, 103 (2004).
DOI
|
4 |
T. Singh and F. Pashaie, Microsystem Technologies, 1 (2014). [DOI: http://dx.doi.org/DOI:10.1007/s00542-014-2329-y 2014]
|
5 |
T. Singh and K. J. Rangra, Microsystem Technologies, 1 (2015). [DOI: http://dx.doi.org/10.1007/s00542-015-2411-0 2015]
|
6 |
T. Singh and N. Khaira, The Scientific World Journal, 2014, 1 (2014).
|
7 |
T. Singh, Electronics, 17, 105 (2013).
|
8 |
G. M. Rebeiz, RF MEMS: Theory, Design, and Technology. New York: Wiley-Interscience, 2003.
|
9 |
C. O’Mahony, M. Hill, P. J. Hugher, and W. A. Lane, Journal of Micromechanics and Microengineering, 12, 438 (2002).
DOI
|
10 |
D. Peroulis, S. Pacheco, K. Sarabandi, and L. P. Katehi, IEEE Transactions on Microwave Theory and Techniques, 51, 259 (2003).
DOI
|
11 |
M. Lishchunska, N. Cordero, O. Slattery, and C. O’Mahony, Sensor Letters, 4, 200 (2006).
DOI
|
12 |
T. Singh and F. Pashaie, Journal of Computing Science and Engineering, 8 (2014).
|
13 |
C. L. Goldsmith, T. Lin, B. Powers, W. Wu, and B. Norvell, IEEE International MTT-S Symposium Digest, 1, 91 (1995).
|
14 |
Z. J. Yao, S. Chen, S. Eshelman, D. Denniston, and C. L. Goldsmith, IEEE Journal of Microelectromechanical Systems, 8, 129 (1999).
DOI
|
15 |
T. Singh, Trans. Electr. Electron. Mater., 14, 172 (2013).
DOI
|