1 |
K. E. Peterson, IBM J. Res. Develop., 23, 376 (1979) [DOI: http://dx.doi.org/10.1147/RD.234.0376].
DOI
|
2 |
C. T. Nguyen, The 11th Annual International Workshop on Micro Electro Mechanical Systems (Heidelberg) (Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA 1998 Jan 25 - 29) p. 1 [DOI: http://dx.doi.org/10.1109/MEMSYS.1998.659719].
DOI
|
3 |
G. M. Rebeiz, RF MEMS Theory, Design and Technology (John Wiley & Sons, USA, 2003).
|
4 |
J. B. Muldavin and G. M. Rebeiz, IEEE Trans. Microw. Theory Techn. , 48, 1053 (2000) [DOI: http://dx.doi.org/10.1109/22.904744].
DOI
ScienceOn
|
5 |
Z. J. Yao, S. Chen, E. Eshelman, D. Denniston and C. L. Goldsmith, IEEE J. Microelectromech. Systems, 8, 129 (1999) [DOI: http://dx.doi.org/10.1109/84.767108].
DOI
ScienceOn
|
6 |
S. P. Pacheco, L. P. B. Katehi and C. T. Nguyen, Microwave Symposium Digest. 2000 IEEE MTT-S International (USA) (Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA 2000 Jun 11-16) p. 165 [DOI: http://dx.doi.org/10.1109/MWSYM.2000.860921].
DOI
|
7 |
M. Ruan, J. Shen and C. B. Wheeler, Micro Electro Mechanical Systems, 2001. MEMS 2011. The 14th IEEE International Conference on (USA) (Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA 2001 Jan 21-25) p. 224 [DOI: http://dx.doi. org/10.1109/MEMSYS.2001.906519].
DOI
|
8 |
H. C. Lee, J. H. Park, J. Y. Park, H. J. Nam and J. U. Bu, Journal of Micromechanics and Microengineering. 15, 2098 (2005) [DOI: http://dx.doi.org/10.1088/0960-1317/15/11/015].
DOI
ScienceOn
|
9 |
M. Daneshmand, S. Fauladi, R. R. Mansour, M. Lisi and T. Stajcer, Microwave Symposium Digest, 2009. MTT-S International (USA) (Microwave to Millimeter-wave Lab., Univ. of Alberta, Edmonton, AB, Canada 2009 Jun 07-12) p. 1217 [DOI: http:// dx.doi.org/10.1109/MWSYM.2009.5165922].
DOI
|
10 |
W. M. V. Spenger, R. Puers and I. D. Wolf, J. Adhesion Sci. Technol. 17, 563 (2003) [DOI: http://dx.doi.org/10.1163/15685610360554410].
DOI
ScienceOn
|
11 |
L. A. Rocha, E. Cretu and R. F. Wolffenbuttel, Tech. Proc. of the 2004 NSTI Nanotech. Conference and Trade Show (USA) (Nano Science and Tech. Inst. Boston, MA, 2004 Vol. 2) p. 203 (2004).
|
12 |
M. F. Badia, E. Butrado and A. M. Ionescu, IEEE J. Microelectromech. Systems, 21, 1229 (2012).
DOI
ScienceOn
|
13 |
J. B. Muldavin and G. M. Rebeiz, IEEE Trans. Microw. Theory Techn. , 48, 1045 (2000) [DOI: http://dx.doi.org/10.1109/22.904743].
DOI
ScienceOn
|
14 |
L. X. Zhang and Y. P. Zhao, Microsys. Technol. 9, 420 (2003) [DOI: http://dx.doi.org/10.1007/S00542-002-0250-2].
DOI
|
15 |
C. L. Goldsmith and D. I. Forehand, IEEE Microw. Wireless Compon. Lett. 15, 718 (2005) [DOI: http://dx.doi.org/10.1109/LMWC.2005.856827].
DOI
ScienceOn
|
16 |
G. Wang, RF MEMS switches with novel materials nd micromachining techniques for SOC/SOP RF front ends, Ph.D. Dissertation, (Georgia Institute of Technology, Atlanta, GA, 2006) [DOI: http://dx.doi.org/1853/14112].
|