• Journal of the Institute of Electronics Engineers of Korea TC
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• v.42 no.12
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• pp.171-176
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• 2005

This study designed and fabricated a multi-purpose planar antenna for base stations that are accessible to DCS, WiBro, and ISM. The proposed antenna was designed into an open loop form from the existing monopole structure. The capacitance of the multi-purpose antenna was increased by the coupling of open parts. This makes the use of MMIC and LTCC convenient and the antenna is smaller and has a larger gain than existing antennas. The resonance distance and bandwidth can be adjusted by changing the open gap and the height of the loop of the antenna. The bandwidth of the designed antenna satisfies DCS, IMT-2000, WiBro, Bluetooth, wireless LAN and ISM bands based on VSWR 2. The entire frequency bandwidth is $58.75\%$ of $1.575GHz\~2.985GHz(1.41GHz)$. Also, the radiation pattern of the antenna displayed co-polarization and cross-polarization characteristics at 1.6GHz, 2.3GHz and 2.8GHz.

• Journal of IKEEE
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• v.21 no.3
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• pp.248-251
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• 2017

In this paper, The proposed board is developed by EMI compliant Dash Camera with $360^{\circ}$ omni angle. The proposed board is designed by designing DM and CM input noise reduction circuit and applying active EMI filter coupling circuit. The DM and CM input noise reduction circuit design uses a differential op amp circuit to obtain the DM noise coupled to the input signal via the parasitic capacitance(CP). In order to simplify the circuit by applying the active EMI filter coupling circuit, a noise separator is installed to compensate the noise of the EMI source to compensate the CM and DM active filter simultaneously. In order to evaluate the performance of the board for the proposed EMI response, an authorized accreditation body has confirmed that the electromagnetic certification standard for each frequency band is satisfied.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.7
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• pp.778-785
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• 2010

The folded monopole antenna for applying mobile communications equipment and wireless devices is presented in this paper. By using the coplanar waveguide feed the operating bandwidth has improved. In addition, each individual resonant elements has occurred different capacitance through asymmetrical left and right ground planes; therefore, the bandwidth has kept and the impedance matching has stabilized. By measurement results, the impedance bandwidth under VSWR< 2.5:1 are $824{\sim}890$ MHz and the $1,500{\sim}2,170$ MHz, also radiation patterns has omni-directional characteristics. The maximum gains of the proposed antenna are 5.52, 0.64, 3.00, 0.94 and 1.85 dBi at 850, 1,575, 1,790, 1,930 and 2,050 MHz respectively. The proposed antenna will be adapted to the internal antenna of the mobile communication devices.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.3
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• pp.273-279
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• 2009

In this paper, an antenna which has dipole-like radiation pattern and low profile is proposed. The antenna is composed of four elements slot array based on L-shaped 0.43 $\lambda_g$ slot element. It presents a omni-directional radiation patter in the azimuth plane and has a null toward broad-side direction. In the design, a small mono-pole antenna which acts as a large capacitance element, combined with the partially removed ground plane by four L-shaped slots. As a result, these structure act as a LC resonator for radiation. The measured result shows, the impedance bandwidth(VSWR$\leq$2) of the proposed antenna is 60 MHz(2.35$\sim$2.41 GHz). The measured maximum radiation gain and efficiency of proposed antenna is 0.02 dBi, 56.7 % at center frequency 2.38 GHz, respectively. The proposed antenna can be applied to wireless tan access point system.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.5
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• pp.555-560
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• 2014

In order to improve spectrum sensitivity of photodiode for detection of the laser wavelength at 850 nm ~ 1000 nm of near-infrared band, this study has produced silicon-based photodiode whose area is $5000{\mu}m{\times}2000{\mu}m$, and the thickness is $280{\mu}m$. It was packed by the TO-5 type. The electrical properties of the dark currents have valued of approximately 0.1 nA for 5 V reverse bias, while the capacitance showed 32.5 pF at frequency range of 1 kHz and about 32.4 pF at the range of 200 kHz for 0 V. In addition, the rising time of output signal was as fast response as 20.92 ns for 10V. For the optical properties, the best spectrum sensitivity was 0.57 A/W for 890 nm, while it was relatively excellent value of 0.37 A/W for 1,000 nm. Over all, there were good spectrum sensitivity for this diode over the range of 870 ~ 920 nm.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.10a
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• pp.763-764
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• 2013

A three-dimensional image capturing device and its signal processing algorithm and apparatus are presented. Three dimensional information is one of emerging differentiators that provides consumers with more realistic and immersive experiences in user interface, game, 3D-virtual reality, and 3D display. It has the depth information of a scene together with conventional color image so that full-information of real life that human eyes experience can be captured, recorded and reproduced. 20 Mega-Hertz-switching high speed image shutter device for 3D image capturing and its application to system prototype are presented[1,2]. For 3D image capturing, the system utilizes Time-of-Flight (TOF) principle by means of 20MHz high-speed micro-optical image modulator, so called 'optical resonator'. The high speed image modulation is obtained using the electro-optic operation of the multi-layer stacked structure having diffractive mirrors and optical resonance cavity which maximizes the magnitude of optical modulation[3,4]. The optical resonator is specially designed and fabricated realizing low resistance-capacitance cell structures having small RC-time constant. The optical shutter is positioned in front of a standard high resolution CMOS image sensor and modulates the IR image reflected from the object to capture a depth image (Figure 1). Suggested novel optical resonator enables capturing of a full HD depth image with depth accuracy of mm-scale, which is the largest depth image resolution among the-state-of-the-arts, which have been limited up to VGA. The 3D camera prototype realizes color/depth concurrent sensing optical architecture to capture 14Mp color and full HD depth images, simultaneously (Figure 2,3). The resulting high definition color/depth image and its capturing device have crucial impact on 3D business eco-system in IT industry especially as 3D image sensing means in the fields of 3D camera, gesture recognition, user interface, and 3D display. This paper presents MEMS-based optical resonator design, fabrication, 3D camera system prototype and signal processing algorithms.

• Journal of Advanced Navigation Technology
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• v.23 no.2
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• pp.172-178
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• 2019

This paper has designed, fabricated, and analyzed the passive devices realized using low temperature co-fired ceramic (LTCC) multi layer substrates by dividing into the shrinkage process and the non-shrinkage process. Using two types of ceramic materials with dielectric constant 7 or 40, we have fabricated the same shape of various elements in 2 different processes and compared the characteristics. For the substrate of dielctric constant 40, compared with the shrinkage process which has 17% shrink in the X and Y directions with 36% shrink in the Z direction, the non-shrinkage process has 43% shrink in the Z direction without shrink in the X and Y directions, so high dimensional accuracy and surface flatness can be obtained. The inductances and capacitances of the fabricated elements are estimated from measurement using empirical analysis equations of parameters and implemented as a design library. Depending on the substrate and the process, the inductance and capacitance depending on the turn number of winding and unit area have been measured, and empirical polynomials are proposed to predict element values.

• Journal of Radiation Industry
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• v.6 no.1
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• pp.31-40
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• 2012

There are two methods to fabricate the readout electronic to a large-area CMOS image sensor (LACIS). One is to design and manufacture the sensor part and signal processing electronics in a single chip and the other is to integrate both parts with bump bonding or wire bonding after manufacturing both parts separately. The latter method has an advantage of the high yield because the optimized and specialized fabrication process can be chosen in designing and manufacturing each part. In this paper, LACIS chip, that is optimized design for the latter method of fabrication, is presented. The LACIS chip consists of a 3-TR pixel photodiode array, row driver (or called as a gate driver) circuit, and bonding pads to the external readout ICs. Among 4 types of the photodiode structure available in a standard CMOS process, $N_{photo}/P_{epi}$ type photodiode showed the highest quantum efficiency in the simulation study, though it requires one additional mask to control the doping concentration of $N_{photo}$ layer. The optimized channel widths and lengths of 3 pixel transistors are also determined by simulation. The select transistor is not significantly affected by channel length and width. But source follower transistor is strongly influenced by length and width. In row driver, to reduce signal time delay by high capacitance at output node, three stage inverter drivers are used. And channel width of the inverter driver increases gradually in each step. The sensor has very long metal wire that is about 170 mm. The repeater consisted of inverters is applied proper amount of pixel rows. It can help to reduce the long metal-line delay.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.11
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• pp.821-827
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• 2018

In devices used for re-forming osteoblasts to treat osteoporosis, a magnetic field is applied from the outside of the bone, and the minerals contained in the bone are aligned in a certain direction and undergo precessional motion. When a $90^{\circ}$ RF pulse is applied by using an RF coil, protons of minerals are brought to an excited state, and phosphorus activity promoting the deposition of osteoblasts in the bone is increased, thereby reshaping the bone. Miniaturizing the RF coil that generates a signal corresponding to the harmonic of the precessional motional frequency by means of the $90^{\circ}$ RF pulse can drastically reduce the overall size of the bone reshaping system. In this study, we propose a methodology for the miniaturization of the RF coil that can be used for osteoblast re-formation using a bone reshaping system. The capacitance of the designed RF coil is 25 pF, the inductance is approximately 100 nH, and the resonance frequency is 96 MHz. The radius of the end ring of the designed RF coil is 18 cm, and the total length of the leg is $2{\times}11.6cm$. The performance of the coil is verified through post-design measurement.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.8
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• pp.22-26
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• 2012

This paper introduces a 2.5-Gb/s optical receiver implemented in a standard 1P4M 0.18um CMOS technology for the applications of active optical HDMI cables. The optical receiver consists of a differential transimpedance amplifier(TIA), a five-stage differential limiting amplifier(LA), and an output buffer. The TIA exploits the inverter input configuration with a resistive feedback for low noise and power consumption. It is cascaded by an additional differential amplifier and a DC-balanced buffer to facilitate the following LA design. The LA consists of five gain cells, an output buffer, and an offset cancellation circuit. The proposed optical receiver demonstrates $91dB{\Omega}$ transimpedance gain, 1.55 GHz bandwidth even with the large photodiode capacitance of 320 fF, 16 pA/sqrt(Hz) average noise current spectral density within the bandwidth (corresponding to the optical sensitivity of -21.6 dBm for $10^{-12}$ BER), and 40 mW power dissipation from a single 1.8-V supply. Test chips occupy the area of $1.35{\times}2.46mm^2$ including pads. The optically measured eye-diagrams confirms wide and clear eye-openings for 2.5-Gb/s operations.