• ETRI Journal
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• 제33권3호
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• pp.393-400
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• 2011

A systematic approach for the design of two-stage class AB CMOS unity-gain buffers is proposed. It is based on the inclusion of a class AB operation to class A Miller amplifier topologies in unity-gain negative feedback by a simple technique that does not modify quiescent currents, supply requirements, noise performance, or static power. Three design examples are fabricated in a 0.5 ${\mu}m$ CMOS process. Measurement results show slew rate improvement factors of approximately 100 for the class AB buffers versus their class A counterparts for the same quiescent power consumption (< 200 ${\mu}W$).

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권3호
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• pp.326-333
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• 2015

This paper reports an adaptive positive feedback bias control technique for operational transconductance amplifiers to adjust the bias current based on the output current monitored by a current replica circuit. This technique enables operational transconductance amplifiers to quickly adapt their power consumption to various analog workloads when they are configured with negative feedback. To prove the concept, a test voltage follower is fabricated in $0.5-{\mu}m$ CMOS technology. Measurement result shows that the power consumption of the test voltage follower is approximately linearly proportional to the load capacitance, the signal frequency, and the signal amplitude for sinusoidal inputs as well as square pulses.

• Transactions on Electrical and Electronic Materials
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• 제14권5호
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• pp.235-241
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• 2013

A low power CMOS control circuit is applied in an integrated DC-DC buck converter. The integrated converter is composed of a feedback control circuit and power block with 0.35 ${\mu}m$ CMOS process. A current-sensing circuit is integrated with the sense-FET method in the control circuit. In the current-sensing circuit, a current-mirror is used for a voltage follower in order to reduce power consumption with a smaller chip-size. The N-channel MOS acts as a switching device in the current-sensing circuit where the sensing FET is in parallel with the power MOSFET. The amplifier and comparator are designed to obtain a high gain and a fast transient time. The converter offers well-controlled output and accurately sensed inductor current. Simulation work shows that the current-sensing circuit is operated with an accuracy of higher than 90% and the transient time of the error amplifier is controlled within $75{\mu}sec$. The sensing current is in the range of a few hundred ${\mu}A$ at a frequency of 0.6~2 MHz and an input voltage of 3~5 V. The output voltage is obtained as expected with the ripple ratio within 1%.

• IEIE Transactions on Smart Processing and Computing
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• 제3권6호
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• pp.416-424
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• 2014

This paper presents an 8-bit pipelined analog-to-digital converter. The supply voltage applied for comparators and other sub-blocks of the ADC were 0.7V and 0.5V, respectively. This low power ADC utilizes the capacitive charge pump technique combined with a source-follower and calibration to resolve the need for the opamp. The differential charge pump technique does not require any common mode feedback circuit. The entire structure of the ADC is based on fully dynamic circuits that enable the design of a very low power ADC. The ADC was designed to operate at 1MS/s in 90nm CMOS process, where simulated results using ADS2011 show the peak SNDR and SFDR of the ADC to be 47.8 dB (7.64 ENOB) and 59 dB respectively. The ADC consumes less than 1mW for all active dynamic and digital circuitries.

• 센서학회지
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• 제15권5호
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• pp.341-346
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• 2006

We have fabricated SOI CMOS active pixel image sensor with the pinned photodiode on handle wafer in order to reduce dark currents and improve spectral response. The structure of the active pixel image sensor is 4 transistors APS which consists of a reset and source follower transistor on seed wafer, and is comprised of the photodiode, transfer gate, and floating diffusion on handle wafer. The source of dark current caused by the interface traps located on the surface of a photodiode is able to be eliminated, as we apply the pinned photodiode. The source of dark currents between shallow trench isolation and the depletion region of a photodiode can be also eliminated by the planner process of the hybrid bulk/SOI structure. The photodiode could be optimized for better spectral response because the process of a photodiode on handle wafer is independent of that of transistors on seed wafer. The dark current was about 6 pA at 3.3 V of floating diffusion voltage in the case of transfer gate TX = 0 V and TX=3.3 V, respectively. The spectral response of the pinned photodiode was observed flat in the wavelength range from green to red.

• 스마트미디어저널
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• 제4권2호
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• pp.55-61
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• 2015

A bandwidth-enhanced ultra-wide band (UWB) CMOS balun-LNA is implemented as a part of a software defined radio (SDR) receiver which supports multi-band and multi-standard. The proposed balun-LNA is composed of a single-to-differential converter, a differential-to-single voltage summer with inductive shunt peaking, a negative feedback network, and a differential output buffer with composite common-drain (CD) and common-source (CS) amplifiers. By feeding the single-ended output of the voltage summer to the input of the LNA through a feedback network, a wideband balun-LNA exploiting negative feedback is implemented. By adopting a source follower-based inductive shunt peaking, the proposed balun-LNA achieves a wider gain bandwidth. Two LNA design examples are presented to demonstrate the usefulness of the proposed approach. The LNA I adopts the CS amplifier with a common gate common source (CGCS) balun load as the S-to-D converter for high gain and low noise figure (NF) and the LNA II uses the differential amplifier with the ac-grounded second input terminal as the S-to-D converter for high second-order input-referred intercept point (IIP2). The 3 dB gain bandwidth of the proposed balun-LNA (LNA I) is above 5 GHz and the NF is below 4 dB from 100 MHz to 5 GHz. An average power gain of 18 dB and an IIP3 of -8 ~ -2 dBm are obtained. In simulation, IIP2 of the LNA II is at least 5 dB higher than that of the LNA I with same power consumption.

• 대한전자공학회논문지SD
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• 제39권7호
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• pp.7-15
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• 2002

The digital DBS tuner is designed and implemented in a CMOS process using a direct-conversion architecture that offers a high degree of integration. To generate mathched LO I/Q quadrature signals covering the total input frequency range, a fully integrated ring oscillator is employed. And, to decrease a high level of phase noise of the ring oscillator, a frequency synthesizer is designed using a double loop strucure. This paper proposes and verifies a band selective loop for fast frequency switching time of the double loop frequency synthesizer. The down-conversion mixer with source follower input stages is used for low voltage operation. An experiment implementation of the frequency synthesizer and mixer with integrated a 0.25um CMOS process achieves a switching time of 600us when frequency changes from 950 to 2150MHz. And, the experiment results show a quadrature amplitude mismatch of max. 0.06dB and a quadrature phase mismathc of max. >$3.4^{\circ}$.

• 한국산학기술학회논문지
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• 제13권9호
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• pp.4159-4164
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• 2012

본 논문에서는 암호통신을 위한 전압 제어형 카오스 신호 발생회로를 설계하였다. 제안하는 회로는 3개의 MOS 소자로 이루어지는 비선형 함수 블록과 소스 팔로워를 버퍼로 하는 이산형 카오스 신호 발생회로로, 비겹침 2상 클럭으로 구동되며, 2개의 제어전압 단자를 가진다. 제안된 회로는 SPICE 모의실험을 통하여 시간특성, 주파수특성 및 분기도 등의 여러 가지 카오스 다이내믹스가 생성됨을 확인하였다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권2호
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• pp.95-103
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• 2011

This paper proposes a 6b 1.2 GS/s 47.8 mW 0.17 $mm^2$ 65 nm CMOS ADC for high-rate wireless personal area network systems. The proposed ADC employs a source follower-free flash architecture with a wide input range of 1.0 $V_{p-p}$ at a 1.2 V supply voltage to minimize power consumption and high comparator offset effects in a nanometer CMOS technology. The track-and-hold circuits without source followers, the differential difference amplifiers with active loads in pre-amps, and the output averaging layout scheme properly handle a wide-range input signal with low distortion. The interpolation scheme halves the required number of pre-amps while three-stage cascaded latches implement a skew-free GS/s operation. The two-step bubble correction logic removes a maximum of three consecutive bubble code errors. The prototype ADC in a 65 nm CMOS demonstrates a measured DNL and INL within 0.77 LSB and 0.98 LSB, respectively. The ADC shows a maximum SNDR of 33.2 dB and a maximum SFDR of 44.7 dB at 1.2 GS/s. The ADC with an active die area of 0.17 $mm^2$ consumes 47.8 mW at 1.2 V and 1.2 GS/s.

• 방사선산업학회지
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• 제9권1호
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• pp.1-7
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• 2015

The trend of x-ray image sensor has been evolved from an amorphous silicon sensor to a crystal silicon sensor. A crystal silicon X-ray sensor, meaning a X-ray CIS (CMOS image sensor), is consisted of three transistors (Trs), i.e., a Reset Transistor, a Source Follower and a Select Transistor, and a photodiode. They are highly sensitive to radiation exposure. As the frequency of exposure to radiation increases, the quality of the imaging device dramatically decreases. The most well known effects of a X-ray CIS due to the radiation damage are increments in the reset voltage and dark currents. In this study, a pixel array of a X-ray CIS was made of $20{\times}20pixels$ and this pixel array was exposed to a high radiation dose. The radiation source was Co-60 and the total radiation dose was increased from 1 to 9 kGy with a step of 1 kGy. We irradiated the small pixel array to get the increments data of the reset voltage and the dark currents. Also, we simulated the radiation effects of the pixel by MCNP (Monte Carlo N-Particle) simulation. From the comparison of actual data and simulation data, the most affected location could be determined and the cause of the increments of the reset voltage and dark current could be found.