• 전자통신동향분석
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• 제38권6호
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• pp.52-61
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• 2023

With semiconductor scaling approaching the physical limits, devices including CMOS (complementary metal-oxide-semiconductor) components have managed to overcome yet are currently struggling with several technical issues like short-channel effects. Evolving from the process node of 22 nm with FinFET (fin field effect transistor), state-of-the-art semiconductor technology has reached the 3 nm node with the GAA-FET (gate-all-around FET), which appropriately addresses the main issues of power, performance, and cost. Technical problems remain regarding the foundry of GAA-FET, and next-generation devices called post-GAA transistors have not yet been devised, except for the CFET (complementary FET). We introduce a CFET that spatially stacks p- and n-channel FETs on the same footprint and describe its structure and fabrication. Technical details like stacking of nanosheets, special spacers, hetero-epitaxy, and selective recess are more thoroughly reviewed than in similar articles on CFET fabrication.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권3호
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• pp.401-410
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• 2017

In this work, we show that the excessive lattice heating problem due to parasitic pnp transistor action in the diode electrostatic discharge (ESD) protection device in the diode input protection circuit, which is favorably used in CMOS RF ICs, can be solved by adopting a symmetrical cathode structure. To explain how the recipe works, we construct an equivalent circuit for input human-body model (HBM) test environment of a CMOS chip equipped with the diode protection circuit, and execute mixed-mode transient simulations utilizing a 2-dimensional device simulator. We attempt an in-depth comparison study by varying device structures to suggest valuable design guidelines in designing the protection diodes connected to the $V_{DD}$ and $V_{SS}$ buses. Even though this work is based on mixed-mode simulations utilizing device and circuit simulators, the analysis given in this work clearly explain the mechanism involved, which cannot be done by measurements.

• 전자공학회지
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• 제24권6호
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• pp.38-49
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• 1997

0.4mm Resign Rule의 Super Low Power Dissipation, Low Voltage. Operation-5- Full CMOS SRAM Cell을 개발하였다. Retrograde Well과 PSL(Poly Spacer LOCOS) Isolation 공정을 사용하여 1.76mm의 n+/p+ Isolation을 구현하였으며 Ti/TiN Local Interconnection을 사용하여 Polycide수준의 Rs와 작은 Contact저항을 확보하였다. p-well내의 Boron이 Field oxide에 침적되어 n+/n-well Isolation이 취약해짐을 Simulation을 통해 확인할 수 있었으며, 기생 Lateral NPN Bipolar Transistor의 Latch Up 특성이 취약해 지는 n+/n-wellslze는 0.57mm이고, 기생 Vertical PNP Bipolar Transistor는 p+/p-well size 0.52mm까지 안정적인 Current Gain을 유지함을 알 수 있었다. Ti/TiN Local Interconnection의 Rs를 Polycide 수준으로 낮추는 것은 TiN deco시 Power를 증가시키고 Pressure를 감소시킴으로써 실현할 수 있었다. Static Noise Margin분석을 통해 Vcc 0.6V에서도 Cell의 동작 Margin이 있음을 확인할 수 있었으며, Load Device의 큰 전류로 Soft Error를 개선할수 있었다. 본 공정으로 제조한 1M Full CMOS SRAM에서 Low Vcc margin 1.0V, Stand-by current 1mA이하(Vcc=3.7V, 85℃기준) 를 얻을 수 있었다.

• ETRI Journal
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• 제20권1호
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• pp.37-45
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• 1998

Reduced surface field lateral double-diffused MOS transistor for the driving circuits of plasma display panel and field emission display in the 120V region have been integrated for the first time into a low-voltage $1.2{\mu}m$ analog CMOS process using p-type bulk silicon. This method of integration provides an excellent way of achieving both high power and low voltage functions on the same chip; it reduces the number of mask layers double-diffused MOS transistor with a drift length of $6.0{\mu}m$ and a breakdown voltage greater than 150V was self-isolated to the low voltage CMOS ICs. The measured specific on-resistance of the lateral double-diffused MOS in $4.8m{\Omega}{\cdot}cm^2$ at a gate voltage of 5V.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.17.2-17.2
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• 2010

Printed electronics is an emerging technology to realize various microelectronic devices via a cost-effective method. Here we demonstrated a high performance of p-channel and n-channel top-gate/bottom contact polymer field-effect transistors (FETs), and applications to elementary organic complementary inverter and ring oscillator circuits by inkjet processing. We could obtained high field-effect mobility more than $0.4\;cm^2/Vs$ for both of p-channel and n-channel FETs, and successfully measured inkjet-printed polymer inverters. The performance of devices highly depends on the selection of dielectrics, printing condition and device architecture. Optimized CMOS ring oscillators with p-type and n-type polymer transistors showed as high as 50 kHz operation frequency. This research was financially supported by development of next generation RFID technology for item level applications (2008-F052-01) funded by the ministry of knowledge economy (MKE).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1993년도 추계학술대회 논문집
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• pp.93-96
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• 1993

BiCMOS technology, which combines CMOS and bipolar technology, offers the possibility of achieving both very high density and high performance. In this paper, the characteristics of BiCMOS and CMOS circuits, especilly the delay time is studied. BiCMOS inverter, which has high drive ability because of bipolar transistor, drives high load capacitance and has low-power characteristics because the current flows only during switching transient just like the CMOS gate. BiCMOS inverter has the less dependence on load capacitance than CMOS inverter. SPICE that has been used for electronic circuit analysis is chosen to simulate these circuits and the characteristics is discussed.

• 전기학회논문지P
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• 제53권1호
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• pp.22-27
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• 2004

BiCMOS circuit consist of CMOS part which constructs logic function, and bipolar part which drives output load. In BiCMOS circuits, transistor stuck-open faults exhibit delay faults in addition to sequential behavior. In this paper, proposes a method for efficiently generating test pattern which detect stuck-open in BiCMOS circuits. In proposed method, BiCMOS circuit is divided into pull-up part and pull-down part, using structural property of BiCMOS circuit, and we generate test pattern using set theory for efficiently detecting faults which occured each divided blocks.

• 전자공학회논문지C
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• 제34C권1호
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• pp.1-11
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• 1997

A BiCMOS circuit consists of the CMOS part which performs the logic function, and the bipolar part which drives output load. In BiCMOS circuits, transistor stuck-open faults exhibit delay faults in addition to sequential beavior. Also, stuck-on faults enhanced IDDQ (quiscent power supply current) at steady state. In this paper, a method is proposed which efficiently generates test patterns to detect stuck-open faults and stuck-on faults in BiCMOS circuits. The proposed method divides the BiCMOS circuit into pull-up part and pull-down part, and generates test patterns detect faults occured in each part by structural property of the BiCMOS circuit.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.118-119
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• 2007

High performance three-dimensional (3-D) stacked poly-Si complementary metal-oxide semiconductor (CMOS) inverters with a high quality laser crystallized channel were fabricated. Low temperature crystallization methods of a-Si film using the excimer-laser annealing (ELA) and sequential lateral solidification (SLS) were performed. The NMOS thin-film-transistor (TFT) at lower layer of CMOS was fabricated on oxidized bulk Si substrate, and the PMOS TFT at upper layer of CMOS was fabricated on interlayer dielectric film. The 3-D stacked poly-Si CMOS inverter showed excellent electrical characteristics and was enough for the vertical integrated CMOS applications.

• 센서학회지
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• 제26권2호
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• pp.85-90
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• 2017

A wide dynamic range (WDR) CMOS image sensor (CIS) was developed with a specialized readout architecture for realizing high-sensitivity (HS) and low-sensitivity (LS) reading modes. The proposed pixel is basically a three-transistor (3T) active pixel sensor (APS) structure with an additional transistor. In the developed WDR CIS, only one mode between the HS mode for relatively weak light intensity and the LS mode for the strong light intensity is activated by an external controlling signal, and then the selected signal is read through each column-parallel readout circuit. The LS mode is implemented with the column capacitors and a feedback structure for adjusting column capacitor size. In particular, the feedback circuit makes it possible to change the column node capacitance automatically by using the incident light intensity. As a result, the proposed CIS achieved a wide dynamic range of 94 dB by synthesizing output signals from both modes. The prototype CIS is implemented with $0.18-{\mu}m$ 1-poly 6-metal (1P6M) standard CMOS technology, and the number of effective pixels is 176 (H) ${\times}$ 144 (V).