• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.2
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• pp.424-427
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• 2007

A fully differential transconductor using the series composite transistor is proposed. Simulation results show that THD is less than 1.2% for the differential input signal of up to $1.5V_{p-p}$ when the input signal frequency is 10MHz. i he proposed transconductor is used to design a third-order elliptic Gm-C lowpass filter with 138kHz cutoff frequency for ADSL Tx filter. The design procedure is based on signal flow graph(SFG) of a doubly-terminated LC ladder filter by means of fully differential transconductors and capacitors. The filter is fabricated and measured with a $0.35{\mu}m$ CMOS process.

• Proceedings of the IEEK Conference
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• summer
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• pp.74-76
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• 2004

A Half-VDD Voltage(VHDD) Generator using PMOS pull-up transistor and NMOS pull-down transistor was newly proposed for low-voltage DRAMs. The driving current was increased and the power-on settling time was reduced in the new circuit. The newly proposed VHDD generator worked successfully at VDD at 1.5V and fabricated using 0.18um CMOS twin-well technology.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.239-239
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• 2013

For more than four decades, ion-sensitive field-effect transistor (ISFET) sensors that respond to the change of surface potential on a membrane have been intensively investigated in the chemical, environmental, and biological spheres, because of their potential, in particular their compatibility with CMOS manufacturing technology. Here, we demonstrate a new type of ISFET with dual-gate (DG) structure fabricated on ultra-thin body (UTB), which highly boosts sensitivity, as well as enhancing chemical stability. The classic ion-sensitive field-effect transistor (ISFET) has been confronted with chronic problems; the Nernstian response, and detection limit with in the Debye length. The super-coupling effects imposed on the ultra thin film serve to not only maximize sensitivity of the DG ISFET, but also to strongly suppress its leakage currents, leading to a better chemical stability. This geometry will allow the ISFET based biosensor platform to continue enhancement into the next decade.

• ETRI Journal
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• v.41 no.3
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• pp.383-395
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• 2019

Clock Controlled Dual keeper Domino logic structures (CCDD_1 and CCDD_2) for achieving a high-speed performance with low power consumption and a good noise margin are proposed in this paper. The keeper control circuit comprises an additional PMOS keeper transistor controlled by the clock and foot node voltage. This control mechanism offers abrupt conditional control of the keeper circuit and reduces the contention current, leading to high-speed performance. The keeper transistor arrangement also reduces the loop gain associated with the feedback circuitry. Hence, the circuits offer less delay variability. The design and simulation of various wide fan-in designs using 180 nm CMOS technology validates the proposed CCDD_1 and CCDD_2 designs, offering an increased speed performance of 7.2% and 8.5%, respectively, over a conventional domino logic structure. The noise gain margin analysis proves good robustness of the CCDD structures when compared with a conventional domino logic circuit configuration. A Monte Carlo simulation for 2,000 runs under statistical process variations demonstrates that the proposed CCDD circuits offer a significantly reduced delay variability factor.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.2
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• pp.185-190
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• 2016

A 70-${\AA}$ nanowire field-effect transistor (FET) for sub-10-nm CMOS technology is designed and simulated in order to investigate the impact of an oxide trap on random telegraph noise (RTN) in the device. It is observed that the drain current fluctuation (${\Delta}I_D/I_D$) increases up to a maximum of 78 % due to the single electron trapping. In addition, the effect of various trap positions on the RTN in the nanowire FET is thoroughly analyzed at various drain and gate voltages. As the drain voltage increases, the peak point for the ${\Delta}I_D/I_D$ shifts toward the source side. The distortion in the electron carrier density and the conduction band energy when the trap is filled with an electron at various positions in the device supports these results.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.775-777
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• 2016

In this paper presents an analysis of pulsed radiation effects of unit devices. Unit devices are the nMOSFET, pMOSFET, NPN Transistor and those fabricated by the 0.18um CMOS process. Pulsed radiation test results in nMOSFET, the photocurrent of tens nA was generated in $2.07{\times}10^8rad(si)/s$. For the pMOSFET, a photocurrent generation was not observed in $3{\times}10^8rad(si)/s$. For the NPN transistor, the photocurrent was generated with about 1uA. Therefore, the MOSFET must be used than BJT transistor when radhard IC design.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.4
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• pp.88-95
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• 2015

This paper presents a new analysis of RF negative resistance (RFNR) circuits, known as a negative resistance generator. For accurate equation analysis of RFNR, this study examined the effects of the gate resistance and the source parasitic capacitance of the transistor. In addition, the input admittance of the conventional equation was calculated by looking into the source-terminal of the transistor, whereas that of the proposed equation was calculated by examining the gate-terminal of the transistor. The proposed equation analysis is more accurate than that of the conventional analysis, especially for higher frequency range. This paper verify the accuracy of the proposed analysis at high frequency range using the simulation.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.7
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• pp.1227-1234
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• 2008

In this paper is designed a 256-bit synchronous OTP(one-time programmable) memory required in application fields such as automobile appliance power ICs, display ICs, and CMOS image sensors. A 256-bit synchronous memory cell consists of NMOS capacitor as antifuse and access transistor without a high-voltage blocking transistor. A gate bias voltage circuit for the additional blocking transistor is removed since logic supply voltage VDD(=1.5V) and external program voltage VPPE(=5.5V) are used instead of conventional three supply voltages. And loading current of cell to be programmed increases according to RON(on resistance) of the antifuse and process variation in case of the voltage driving without current constraint in programming. Therefore, there is a problem that program voltage can be increased relatively due to resistive voltage drop on supply voltage VPP. And so loading current can be made to flow constantly by using the current driving method instead of the voltage driving counterpart in programming. Therefore, program voltage VPP can be lowered from 5.9V to 5.5V when measurement is done on the manufactured wafer. And the sens amplifier circuit is simplified by using the sens amplifier of clocked inverter type instead of the conventional current sent amplifier. The synchronous OTP of 256 bits is designed with Magnachip $0.13{\mu}m$ CMOS process. The layout area if $298.4{\times}314{\mu}m2$.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.12
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• pp.234-241
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• 2012

This paper proposes a novel design methodology considering transistor layout variation. The proposed design technique is to improve the transistor's electrical characteristics without performing a circuit simulation to extract transistor layout variation. There are three advantages in the proposed method. Firstly, there is no need to change the normal design flow used in layout designs. Secondly, there is no need to perform simulation in order to extract the transistor layout variation. Thirdly, early warnings in layout design lead to decreasing the number of post layout simulations. Less post layout simulations will decrease the number of iterations in the design cycle and shorten design period. The number of bad transistors in the early design phase were reduced from 17.8% to 2.9% by applying eDRC environment for layout designers to develop Standard Cell Library.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.2
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• pp.36-47
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• 1998

Low power circuit techniques have been developed to realize the highest possible performance of embedded SRAM at 1V power supply with$0.5\mu\textrm{m}$ single threshold CMOS technology in which the unbalance between NMOS and PMOS threshold voltages is utilized to optimize the low power CMOS IC design. To achieve the best trade-off between the transistor drivability and the subthreshold current increase, the ground potential of memory array is raised to suppressthe subthreshold current. The problems of lower cellstability and bit-line dealy increase due to the enhanced array ground potential are evaluated to be controlled within the allowable range by careful circuit design. 160MHz, 128kb embedded SRAM with 3.4ns access time is demonstrated with the power consumption of 14.8mW in active $21.4{mu}W$ in standby mode at 1V power supply.