• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.510-510
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• 2000

This paper introduces the design of BiCMOS latched comparator circuit for high-speed system application, which can be used in data conversion, instrumentation, communication system etc. By exploiting the advantage technology of the combination of both the bipolar transistor and the CMOS transistor devices. The comparator circuit includes an input stage that combines MOS sampling with a bipolar regenerative amplifier. The resistive load of conventional current-steering comparator is replaced by a load, which is made by a NMOS transistor. The advantage of design and PSPICE simulation of BiCMOS latched comparator are the circuit will obtain wide bandwidth with lowest power consumption at a single supply voltage. All the characteristics of the proposed BiCMOS latched comparator circuit is carried out by simulation program.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.2
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• pp.106-109
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• 2004

A high-density 3-transistor cell one-time programmable (OTP) ROM array using standard CMOS Gate-Oxide antifuse (AF) is proposed, fabricated, and characterized with $0.18{\mu}m$ CMOS process. The proposed non-volatile high-density OTP ROM is composed of an array of 3-T OTP cells with the 3-T consisting of an nMOS AF, a high voltage (HV) blocking transistor, and a cell access transistor, all compatible with standard CMOS technology.

• Journal of the Optical Society of Korea
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• v.15 no.1
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• pp.1-3
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• 2011

We characterize and analyze silicon avalanche photodetectors (APDs) fabricated with standard complementary metal-oxide-semiconductor (CMOS) technology. Current characteristics, responsivity, avalanche gain, and photodetection bandwidth of CMOS-APDs based on two types of PN junctions, N-well/P-substrate and $P^+$/N-well junctions, are compared and analyzed. It is demonstrated that the CMOS-APD using the $P^+$/N-well junction has higher responsivity as well as higher photodetection bandwidth than N-well/P-substrate. In addition, the important factors influencing CMOS-APD performance are clarified from this investigation.

• Journal of Sensor Science and Technology
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• v.14 no.6
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• pp.387-394
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• 2005

In order to design SOI CMOS image sensors, SOI MOSFET model parameters were extracted using the equation of bulk MOSFET model parameters and were optimized using SPICE level 2. Simulated I-V characteristics of the SOI NMOSFET using the extracted model parameters were compared to the experimental I-V characteristics of the fabricated SOI NMOSFET. The simulation results agreed well with experimental results. A unit pixel for SOI CMOS image sensors was designed and was simulated for the PPS, APS, and logarithmic circuit using the extracted model parameters. In these CMOS image sensors, a nano-wire MOSFET photodetector was used. The output voltage levels of the PPS and APS are well-defined as the photocurrent varied. It is confirmed that SOI CMOS image sensors are faster than bulk CMOS image sensors.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.14 no.3
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• pp.189-196
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• 1989

In this paper, BICMOS gate array technology that has CMOS devices for logic applications and bipolar devices for driver applications is presented. An optimized poly gate p-well CMOS process is chosen to fabricate the BICMOS gate array system and the basic concepts to design these devices are to improve the characteristics of bipolar & CMOS device with simple process technology. As the results hFE value is 120(Ic=1mA) for transistor, and there is no short channel effects for CMOS devices which have Leff to 1.25um and 1.35um for n-channel, respectively, 0.8nx gate delay time of 41 stage ring oscillators is obtained.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.37 no.6
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• pp.25-34
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• 2000

This paper describes design of a 250-Mbps 10-channel optical receiver array for parallel optical interconnection with the general-purpose CMOS technology The optical receiver is one of the most important building blocks to determine performance of the parallel optical interconnection system. The chip in CMOS technology makes it possible to implement the cost-effective system also. Each data channel consists of analog front-end including the integrated photo-detector and amplifier chain, digital block with D-FF and off-chip driver. In addition, the chip includes PLL (Phase-Lock Loop) for synchronous data recovery. The chip was fabricated in a 0.65-${\mu}{\textrm}{m}$ 2-poly, 2-metal CMOS technology. Power dissipation of each channel is 330㎽ for $\pm$2.5V supply.

• Journal of Sensor Science and Technology
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• v.5 no.6
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• pp.25-34
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• 1996

In this paper, we have designed signal conditioning circuitry for piezoresistive pressure sensor. Signal conditioning circuitry consists of voltage reference circuit for sensor driving voltage and instrument amplifier for sensor signal amplification. Signal conditioning circuitry is simulated using HSPICE in a single poly double metal $1.5\;{\mu}m$ BiCMOS technology. Simulation results of band-gap reference circuit showed that temperature coefficient of $21\;ppm/^{\circ}C$ at the temperature range of $0\;{\sim}\;70^{\circ}C$ and PSRR of 80 dB. Simulation results of BiCMOS amplifier showed that dc voltage gain, offset voltage, CMRR, CMR and PSRR are outperformed to CMOS and Bipolar, but power dissipation and noise voltage were more improved in CMOS than BiCMOS and Bipolar. Designed signal conditioning circuitry showed high input impedance, low offset and good CMRR, therefore, it is possible to apply sensor and instrument signal conditioning circuitry.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1460-1462
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• 1994

BiCMOS is the newly developed technology that integrates both CMOS and bipolar structures on the same integrated circuit. Improved performance can be obtained from combining the advantages of high density and low power in CMOS with the speed and current capibility advantages by bipolar. However, the major drawbacks to BiCMOS are high cost, long fabrication time and difficulty of merging CMOS with bipolar without degrading of device Performance because CMOS and bipolar share same process step. In this paper, N-Well CMOS oriented BiCMOS process and optimization of device performance are studied when N-Well links CMOS with bipolar process step by 2D process and 3D Device simulation. From the simulation, Constriction of linking process step has been understood and provided to give the method of choosing BiCMOS for various analog design request.

• Proceedings of the IEEK Conference
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• 2000.11c
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• pp.5-8
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• 2000

Voltage mode chaotic neuron has been designed in integrated circuit and fabricated by using 0.8$\mu\textrm{m}$ single poly CMOS technology. The fabricated CMOS chaotic neuron consist of chaotic signal generator and sigmoid output function. This paper presents an analysis of the chaotic behavior in the voltage mode CMOS chaotic neuron. From empirical equations of the chaotic neuron, the dynamical responses such as time series, bifurcation, and average firing rate are calculated. And, results of experiments in the single chaotic neuron and chaotic neural networks by two neurons are shown and compared with the simulated results.

• Proceedings of the KIEE Conference
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• 2002.11c
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• pp.253-256
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• 2002

A programmable CMOS negative resistor has been designed and fabricated in a 0.5um double poly double metal technology. The proposed CMOS negative resistor consists of a positive feedback OTA and a bump circuit with Gaussian-like I-V curve. Measurements of the fabricated chip confirm that the proposed CMOS resistor shows various negative resistance according to control voltage.