• JSTS:Journal of Semiconductor Technology and Science
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• 제12권4호
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• pp.405-410
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• 2012

This paper presents an inductorless 8-Gb/s adaptive passive equalizer with low-power consumption and small chip area. The equalizer has a tunable RC filter which provides high-frequency gain boosting and a limiting amplifier that restores the signal level from the filter output. It also includes a feedback loop which automatically adjusts the filter gain for the optimal frequency response. The equalizer fabricated in $0.18-{\mu}m$ CMOS technology can successfully equalize 8-Gb/s data transmitted through up to 50-cm FR4 PCB channels. It consumes 6.75 mW from 1.8-V supply voltage and occupies $0.021mm^2$ of chip area.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권3호
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• pp.326-332
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• 2017

A switched VCO-based UWB transmitter for 3-5 GHz is implemented using $0.18{\mu}m$ CMOS technology. Using RF switch and timing control of DPGs, the uniform RF power and low power consumption are possible regardless of carrier frequency. And gate control of RF switch enables the undesired side lobe rejection sufficiently. The measured pulse width is tunable from 0.5 to 2 ns. The measured energy efficiency per pulse is 4.08% and the power consumption is 0.6 mW at 10 Mbps without the buffer amplifier.

• International Journal of Aeronautical and Space Sciences
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• 제13권2호
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• pp.260-265
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• 2012

Satellite devices for fine attitude control of the Science & Technology Satellite-2 (STSAT-2). Based on the mission requirements of STSAT-2, the conventional analog-type sun sensors were found to be inadequate, motivating the development of a compact, fast and fine digital sun sensor (FDSS). The FDSS uses a CMOS image sensor and has an accuracy of less than 0.03degrees, an update rate of 5Hz and a weight of less than 800g. A pinhole-type aperture is substituted for the optical lens to minimize its weight. The target process speed is obtained by utilizing the Field Programmable Gate Array (FPGA), which acquires images from the CMOS sensor, and stores and processes the image data. The sensor accuracy is maintained by a rigorous centroid algorithm. This paper describes the FDSS designs, realizations, tests and calibration results.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.237-240
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• 2002

In this W, a NiSi technology suitable for sub-100nm CMOS sevice is proposed. It seems that capping layer has little effect on the sheet resistance and junction leakage current when there is no thermal treatment. However, there happened agglomeration and drastic increase of Junction leakage current without capping layer. In other word, capping layer especially TiN capping layer is highly effective in suppressing thermal effect. It is shown that the sheet resistance of 0.12${\mu}{\textrm}{m}$ linewidth and shallow p+/n junction with NiSi were stable up to 700 t /30 minute thermal treatment.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권3호
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• pp.148-152
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• 2009

Recent CMOS technology scaling has seriously eroded the bit-line noise immunity of register files due to the consequent increase in active bit-line leakage currents. To restore its noise immunity while maintaining performance, we propose and evaluate a $256{\times}40$-bit register file incorporating dual-$V_t$ bit-lines with a boosted gate overdrive voltage in 65 nm bulk CMOS technology. Simulation results show that the proposed bootsrapping scheme lowers leakage current by a factor of 450 without its performance penalty.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권4호
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• pp.277-282
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• 2008

A fully integrated inductorless CMOS impulse radio ultra-wideband (IR-UWB) receiver is implemented using $0.18\;{\mu}m$ CMOS technology for 3-5 GHz application. The UWB receiver adopts the non-coherent architecture, which removes the complexity of RF architecture and reduces power consumption. The receiver consists of inductorless differential three stage LNA, envelope detector, variable gain amplifier (VGA), and comparator. The measured sensitivity is -70 dBm in the condition of 5 Mbps and BER of $10^{-3}$. The receiver chip size is only $1.8\;mm\;{\times}\;0.9\;mm$. The consumed current is 15 mA with 1.8 V supply.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권6호
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• pp.817-824
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• 2016

A simultaneous bidirectional transceiver over a single wire has been developed in a 65 nm CMOS technology for a command and control bus. The echo signals of the simultaneous bidirectional link are cancelled by controlling the decision level of receiver comparators without power-hungry operational amplifier (op-amp) based circuits. With the clock information embedded in the rising edges of the signals sent from the source side to the sink side, the data is recovered by an open-loop digital circuit with 20 times blind oversampling. The data rate of the simultaneous bidirectional transceiver in each direction is 75 Mbps and therefore the overall signaling bandwidth is 150 Mbps. The measured energy efficiency of the transceiver is 56.7 pJ/b and the bit-error-rate (BER) is less than $10^{-12}$ with $2^7-1$ pseudo-random binary sequence (PRBS) pattern for both signaling directions.

• ETRI Journal
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• 제35권2호
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• pp.226-233
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• 2013

This paper presents a two-stage power-efficient class-AB operational transconductance amplifier (OTA) based on an adaptive biasing circuit suited to low-power dissipation and low-voltage operation. The OTA shows significant improvements in driving capability and power dissipation owing to the novel adaptive biasing circuit. The OTA dissipates only $0.4{\mu}W$ from a supply voltage of ${\pm}0.6V$ and exhibits excellent high driving, which results in a slew rate improvement of more than 250 times that of the conventional class-AB amplifier. The design is fabricated using $0.18-{\mu}m$ CMOS technology.

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권3호
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• pp.168-172
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• 2005

In this paper, we present a new adaptive biasing scheme for CMOS op-amps. The designed circuit has been used in an Operational Transconductance Amplifier (OTA) with ${\pm}1$ V power supply, and it has improved the positive and negative slew rates from 2.92 V/msec to 1242 V/msec and from 1.56 V/msec to 133 V/msec respectively, while maintaining all the small-signal performance parameter values the same as that without adaptive biasing (as expected), however, there was a marginal decrease of the dynamic range. The most useful features of the proposed circuit are that it uses a very low number of components (thus not creating severe area penalty) and requires only 25 nW of extra stand-by power.

• 전자통신동향분석
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• 제33권6호
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• pp.1-11
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• 2018

Several industrial applications such as space exploration, aerospace, automotive, the downhole oil and gas industry, and geothermal power plants require specific electronic systems under extremely high temperatures. For the majority of such applications, silicon-based technologies (bulk silicon, silicon-on-insulator) are limited by their maximum operating temperature. Silicon carbide (SiC) has been recognized as one of the prime candidates for providing the desired semiconductor in extremely high-temperature applications. In addition, it has become particularly interesting owing to a Si-compatible process technology for dedicated devices and integrated circuits. This paper briefly introduces a variety of SiC-based integrated circuits for use under extremely high temperatures and covers the technology trend of SiC CMOS devices and processes including the useful implementation of SiC ICs.