• Journal of the Optical Society of Korea
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• v.20 no.2
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• pp.291-299
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• 2016

We have investigated the ultimate limits of nonuniform grating couplers (NGCs) for optimized fiber coupling to silicon waveguides, compared to uniform grating couplers (UGCs). Simple grating coupler schemes, which can be fabricated in etching steps of the conventional complementary metal-oxide semiconductor (CMOS) process on silicon-on-insulator (SOI) wafers without forming any additional overlay structure, have been simulated numerically and demonstrated experimentally. Optimum values of the grating period, fill factor, and groove number for ultimate coupling efficiency of the NGCs are determined from finite-difference time-domain (FDTD) simulation, and confirmed with experimentally demonstrated devices by comparison to those for the UGCs. Our simulated results indicate that maximum coupling efficiency of NGCs is possible when the minimum pattern size is below 50 nm, but the experimental value for the maximum coupling efficiency is limited by the attainable fabrication tolerance in a practical device process.

• Biotechnology and Bioprocess Engineering:BBE
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• v.8 no.4
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• pp.252-256
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• 2003

In this paper we describe the status of a silicon-based microelectrode for neural recording and an advanced neural interface. We have developed a silicon neural probe, using a combination of plasma and wet etching techniques. This process enables the probe thickness to be controlled precisely. To enhance the CMOS compatibility in the fabrication process, we investigated the feasibility of the site material of the doped polycrystalline silicon with small grains of around 50 nm in size. This silicon electrode demonstrated a favorable performance with respect to impedance spectra, surface topography and acute neural recording. These results showed that the silicon neural probe can be used as an advanced microelectrode for neurological applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.11a
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• pp.210-215
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• 1994

In the CMOS device, Counter doping is needed to adjust threshold voltage because of the difference between n-MOSFET and p-MOSFET well doping concentration when n+ polysilicon gate is used. Therefore buried channel is formed in the p-channel MOSFET degrading properties. So well doping concentration and doping condition should be considered in fabrication process and device design. Here we are to extract the initial process condition using simulation and fabricate p-MOSFET device and then compare the subthreshold characteristics of simulated and fabricated device.

• Progress in Superconductivity and Cryogenics
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• v.20 no.4
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• pp.20-25
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• 2018

Niobium nitride (NbN) superconducting thin films with the thickness of 100 and 400 nm have been deposited on the surfaces of silicon oxide/silicon substrates using a sputtering method. Their superconducting properties have been evaluated in terms of the transition temperature, critical magnetic field, and critical current density. In addition, the NbN films were patterned in a line with a width of $10{\mu}m$ by a reactive ion etching (RIE) process for their characterization. This study proves the applicability of the standard complementary metal-oxide-semiconductor (CMOS) process in the fabrication of superconducting thin films without considerable degradation of superconducting properties.

• Korean Chemical Engineering Research
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• v.47 no.2
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• pp.141-149
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• 2009

The Cu thin film material and process, which have been already used for metallization of CMOS(Complementary Metal Oxide Semiconductor), has been highlighted as the Cu metallization is introduced to the metallization process for giga - level memory devices. The recent progresses in the development of key elements in electrochemical processes like surface pretreatment or electrolyte composition are summarized in the paper, because the semiconductor metallization by electrochemical processes such as electrodeposition and electroless deposition controls the thickness of Cu film in a few nm scales. The technologies in electrodeposition and electroless deposition are described in the viewpoint of process compatibility between copper electrodeposition and damascene process, because a Cu metal line is fabricated from the Cu thin film. Silver metallization, which may be expected to be the next generation metallization material due to its lowest resistivity, is also introduced with its electrochemical fabrication methods.

• Journal of the Korean Society of Radiology
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• v.5 no.5
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• pp.283-287
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• 2011

In this study, fine $Gd_2O_2S$:Tb powder was synthesized by using a low temperature solution-combustion method for a high-resolution digital x-ray imaging detector. From the fabricated phosphor power, the fine scintillator films was fabricated by particle sedimentation method and was investigated the luminescent property. From the experimental results of relative light output as a function of terbium concentration, the highest luminescent efficiency has at 5 wt% Tb concentration, and luminescent intensity decreased rapidly according to quenching effect about higher Tb concentration. Also, the relative light output of $270{\mu}m$-$Gd_2O_2S$:Tb film has 2945 pC/$cm^2$/mR. And light intensity was saturated at higher film thickness. Finally, to evaluate an image acquisition performance of fabricated phosphor, images were obtained by using commercial CMOS sensor and measured the MTF, NPS, and DQE. DQE(0 lp/mm) of fine phosphor film has 37%. But, DQE improvement of fine phosphor film is possible by resolving problem of film fabrication process and has a significant potential in the application of digital radiation imaging system later.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.3
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• pp.108-115
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• 1990

This paper describes the design and fabrication of a processing element that will be used as a component in the construction of a two dimensional systolic for FFT. The chip performs data shuffling and radix-2 decimation-in-time (DIT) butterfly arithmetic. It consists of a data routing unit, internal control logic and HBA unit which computes butterfly arithmetic. The 6.5K transistors processing element designed with standard cells has been fabricated with a 2u'm double metal CMOS process, and evaluated by wafer probing measurements. The measured characteristics show that a HBA can be computed in 0.5 usec with a 20MHz clok, and it is estimated that the FFT of length 1024 can be transformed in 11.2 usec.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.1
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• pp.105-111
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• 2013

We have developed an analog associative memory implemented with an analog array which has linear writing and erasing characteristics. The associative memory adopts a winner-take-all strategy. The operation for reading in the memory is executed with an absolute differencing circuit and a winner-take-all (WTA) circuit suitable for a nearest-match function of a content-addressable memory. We also present a system architecture that enables highly-paralleled fast writing and quick readout as well as high integration density. A multiple memory cell configuration is also presented for achieving higher integration density, quick readout, and fast writing. The system technology presented here is ideal for a real time recognition system. We simulate the function of the mechanism by menas of Hspice with $1.2{\mu}$ double poly CMOS parameters of MOSIS fabrication process.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.5
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• pp.367-373
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• 2001

A programmable A/D converter is designed with 8 N and P channel MOSFETs, respectively. In order to observe linear programmability of the EEPROM device during programming mode, a cell is developed with a 1.2 ${\mu}{\textrm}{m}$ double poly CMOS fabrication process in MOSIS. It is observed that the high resolution, of say 10m Volt, is valid in the range 1.25volts to 2volts. The experimental result is used for simulating the programmable 8 bit A/D converter with Hspice. The A/D converter is demonstrated to consume low power, 37㎽ by utilizing a programming operation. In addition, the converter is attained at the conversion frequency of 333 MHz.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.5
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• pp.639-642
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• 2013

In this paper, proposed NED(nuclear event detectors) for detection of a transient radiation. Nuclear event detector was blocked of power temporary for defence of critical damage at a electric device when a induced transient radiation. Conventional NED consist of BJT, resistors and capacitors. The NED supply voltage of 5V and MCM(Multi Chip Module) structures. The proposed NED were designed for low supply voltage using 0.18um CMOS process. The response time of proposed NED was 34.8ns. In addition, pulse radiation experiments using a electron beam accelerator, the output signal has occurred.