• 전자공학회논문지S
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• 제35S권9호
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• pp.19-27
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• 1998

본 연구에서는 E-GSM 단말기용 RF Transceiver 칩의 송신부에 대한 회로설계 및 시뮬레이션, 공정 및 제작, 평가를 수행하였다. AMS社의 0.8${\mu}m$ BiCMOS 공정으로 제작된 RF-IC 칩은 $10 {\times} 10mm$ 크기의 80 pin TQFP로 제작되었으며, 3.3V에서 동작하고 양호한 RF 특성을 보였다. 본 논문에서는 IF/RF 상향변조 주파수 혼합기, IF/RF polyphase, 전치증폭기 등을 포함하는 송신부의 개발 결과를 서술하고자 한다. 송산단의 측정결과 E-GSM RF 송신단 주파수인 880~915MHz에서 양호하게 동작하며, 소비전류는 71mA이고 총출력은 8.2dBm으로 측정되었다.

• 한국전자파학회논문지
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• 제27권10호
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• pp.877-882
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• 2016

본 논문에서는 LC 공진회로를 이용한 2 단자 능동 인덕터를 제안한다. 제안된 회로는 기존 자이레이터 구조의 1 단자 능동 인덕터들을 캐스코드 형태로 결합하였으며, 두 자이레이터 사이에 LC 공진회로를 추가시켰다. LC 공진회로는 능동 인덕터를 구성하는 트랜지스터의 기생 성분들을 상쇄시킴으로써 넓은 대역에서 높은 Q-지수를 제공한다. 제안된 회로는 삼성전자 65 nm 공정을 이용하여 시뮬레이션과 제작을 수행하였으며, 1~6 GHz 대역에서 2 nH의 일정한 인덕턴스와 40 이상의 높은 Q-지수를 가진다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권3호
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• pp.232-238
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• 2008

In this paper, a wideband power efficient 2.2 GHz - 4.9 GHz Medium Power Amplifier (MPA), has been designed and fabricated using $0.8{\mu}m$ SiGe BiCMOS process technology. Passive elements such as parallel-branch spiral inductor, metal-insulator-metal (MIM) capacitor and three types of resistors are all integrated in this process. This MPA is a two stage amplifier with all matching components and bias circuits integrated on-chip. A P1dB of 17.7 dBm has been measured with a power gain of 8.7 dB at 3.4 GHz with a total current consumption of 30 mA from a 3 V supply voltage at $25^{\circ}C$. The measured 3 dB bandwidth is 2.7 GHz and the maximum Power Added Efficiency (PAE) is 41 %, which are very good results for a fully integrated Medium PA. The fabricated circuit occupies a die area of $1.7mm{\times}0.8mm$.

• Journal of electromagnetic engineering and science
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• 제9권1호
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• pp.25-31
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• 2009

This paper describes CMOS VCO circuit design procedures and techniques for multi-band/multi-standard RF transceivers. The proposed techniques enable a 4 GHz CMOS VCO to satisfy all requirements for Quad-band GSMIEDGE and WCDMA standards by achieving a good trade-off among important specifications, phase noise, power consumption, modulation performance, and chip area efficiency. To meet the very stringent GSM T/Rx phase noise and wide frequency range specifications, the VCO utilizes bond-wire inductors with high-quality factor, an 8-bit coarse tune capbank for low VCO gain(30$\sim$50 MHz/V) and an on-chip $2^{nd}$ harmonic noise filter. The proposed VCO is implemented in $0.13{\mu}m$ CMOS technology. The measured tuning range is about 34 %(3.17 to 4.49 GHz). The VCO exhibits a phase noise of -123 dBc/Hz at 400 kHz offset and -145 dBc/Hz at 3 MHz offset from a 900 MHz carrier after LO chain. The calculated figure of merit(FOM) is -183.5 dBc/Hz at 3 MHz offset. This fully integrated VCO occupies $0.45{\times}0.9\;mm^2$.

• ETRI Journal
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• 제30권1호
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• pp.33-46
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• 2008

This paper presents the experimental results of a low-power low-cost RF transceiver for the 915 MHz band IEEE 802.15.4b standard. Low power and low cost are achieved by optimizing the transceiver architecture and circuit design techniques. The proposed transceiver shares the analog baseband section for both receive and transmit modes to reduce the silicon area. The RF transceiver consumes 11.2 mA in receive mode and 22.5 mA in transmit mode under a supply voltage of 1.8 V, in which 5 mA of quadrature voltage controlled oscillator is included. The proposed transceiver is implemented in a 0.18 ${\mu}m$ CMOS process and occupies 10 $mm^2$ of silicon area.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.89-93
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• 2002

In the present paper we suggested a parallel-branch structure of aluminum spiral inductor for the use of RF integrated circuit at 1∼3 GHz. The inductor was implemented on P-type silicon wafer (5∼15 Ω-cm) under the standard CMOS process and it showed a improved quality(Q) factor by more than 10% with no degradation of inductance. The effect of the structure modification on the Q factor and the inductance was scrutinized comparing with those of the conventional spiral inductors.

• 한국전자통신학회논문지
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• 제7권4호
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• pp.715-720
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• 2012

본 연구는 1V 미만의 전원 전압에서 저 위상잡음 동작에 적합한 혼성 평형 전압제어 발진기 회로를 제안한다. 제안한 회로의 개별 반 회로에서는 바렉터 통합형 궤환 커패시터를 사용한다. 바렉터 통합형 궤환 커패시터의 사용으로 인해 발진기 탱크회로내의 부성저항이 더욱 증가되며 이는 1V 미만 전원전압에서도 발진기의 안정된 발진시동을 보장한다. 또한, 본 연구에서는 이러한 부성저항의 증가 현상을 이론적으로 해석한다. $0.18{\mu}m$ RF CMOS 기술을 사용한 시뮬레이션 결과는 발진 주파수 4.87GHz의 1MHz 오프셋에서 0.6 V에서 0.9 V 사이의 전원 전압에 걸쳐 -122.4 dBc/Hz에서 -125,5 dBc/Hz까지의 위상잡음을 나타냄을 보여준다.

• ETRI Journal
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• 제26권3호
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• pp.229-240
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• 2004

This paper reports on our development of a dual-mode transceiver for a CMOS high-rate Bluetooth system-onchip solution. The transceiver includes most of the radio building blocks such as an active complex filter, a Gaussian frequency shift keying (GFSK) demodulator, a variable gain amplifier (VGA), a dc offset cancellation circuit, a quadrature local oscillator (LO) generator, and an RF front-end. It is designed for both the normal-rate Bluetooth with an instantaneous bit rate of 1 Mb/s and the high-rate Bluetooth of up to 12 Mb/s. The receiver employs a dualconversion combined with a baseband dual-path architecture for resolving many problems such as flicker noise, dc offset, and power consumption of the dual-mode system. The transceiver requires none of the external image-rejection and intermediate frequency (IF) channel filters by using an LO of 1.6 GHz and the fifth order onchip filters. The chip is fabricated on a $6.5-mm^{2}$ die using a standard $0.25-{\mu}m$ CMOS technology. Experimental results show an in-band image-rejection ratio of 40 dB, an IIP3 of -5 dBm, and a sensitivity of -77 dBm for the Bluetooth mode when the losses from the external components are compensated. It consumes 42 mA in receive ${\pi}/4-diffrential$ quadrature phase-shift keying $({\pi}/4-DQPSK)$ mode of 8 Mb/s, 35 mA in receive GFSK mode of 1 Mb/s, and 32 mA in transmit mode from a 2.5-V supply. These results indicate that the architecture and circuits are adaptable to the implementation of a low-cost, multi-mode, high-speed wireless personal area network.

• Journal of Electrical Engineering and Technology
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• 제13권6호
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• pp.2441-2446
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• 2018

This paper presents a radio frequency-to-direct current (RF-to-DC) converter for special RF power harvesting application at 915 MHz. The major featured components of the proposed RF-to-DC converter is the combination of a cross-coupled rectifier and an active diode: first, the cross-coupled rectifier boosts the input voltage to desired level, and an active diode blocks the reverse current, respectively. A prototype was implemented using $0.18{\mu}m$ CMOS technology, and the performance was proven from the fact that the targeted RF harvesting system's full-operation with higher power efficiency; even if the system's input power gets lower (e.g., from nominal 0 to min. -12 dBm), the proposed RF-to-DC converter constantly provides 1.47 V, which is exactly the voltage level to drive follow up system components like DC-to-DC converter and so on. And, maximum power conversion efficiency is 82 % calculated from the 0 dBm input power, 2.3 mA load current.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권2호
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• pp.143-149
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• 2008

A novel compact model for a five-port transformer balun is proposed for the efficient circuit design of hybrid balun. Compared to the conventional model, the proposed model provides much faster computation time and more reasonable values for the extracted parameters. The hybrid balun, realized in $0.18\;{\mu}m$ CMOS, achieves 2.8 dB higher gain and 1.9 dB lower noise figure than its passive counterpart only at a current consumption of 0.67 mA from 1.2 V supply. By employing the hybrid balun, a differential zero-IF receiver is designed in $0.18\;{\mu}m$ CMOS for IEEE 802.15.4 ZigBee applications. It is composed of a differential cascode LNA, passive mixers, and active RC filters. Comparative investigations on the three receiver designs, each employing the hybrid balun, a simple transformer balun, and an ideal balun, clearly demonstrate the advantages of the hybrid balun in fully differential CMOS RF receivers. The simulated results of the receiver with the hybrid balun show 33 dB of conversion gain, 4.2 dB of noise figure with 20 kHz of 1/f noise corner frequency, and -17.5 dBm of IIP3 at a current consumption of 5 mA from 1.8 V supply.