• Journal of Sensor Science and Technology
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• v.29 no.2
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• pp.82-88
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• 2020

In this paper, we propose a complementary metal-oxide semiconductor (CMOS) binary image sensor with a gate/body-tied (GBT) p-channel metal-oxide-semiconductor field-effect transistor (PMOSFET)-type photodetector using a double-tail comparator for high-speed and low-power operations. The GBT photodetector is based on a PMOSFET tied with a floating gate (n+ polysilicon) and a body that amplifies the photocurrent generated by incident light. A double-tail comparator compares an input signal with a reference voltage and returns the output signal as either 0 or 1. The signal processing speed and power consumption of a double-tail comparator are superior over those of conventional comparator. Further, the use of a double-sampling circuit reduces the standard deviation of the output voltages. Therefore, the proposed CMOS binary image sensor using a double-tail comparator might have advantages, such as low power consumption and high signal processing speed. The proposed CMOS binary image sensor is designed and simulated using the standard 0.18 ㎛ CMOS process.

• The KIPS Transactions:PartA
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• v.15A no.3
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• pp.135-140
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• 2008

This paper describes a high-speed CMOS demultiplexer using redundant multi-valued logic (RMVL). The proposed circuit receives serial binary data and is converted to parallel redundant multi-valued data using RMVL. The converted data are reconverted to parallel binary data. By the redundant multi-valued data conversion, the RMVL makes it possible to achieve higher operating speeds than that of a conventional binary logic. The implemented demultiplexer consists of eight integrators. Each integrator is composed of an accumulator, a window comparator, a decoder and a D flip flop. The demultiplexer is designed with TSMC $0.18{\mu}m$ standard CMOS process. The validity and effectiveness are verified through the HSPICE simulation. The demultiplexer is achieved the maximum data rate of 20 Gb/s and the average power consumption of 95.85 mW.

• Journal of Sensor Science and Technology
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• v.18 no.6
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• pp.475-484
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• 2009

In this paper, an analysis of the complementary CMOS active pixel and readout circuit is carried out. Complementary pixel structure which is different from conventional 3TR APS structure consists of photo diode, reset PMOS, several NMOSs and PMOSs sets for complementary signals. Proposed CMOS image sensors pixel has been fabricated using 0.5 standard CMOS process. Measured results show that the output signal range is from 0.8 V to 3.8 V. This output signal range increased 125 % compared to conventional 3TR pixel in the condition of 5 V power supply.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.2
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• pp.235-245
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• 2014

This paper presents an envelope tracking power amplifier using a standard CMOS process for the 3GPP long-term evolution transmitters. An efficiency of the CMOS power amplifier for the modulated signals can be improved using a highly efficient and wideband CMOS bias modulator. The CMOS PA is based on a two-stage differential common-source structure for high gain and large voltage swing. The bias modulator is based on a hybrid buck converter which consists of a linear stage and a switching stage. The dynamic load condition according to the envelope signal level is taken into account for the bias modulator design. By applying the bias modulator to the power amplifier, an overall efficiency of 41.7 % was achieved at an output power of 24 dBm using the 16-QAM uplink LTE signal. It is 5.3 % points higher than that of the power amplifier alone at the same output power and linearity.

• Journal of IKEEE
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• v.8 no.1 s.14
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• pp.47-53
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• 2004

We present the design of ternary flip-flop which is based on ternary logic so as to process ternary data. These flip-flops are composed with ternary voltage mode NMAX, NMIN, INVERTER gates. These logic gate circuits are designed using CMOS and obtained the characteristics of a lower voltage, lower power consumption as compared to other gates. These circuits have been simulated with the electrical parameters of a standard 0.35um CMOS technology and 3.3Volts supply voltage. The architecture of proposed ternary flip-flop is highly modular and well suited for VLSI implementation, only using ternary gates.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.6
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• pp.1-8
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• 1998

In this paper, we designed a low power 8bit ELM adder with static CMOS and hybrid logic styles on a chip. The designed 8bit ELM adder with both logic styles was fabricated in a 0.8$\mu\textrm{m}$ single-poly double-metal, LG CMOS process and tested. Hybrid logic style consists of CCPL(Combinative Complementary Pass-transistor Logic), Wang's XOR gate and static CMOS for critical path which determines the speed of ELM adder. As a result of chip test, the ELM adder with hybrid logic style is superior to the one with static CMOS by 9.29% in power consumption, 14.9% in delay time and 22.8% in PDP(Power Delay Product) at 5.0V supply voltage, respectively.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.2
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• pp.140-144
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• 2004

The selectable dual band LNA usually uses common source transistor pair each input of which is selectively driven at a different frequency in a series resonant form. This paper analyzes the degradation in noise figures of the MOSFET common source pair with series resonance when it is driven concurrently at both inputs with different frequencies as a concurrent dual band LNA. Results of analysis will be compared with the measured noise figures of CMOS LNA with double inputs fabricated in 0.18 $\mu\textrm{m}$ CMOS process. Additionally, analyzing the contributions of FET channel noise and source noise from the LNA operating in the other band, this paper proposes optimum matching topology which minimizes the added noises for concurrent operation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.9
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• pp.729-734
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• 2000

Recently, Very Large Scale Integrated (VLSI) circuit & deep-submicron bulk Complementary Metal Oxide Semiconductor(CMOS) devices require gate electrode materials such as metal-silicide, Titanium-silicide for gate oxides. Many previous authors have researched the improvement sub-micron gate oxide quality. However, few have reported on the electrical quality and reliability on the ultra thin gate oxide. In this paper, at first, I recommand a novel shallow trench isolation structure to suppress the corner metal-oxide semiconductor field-effect transistor(MOSFET) inherent to shallow trench isolation for sub 0.1${\mu}{\textrm}{m}$ gate oxide. Different from using normal LOCOS technology deep-submicron CMOS devices using novel Shallow Trench Isolation(STI) technology have a unique"inverse narrow-channel effects"-when the channel width of the devices is scaled down, their threshold voltage is shrunk instead of increased as for the contribution of the channel edge current to the total channel current as the channel width is reduced. Secondly, Titanium silicide process clarified that fluorine contamination caused by the gate sidewall etching inhibits the silicidation reaction and accelerates agglomeration. To overcome these problems, a novel Two-step Deposited silicide(TDS) process has been developed. The key point of this process is the deposition and subsequent removal of titanium before silicidation. Based on the research, It is found that novel STI structure by the SEM, in addition to thermally stable silicide process was achieved. We also obtained the decrease threshold voltage value of the channel edge. resulting in the better improvement of the narrow channel effect. low sheet resistance and stress, and high threshold voltage. Besides, sheet resistance and stress value, rms(root mean square) by AFM were observed. On the electrical characteristics, low leakage current and trap density at the Si/SiO$_2$were confirmed by the high threshold voltage sub 0.1${\mu}{\textrm}{m}$ gate oxide.

• Journal of Information Display
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• v.5 no.1
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• pp.28-33
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• 2004

A high voltage NMOSFET is proposed to drive top emission organic light emitting device (OLED) used in the organic electroluminescent (EL) display on the single crystal silicon substrate. The high voltage NMOSFET can be fabricated by utilizing a simple layout technique with a standard CMOS logic process. It is clearly shown that the maximum supply voltage ($V_{DD}$) required for the pixel-driving transistor could reach 45 V through analytic and experimental methods. The high voltage NMOSFET was fabricated by using a standard 1.5 ${\mu}m$, 5 V CMOS logic process. From the measurements, we confirmed that the high voltage NMOSFET could sustain the excellent saturation characteristic up to 50 V without breakdown phenomena.

• Transactions of the Society of Information Storage Systems
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• v.2 no.2
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• pp.96-99
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• 2006

In this research, a wafer-level transfer method of cantilever away on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride ($Si_3N_4$) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric $Si_3N_4$ cantilevers. In this process, we did not use a SOI wafer but a conventional p-type wafer for the fabrication of the thermo-piezoelectric $Si_3N_4$ cantilever arrays. Furthermore, we have developed a very simple transfer process, requiring only one step of cantilever transfer process for the integration of the CMOS wafer and cantilevers. Using this process, we have fabricated a single thermo-piezoelectric $Si_3N_4$ cantilever, and recorded 65nm data bits on a PMMA film and confirmed a charge signal at 5nm of cantilever deflection. And we have successfully applied this method to transfer 34 by 34 thermo-piezoelectric $Si_3N_4$ cantilever arrays on a CMOS wafer. We obtained reading signals from one of the cantilevers.