• Title/Summary/Keyword: CMOS Power Amplifier

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A Gate-Leakage Insensitive 0.7-V 233-nW ECG Amplifier using Non-Feedback PMOS Pseudo-Resistors in 0.13-μm N-well CMOS

  • Um, Ji-Yong;Sim, Jae-Yoon;Park, Hong-June
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.10 no.4
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    • pp.309-315
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    • 2010
  • A fully-differential low-voltage low-power electrocardiogram (ECG) amplifier by using the nonfeedback PMOS pseudo-resistors is proposed. It consists of two operational-transconductance amplifiers (OTA) in series (a preamplifier and a variable-gain amplifier). To make it insensitive to the gate leakage current of the OTA input transistor, the feedback pseudo-resistor of the conventional ECG amplifier is moved to input branch between the OP amp summing node and the DC reference voltage. Also, an OTA circuit with a Gm boosting block without reducing the output resistance (Ro) is proposed to maximize the OTA DC gain. The measurements shows the frequency bandwidth from 7 Hz to 480 Hz, the midband gain programmable from 48.7 dB to 59.5 dB, the total harmonic distortion (THD) less than 1.21% with a full voltage swing, and the power consumption of 233 nW in a 0.13 ${\mu}m$ CMOS process at the supply voltage of 0.7 V.

Design of Low Power CMOS LNA for 2.4 GHz ZigBee Applications (2.4 GHz ZigBee 응용을 위한 저전력 CMOS LNA 설계)

  • Cho In-Shin;Yeom Kee-Soo
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2006.05a
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    • pp.259-262
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    • 2006
  • This paper presents a design of low power CMOS LNA(Low Noise Amplifier) for 2.4 GHz ZigBee applications. The proposed circuit has been designed by using TSMC $0.18{\mu}m$ CMOS process and current-reused two-stage cascade topology. LNA design procedures and the simulation results using ADS(Advanced Design System) are presented in this paper. Simulation results shows that the LNA has a extremely low power dissipation of 1.38mW with a $V_{DD}$ of 1.0V. The LNA also has a maximum gain of 13.38dB, input return loss of -20.37dB, output return loss of -22.48dB and noise figure of 1.13dB.

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Design of a High-Speed LVDS I/O Interface Using Telescopic Amplifier (Telescopic 증폭기를 이용한 고속 LVDS I/O 인터페이스 설계)

  • Yoo, Kwan-Woo;Kim, Jeong-Beom
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.6 s.360
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    • pp.89-93
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    • 2007
  • This paper presents the design and the implementation of input/output (I/O) interface circuits for 2.5 Gbps operation in a 3.3V 0.35um CMOS technology. Due to the differential transmission technique and low voltage swing, LVDS(low-voltage differential signaling) has been widely used for high speed transmission with low power consumption. This interface circuit is fully compatible with the LVDS standard. The LVDS proposed in this paper utilizes a telescopic amplifier. This circuit is operated up to 2.3 Gbps. The circuit has a power consumption of 25. 5mW. This circuit is designed with Samsung $0.35{\mu}m$ CMOS process. The validity and effectiveness are verified through the HSPICE simulation.

A Design of Ultra Wide Band Switched-Gain Controlled Low Noise Amplifier Using 0.18 um CMOS (0.18 um CMOS 공정을 이용한 UWB 스위칭-이득제어 저잡음 증폭기 설계)

  • Jeong, Moo-Il;Lee, Chang-Seok
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.18 no.4 s.119
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    • pp.408-415
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    • 2007
  • A switched-gain controlled LNA is designed and implemented in 0.18 um CMOS technology for $3.1{\sim}4.8\;GHz$ UWB system. In high gain mode, measurement shows a power gain of 12.5 dB, an input IP3 of 0 dBm, while consuming only 8.13 mA of current. In low gain mode, measurement shows a power gain of -8.7 dB, an input IP3 of 9.1 dBm, while consuming only 0 mA of current.

Multichannel Transimpedance Amplifier Away in a $0.35\mu m$ CMOS Technology for Optical Communication Applications (광통신용 다채널 CMOS 차동 전치증폭기 어레이)

  • Heo Tae-Kwan;Cho Sang-Bock;Park Min Park
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.8 s.338
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    • pp.53-60
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    • 2005
  • Recently, sub-micron CMOS technologies have taken the place of III-V materials in a number of areas in integrated circuit designs, in particular even for the applications of gjgabit optical communication applications due to its low cost, high integration level, low power dissipation, and short turn-around time characteristics. In this paper, a four-channel transimpedance amplifier (TIA) array is realized in a standard 0.35mm CMOS technology Each channel includes an optical PIN photodiode and a TIA incorporating the fully differential regulated cascode (RGC) input configuration to achieve effectively enhanced transconductance(gm) and also exploiting the inductive peaking technique to extend the bandwidth. Post-layout simulations show that each TIA demonstrates the mid-band transimpedance gain of 59.3dBW, the -3dB bandwidth of 2.45GHz for 0.5pF photodiode capacitance, and the average noise current spectral density of 18.4pA/sqrt(Hz). The TIA array dissipates 92mw p in total from a single 3.3V supply The four-channel RGC TIA array is suitable for low-power, high-speed optical interconnect applications.

A D-Band Integrated Signal Source Based on SiGe 0.18μm BiCMOS Technology

  • Jung, Seungyoon;Yun, Jongwon;Rieh, Jae-Sung
    • Journal of electromagnetic engineering and science
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    • v.15 no.4
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    • pp.232-238
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    • 2015
  • This work describes the development of a D-band (110-170 GHz) signal source based on a SiGe BiCMOS technology. This D-band signal source consists of a V-band (50-75 GHz) oscillator, a V-band amplifier, and a D-band frequency doubler. The V-band signal from the oscillator is amplified for power boost, and then the frequency is doubled for D-band signal generation. The V-band oscillator showed an output power of 2.7 dBm at 67.3 GHz. Including a buffer stage, it had a DC power consumption of 145 mW. The peak gain of the V-band amplifier was 10.9 dB, which was achieved at 64.0 GHz and consumed 110 mW of DC power. The active frequency doubler consumed 60 mW for D-band signal generation. The integrated D-band source exhibited a measured output oscillation frequency of 133.2 GHz with an output power of 3.1 dBm and a phase noise of -107.2 dBc/Hz at 10 MHz offset. The chip size is $900{\times}1,890{\mu}m^2$, including RF and DC pads.

Ultra-small Form-Factor Helix on Pad-Type Stage-Bypass WCDMA Tx Power Amplifier Using a Chip-Stacking Technique and a Multilayer Substrate

  • Yoo, Chang-Hyun;Kim, Jung-Hyun
    • ETRI Journal
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    • v.32 no.2
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    • pp.327-329
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    • 2010
  • A fully integrated small form-factor HBT power amplifier (PA) was developed for UMTS Tx applications. For practical use, the PA was implemented with a well configured bottom dimension, and a CMOS control IC was added to enable/disable the HBT PA. By using helix-on-pad integrated passive device output matching, a chip-stacking technique in the assembly of the CMOS IC, and embedding of the bulky inductive lines in a multilayer substrate, the module size was greatly reduced to 2 mm ${\times}$ 2.2 mm. A stage-bypass technique was used to enhance the efficiency of the PA. The PA showed a low idle current of about 20 mA and a PAE of about15% at an output power of 16 dBm, while showing good linearity over the entire operating power range.

A 2.4-GHz Dual-Mode CMOS Power Amplifier with a Bypass Structure Using Three-Port Transformer to Improve Efficiency (3-포드 변압기를 이용한 바이패스 구조를 적용하여 효율이 개선된 이중 모드 2.4-GHz CMOS 전력 증폭기)

  • Jang, Joseph;Yoo, Jinho;Lee, Milim;Park, Changkun
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.23 no.6
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    • pp.719-725
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    • 2019
  • We propose a 2.4-GHz CMOS power amplifier (PA) with a bypass structure to improve the power-added efficiency (PAE) in the low-power region. The primary winding of the output transformer is split into two parts. One of the primary windings is connected to the output of the power stage for high-power mode. The other primary winding is connected to the output of the driver stage for low-power mode. Operation of the high power mode is similar to conventional PAs. On the other hand, the output power of the driver stage becomes the output power of the overall PA in the low power mode. Owing to a turning-off of the power stage, the power consumption is decreased in low-power mode. We designed the CMOS PA using a 180-nm RFCMOS process. The measured maximum output power is 27.78 dBm with a PAE of 20.5%. At a measured output power of 16 dBm, the PAE is improved from 2.5% to 12.7%.

1-Gb/s Readout Amplifier Array for Panoramic Scan LADAR Systems (파노라믹 스캔 라이다용 1-Gb/s 리드아웃 증폭기 어레이)

  • Kim, Dayeong;Park, Sung Min
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.65 no.3
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    • pp.452-456
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    • 2016
  • In this paper, a dual-channel readout amplifier array is realized in a standard $0.18{\mu}m$ CMOS technology for the applications of panoramic scan LADAR systems. Each channel consists of a PIN photodiode with 0.9 A/W responsivity and a 1.0 Gb/s readout amplifier(ROA). The proposed ROA shares the basic configuration of the previously reported feedforward TIA, except that it exploits a replica input to exclude a low pass filter(LPF), thus reducing chip area and improving integration level, and to efficiently reject common-mode noises. Measured results demonstrate that each channel achieves $70dB{\Omega}$ transimpedance gain, 829 MHz bandwidth, -22 dBm sensitivity for $10^{-9}BER$, -34 dB crosstalk between adjacent channels, and 45 mW power dissipation from a single 1.8 V supply.

Integratable Micro-Doherty Transmitter

  • Lee, Jae-Ho;Kim, Do-Hyung;Burm, Jin-Wook;Park, Jin-Soo
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.6 no.4
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    • pp.275-280
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    • 2006
  • We propose Doherty power amplifier structure which can be integrated in Silicon RF ICs. Doherty power amplifiers are widely used in RF transmitters, because of their high Power Added Efficiency (PAE) and good linearity. In this paper, it is proposed that a method to replace the quarter wavelength coupler with IQ up-conversion mixers to achieve 90 degree phase shift, which allows on-chip Doherty amplifier. This idea is implemented and manufactured in CMOS 5 GHz band direct-conversion RF transmitter. We measured a 3dB improvement output RF power and linearity.