• Journal of Welding and Joining
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• 제20권4호
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

• 대한치과기공학회지
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• 제39권4호
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• pp.243-251
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• 2017

Purpose: The purpose of this study was to investigate the effects of etching by monitoring the etched surfaces and the shear bonding strength of resin and porcelain with etched zirconia. Methods: The CAD/CAM was used to produce 24 zirconia blocks in groups of six. The zirconia specimen surfaces were sandblasted, and they were then divided into 12 specimens with surface etching and 12 specimens without etching for the control group. 12 specimens of composite resin were bonded using a curing light, and 12 specimens of porcelain underwent vita porcelain build-up sintering and the shear bonding strength was measured using a universal testing system. The SEM photographs were taken in order to observe any differences in the surfaces before and after etching, and they were magnified by a factor of 8 in order to observe fractured surface types. Results: The results of the shear bonding strength measurements are as follows: For the composite resin tests, between zirconia and resin, the shear bonding strength of the control group (NZR) without surface etching was 4.68 Mpa and the experimental group (EZC) with surface etching was 9.65 Mpa, which is significantly higher. The crystal structure of the zirconia was confirmed to be different in observations of the surfaces before and after etching. Conclusion : In comparing the shear bonding strength of zirconia and composite resin, the effects of etching were found to be significant. The effects of surface etching were also observed in fractured surfaces between zirconia and porcelain. This is expected to be applicable to various prosthetics as surface etching on zirconia is used in clinics.

• 대한치과교정학회지
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• 제20권2호
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• pp.283-291
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• 1990

The purpose of this study was to measure and compare tensile and shear strength for 4 types of new direct-bonding brackets and same brackets after recycling and to evaluate the change of bracket slot width after recycling. Four types of new direct-bond brackets were bonded to recently extracted human premolar teeth and the tensile and shear strength was measured by Universal Testing Machine. The brackets were recycled by chemical process and the tensile and shear test was repeated. To evaluate the change of the bracket slot width, slot width was measured by the Topcon Universal Measuring Microscope before and after recycling. Following results were obtained: 1. There was no satistically significant difference between the tensile and shear strength of recycled brackets and those of new brackets. 2. In both new and recycled brackets, the tensile and shear strength of perforated base bracket was lower than those of photoetched, foilmesh and contou-lok mesh base brackets. (P<0.01) 3. There was no statistically significant difference in bonding strengths of control group bonded only once and two times. 4. There was no statistically significant difference in the change of the bracket slow width after recycling process. 5. Of the failure, the combination type (58%) in the tensile strength and the tooth adhesive interface (65%) in the shear strength was the most common type.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2016년도 추계 학술논문 발표대회
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• pp.81-82
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• 2016

The present study aims to derive optimal interface treatment conditions for emulating a monolithic construction. The joints in this construction are formed through the bonding shear evaluation method during the placement of ultra-high-performance concrete (UHPC) and normal strength concrete (NSC). The evaluation items include push-off tests for homogeneous UHPC + UHPC and heterogeneous NSC + UHPC. The experimental samples comprised a monolithic placement as the baseline, two levels for the separated placement according to the compression strength of concrete, and five levels for the interface treatment. The increase in the number of grooves and their cross-sectional areas only slightly influenced the bonding shear performance. The optimal interface treatment method for the homogeneous UHPC + UHPC construction grooves was at least 30mm. The heterogeneous NSC + UHPC construction should utilize waterjet roughening to expose the aggregate for the increased roughness.

• 대한치과보철학회지
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• 제45권6호
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• pp.805-814
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• 2007

Statement of problem. Composite resin-veneered metal restorations can be used as an alternative to porcelain-fused-metal restorations. But, because of the relatively low bond strength of veneering composite to metal framework, various surface treatment methods have been introduced to improve the bond strength. Purpose. The object of this study was to compare the shear bond strength of different combinations of each of the two bonding systems and each of the two composite veneering resins to cp-Ti/Co-Cr alloy. Material and methods. Two resin bonding systems (metal conditioner containing MEPS monomer, tribochemical silicoating system) and two composite resins (Gradia, Sinfony) were tested on cp-Ti and Co-Cr alloy. Then, according to manufacturers' instructions, resin bonding systems and composite resins were applied. All test specimens were divided into four groups for each alloy; I) sandblast + Metal Primer II + Gradia (MG), II) sandblast + Metal Primer II + Sinfony (MS), III) Rocatec + Gradia (RG), IV) Rocatec + Sinfony (RS). The shear bond strength was determined using a universal testing machine and all data were statistically analyzed with Mann-Whitney test and Kruskal-Wallis test at the significance level of 0.05. Results. The mean (standard deviations) of shear bond strength according to the combinations of two bonding systems and two composite resins to cp-Ti arranged from 16.44 MPa to 17.07 MPa and the shear bond strength to Co-Cr alloy ranged from 16.26 MPa to 17.70 MPa. The result shows that the difference were not statistically significant. Conclusion. The shear bond strengths of composite resins to both cast cp-Ti and Co-Cr alloy were not significantly different between the metal conditioner and the tribochemical silicoating system. And no differences in bond strength were found between cp-Ti and Co-Cr alloy.

• Advances in materials Research
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• 제1권2호
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• pp.147-160
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• 2012

In the present study, diffusion bonding was carried out between AZ31B magnesium and AA2024 aluminium in the temperature range of $405^{\circ}C$ to $475^{\circ}C$ for 15 min to 85 min and 5MPa to 20 MPa uniaxial loads was applied. Interface quality of the joints was assessed by microhardness and shear testing. Also, the bonding interfaces were analyzed by means of optical microscopy, scanning electron microscopy, energy dispersive spectrometer and XRD. The maximum bonding and shear strength was obtained at $440^{\circ}C$, 12 MPa and 70 min. The maximum hardness values were obtained from the area next to the interface in magnesium side of the joint. The hardness values were found to decrease with increasing distance from the interface in magnesium side while it remained constant in aluminium side. It was seen that the diffusion transition zone near the interface consists of various phases of $MgAl_2O_4$, $Mg_2SiO_4$ and $Al_2SiO_5$.

• 대한치과보철학회지
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• 제25권1호
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• pp.317-325
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• 1987

A study on the shear bonding strength between dental alloy and porcelain according to various kidns of sputtered metallic thin films was established by Ingtron universal testing machine, and the change of the elemental weight % at the surface of dental alloy was studied by E.D.S. The kind of metallic thin films were Al, Ni, In, Cr. Ti and Sn with $0.3{\mu}m$ thickness. The dental alloys were Verabond made by Aalba Dent. Co. and Degudent H manufactured by Degussa Co. The control groups were Verabond and Degudent H. The obtained results were as follows; 1. The shear bonding strength of Al plated sample was the strongest of all. 2. The shear bonding strength of Ni plated sample was stronger than that of Degudent H, Sn plated samples. 3. The shear bonding strength of Verabond was weaker than that of Al, Ni, In, Cr, plated samples. 4. After degassing, it is more weight % of Ni at the alloy surface of the Ni sputtered specimen than the Sn sputtered sample.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.55-60
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• 2020

최근 참단 반도체 패키징 기술은 고성능 SIP(system in packaging) 구조로 발전해 가고 있고, 이를 실현시키기 위해서 구리 대 구리 접합은 가장 핵심적인 기술로 대두되고 있다. 구리 대 구리 접합 기술은 아직 구리의 산화 특성과 고온 및 고압력 공정 조건, 등 해결해야 할 문제점들이 남아 있다. 본 연구에서는 아르곤과 질소를 이용한 2단계 플라즈마 공정을 이용한 저온 구리 접합 공정의 접합 계면 품질을 정량적 접합 강도 측정을 통하여 확인하였다. 2단계 플라즈마 공정은 구리 표면에 구리 질화막을 형성하여 저온 구리 접합을 가능하게 한다. 구리 접합 후 접합 강도 측정은 4점 굽힘 시험법과 전단 시험법으로 수행하였으며, 평균 접합 전단 강도는 30.40 MPa로 우수한 접합 강도를 보였다.

• Journal of Welding and Joining
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• 제30권6호
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• pp.62-67
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• 2012

In this study, the bonding strengths of adhesively bonded joints are experimentally investigated. A series of lap-shear tests are conducted using single lap type adhesive joints. In order to analyse the joint fabrication factors that affected the bonding strength, the parametric tests are conducted with various thickness of adhesive, surface roughness and fillet of adhesive. In addition, for the comparative study with the welded joint, lap-shear tests using specimens with 2 welded sides and 4 welded sides are also carried out. The quantitative results of the strength analysis are summarized, and some proposals are made on setting up testing standards for adhesively bonded joints.

• Archives of Metallurgy and Materials
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• 제64권2호
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• pp.507-512
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• 2019

Ag and Cu powders were mechanically alloyed using high-energy planetary milling to evaluate the sinter-bonding characteristics of a die-attach paste containing particles of these two representative conductive metals mixed at atomic scale. This resulted in the formation of completely alloyed Ag-40Cu particles of 9.5 ㎛ average size after 3 h. The alloyed particles exhibited antioxidation properties during heating to 225℃ in air; the combination of high pressure and long bonding time at 225℃ enhanced the shear strength of the chip bonded using the particles. Consequently, the chips sinter-bonded at 225℃ and 10 MPa for 10 min exhibited a sufficient strength of 15.3 MPa. However, an increase in bonding temperature to 250℃ was detrimental to the strength, due to excessive oxidation of the alloyed particles. The mechanically alloyed phase in the particle began to decompose into nanoscale Ag and Cu phases above a bonding temperature of 225℃ during heating.