Effect of Plasma Treatment on the Bond Strength of Sn-Pb Eutectic Solder Flip Chip |
홍순민
((주)삼성전자 메카트로닉스센터 지능시스템연구소 마이크로접합 Lab)
강춘식 (서울대학교 재료공학부) 정재필 (서울시립대학교 재료공학과) |
1 |
Fluxless Wetting Properties of Top Surface Metallurgy in Different Pb-free Solders
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DOI ScienceOn |
2 |
Fluxless Soldering in Air and Nitrogen
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3 |
A Study on the Fluxless Soldering of Si-wafer/Glass Substrate Using Sn-3.5mass%Ag and Sn-37mass%Pb Solder
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4 |
Flux Free Flip Chip Attach Technology for BGA/CSP Packages
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5 |
Fluxless Bump Reflow Using Carboxylic Acid
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6 |
Oxidation of Solder Coating
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7 |
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8 |
Fluxless Wetting Properties of the UBM-coated Si-wafer to Pb-free Solders under Different Atmosphere
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DOI ScienceOn |
9 |
The Effects of Flux Materials on the Moisture Sensitivity and Reliability of Flip-Chip-on-Board Assemblies
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10 |
Plasma Treatment Process for Fluxless Reflow Soldering
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11 |
Fluxes and Flux Action
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12 |
Fluxless Wetting Properties of One side-Coated Under Bump Metallurgy and Top Surface Metallurgy
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13 |
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