• Journal of Welding and Joining
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• 제13권3호
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• pp.125-133
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• 1995

Rene80 superalloy was liquid phase diffusion bonded by using pure boron (B) as an insert material. As a basic study for the possibility of practical application of this bonding method, hardness and high temperature tensile strength of the bonded joint and metallurgical analysis were investigated. As experimental results, hardness of the bonded joint was homogenized after bonding and the tensile strength at 1144K was obtained to 90% of that of base metal. But there were some problems to be improved also, that means the joint was hardened after bonding due to increase of B content and elongation was much lower than that of base metal. Flat area and (Mo, Cr, W) boride, which should be harmful for bonding strength, were observed on the fractured surface of the tensile tested specimen.

• 소성∙가공
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• 제29권6호
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• pp.307-315
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• 2020

The cemented carbide and stainless steel were bonded using a hot-vacuum brazing method to analyze the bonding interface. Since it is suitable for the hot vacuum brazing, nickel metal was used as a binder among the main components of the cemented carbide, and a new cemented carbide material was developed by adjusting the alloy composition. The paste, which is one of the important factors affecting the hot vacuum brazing bonding, was able to improve brazing adhesion by mixing solder as Ni powder and a binder as an organic compound at an appropriate ratio. Division of the stainless steel yielded a dense brazing result. This study elucidated the interfacial characteristics of wear-resistant parts by bonding stainless steel and cemented carbide via hot vacuum brazing.

• Restorative Dentistry and Endodontics
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• 제28권3호
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• pp.209-221
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• 2003

The objectiveness of this study was to evaluate whether low-viscosity composite can bond effectively to dentin surface without bonding resin. The low-viscosity composites being 50wt% filler content were made by the inclusion of bonding resin of two self-etching systems(Cleafil SE Bond, Unifil Bond) varied with contents as 0, 10, 20, 30, 40, 50wt%. Exposed dentin surfaces of extracted 3rd molars are used. Dentin bond strengths were measured. The tests were carried out with a micro-shear device placed testing machine at a CHS of 1mm/min after a low-viscosity composite was filled into an iris cut from micro tygon tubing with internal diameter approximately 0.8mm and height of 1.0mm. 1 Flexural strength and modulus was increased with the addition of bonding resin. 2. Micro-shear bond strength to dentin was improved according to content of bonding resin irrespective of applying or not bonding resin in bonding procedure, and that of Clearfil SE Bond groups was higher than Unifil Bond. 3. There were no significant difference whether use of each bonding resin in bonding procedure for S-40, S-50, U-50(p＞0.05). 4. In SEM examination, resin was well infiltrated into dentin after primed with self-etching primer only for S-50 and U-50 in spite of the formation of thinner hybrid layer. Low viscosity composite including some functional monomer may be used as dentin bonding resin without an intermediary bonding agent. It makes a simplified bonding procedure and foresees the possibility of self-adhesive restorative material.

• 한국산학기술학회논문지
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• 제14권3호
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• pp.991-996
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• 2013

본 논문에서는 유리와 구리의 이종재료 접합을 위해 고유진동수를 60 [kHz]로 갖는 초음파 혼을 설계하고자 하였다. 초음파 혼의 입력단과 출력단의 단면비, 혼의 길이 등 관계식을 통해 설정하였으며 설계된 혼의 타당성 분석을 위해 모달해석을 수행하였다. 기초실험을 통하여 공정변수 및 반응변수를 설정하였으며, 초음파 공구 혼을 이용하여 이종재료 접합 강도 실험을 실시하였다. 또한 실험 결과를 통해 최적 공정조건을 도출하였다.

• 보존과학회지
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• 제26권4호
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• pp.371-376
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• 2010

평택 대추리 유적에서는 원삼국시대로 추정되는 대형옹이 발굴되었으며, 발굴 시 파손된 편들에서 접합한 흔적들을 선명히 관찰할 수 있었다. 그러므로 본 연구에서는 대형옹편들을 접합할 때 사용한 접착제의 성분을 실체현미경, FT-IR, py-GC/MS를 이용하여 알아보았으며, 같이 붙어 있는 직물의 종류를 투과광현미경으로 조사하였다. 실체현미경으로 단면을 관찰한 결과 옹편과 접합부위 사이에는 접착물질로 보이는 검은색 물질이 균일하게 도포되어 있으며, 아래에는 직물의 단면 모양을 지닌 선들을 확인할 수 있었다. 따라서 검은색 접착물질을 FT-IR과 py-GC/MS를 이용하여 성분을 분석한 결과 옻칠성분임을 알 수 있었다. 마지막으로 투과광현미경을 이용하여 옻칠과 함께 붙어있던 직물의 종류를 알아본 결과 대마(hemp)로 확인되었다. 지금까지 고대 유물을 수리할 때 사용한 재료들에 대하여 자료가 거의 없음으로 확인하기 어려웠으나 이번 연구를 통하여 원삼국시대 이전부터 대형옹를 접합할 때 옻칠을 사용하였음을 알 수 있었다. 그러므로 앞으로 고대로부터 사용되어온 접착제에 대하여 체계적인 성분조사가 이루어진다면 고대 유물에 사용되었던 접착.복원제를 연구하는데 큰 도움이 될 것으로 본다.

• 대한전자공학회논문지
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• 제13권6호
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• pp.1-6
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• 1976

탄성파 지연선의 진동자에서 전단과 지연매질사이의 접착제의 두께를 고려하여 변환손실을 계산하는 방법을 제안하며, 수치계산결과 접착제의 두께가 진동자 두께의 1/100정도 이하로 하여야 하며 전극의 두께가 진동자 두께의 1/10정도 될 때 중심주파수의 이동이 생진다. 접착제의 두께를 진동자와 거의 같거나 그 이상으로 하면 주파수 대역폭에서 현상이 점점 커지게 된다. In this paper, the methode of calculating conversion loss is proposed by considering the thickness of bonding medium between electrode and delay material in the vibrator of Elastic delay lines. As the result of computations using digital computer, it is shown that the thickness of bonding medium must be less than about 1/100 of the thickness of vibrator and when the thickness of electrode is about 1110 of vibrator, the center fnequency is shifted. When the thickness of bonding medium is equal to or more than the thickness of vibrator, the 리uctuations in frequency Bandwidth become larger and larger.

• Journal of Welding and Joining
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• 제22권1호
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• pp.77-82
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• 2004

The effect of bonding condition on tensile properties of joints diffusion bonded spheroidal graphite cast iron, FCD60 to Cr-Mo steel, SCM 440 was investigated. Diffusion bonding was performed with various temperatures, holding times, pressures and atmospheres. All tensile specimens were fractured at the bonding interface. The tensile strength and elongation was increased with increasing bonding temperature. Especially, tensile strength of joints bonded at 1123K was higher than that of a raw material, FCD60, and tensile strength of joints bonded at 1173K was equal to that of a raw material, SCM440, but elongation of all joints was lower than those of raw materials. There was little the effect of holding time on the tensile properties. In comparison with bonding atmosphere, the difference of tensile strength was not observed, but elongation of joint bonded at vacuum(6.7mPa and 67mPa) was higher than that of Ar gas. Higher the degee of vacuum, elongation increased. Tensile properties of diffusion bonds depended on microstructures of cast iron at the interface and void ratio. Microstructures of cast iron at interface changed with temperature, because decarburizing and interdiffusion at the interface occurs and transformation of austenite-1 ferrite + graphite occurs on the cooling process. The void ratio decreased with increasing temperature, especially, effected on the elongation.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.785-790
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• 2002

Distributions of residual stress in diffusion bonding of dissimilar materials intermetallics TiAl to steel 40Cr were simulated by FEM calculation. Results showed that destructive residual stresses presented in the minute area adjacent to bond-line of the base material with smaller coefficient of thermal expansion. Reducing bonding temperature and diminishing bonding time are in favor of the mollification of interface tresses.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.27-34
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• 2017

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.