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http://dx.doi.org/10.4313/JKEM.2011.24.12.949

A Study on the Characteristics and Error Ranges of Automotive Application Component's Mechanical Bonding Strength for the Its Reliability Evaluation  

Jeon, Yu-Jae (School of Mechanical Engineering, Chung-Ang University)
Kim, Do-Seok (School of Mechanical Engineering, Chung-Ang University)
Shin, Young-Eui (School of Mechanical Engineering, Chung-Ang University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.24, no.12, 2011 , pp. 949-954 More about this Journal
Abstract
In this study, the characteristics and error ranges of the mechanical bonding strength were analyzed according to before and after thermal shock test for various chips of automotive application component using Sn-3.0Ag-0.5Cu solder. In the after thermal shock test, the mechanical bonding strengths tend to decrease, meanwhile decreasing rates of mechanical strengths were less then 12% at specimen's bonding area below 3.5$mm^2$, and were from 17 to 21% at specimen's bonding area above 12 $mm^2$. On the other hand, Specimen's mean deviation rates were about 5% at specimen's bonding area more than 12 $mm^2$. Inversely, at specimen's bonding area is less then 3.5 $mm^2$, mean deviation rates were increased to about 8%. It means that the smaller device size is, the larger mean deviation rate. In addition, error ranges and deviation rates of the mechanical bonding strengths may differ slightly depending on their bonding area. Furthermore, process conditions as well as method of mechanical reliability evaluation should be established to reduce the error ranges of bonding strength.
Keywords
Thermal shock test; Mechanical bonding strength; Lead-free solder; Automotive application component; Error range; Reliability evaluation;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
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