1 |
Y. J. Jeon, S. I. Son, D. S. Kim, and Y. E. Shin, J. KIEEME, 23, 611 (2010).
|
2 |
Y. E. Shin and S. J Hwang, J. KIEEME, 16, 549 (2003).
|
3 |
W. B. Hampshire, The Search for Leadfree Solders (Soldering & Surface Mount Technology, MCB University Press, 1993) p. 49.
|
4 |
S. S. Ha, J. W. Kim, and S. B. Jung, Journal of Korean Welding Society, 24, 457 (2006).
|
5 |
J. S. Park, I. J. Cho, and Y. E. Shin, J. KIEEME, 22, 199 (2009).
|
6 |
JIS Z 3198-6, Translated and Published by Japanese Standards Association (2003).
|
7 |
JIS Z 3198-7, Translated and Published by Japanese Standards Association (2003).
|
8 |
M. Yunus, K. Srihari, J. M. Pitarresi, and A. Primavera, Microelectron. Reliab., 43, 2077 (2003).
DOI
|