• Proceedings of the KWS Conference
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• 2000.04a
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• pp.283-286
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• 2000

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• The Korean Journal of Health Service Management
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• v.14 no.2
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• pp.1-14
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• 2020

Objectives : The purpose of this study was to test fitness of the structured model of SNS activities for health information. Methods : A structured questionnaire were administered to 500 subjects. A structural equation model was applied to collected data. Results : The response rate was 73.9%. The respondents mostly used Facebook and KakaoStory. They spent 70 minutes per day and 21~30% of this usage was taken by health information. In the variances, those who has religion more actively exchanged information about diseases and medical institutions. The goodness-of-fit of the model was .81(GFI) and .90(CFI). The main path was bridging capital -> bonding capital -> credibility -> SNS activities for health information. The path from quality of sharing information to SNS activities was not significant. It could be explained by the restriction of digital literacy. Conclusions : SNS activities for health information were determined by credibility, currency and bonding social capital. Bridging social capital, indirectly, influenced SNS activities through bonding social capital. Thus building bonding social capital would be a critical success factor for SNS.

• Computers and Concrete
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• v.26 no.3
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• pp.257-273
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• 2020

Concrete bond strength with steel re-bars depends on multiple factors including concrete-steel interface and mechanical properties of concrete. However, the hydration development of cementitious paste, and in turn the mechanical properties of concrete, are negatively affected by cold weather. This study aimed at exploring the concrete-steel bonding behavior in concrete cast and cured under freezing temperatures. Three concrete mixtures were cast and cured at -10 and -20℃. The mixtures were protected using conventional insulation blankets and a hybrid system consisting of insulation blankets and phase change materials. The mixtures comprised General Use cement, fly ash (20%), nano-silica (6%) and calcium nitrate-nitrite as a cold weather admixture system. The mixtures were tested in terms of internal temperature, compressive, tensile strengths, and modulus of elasticity. In addition, the bond strength between concrete and steel re-bars were evaluated by a pull-out test, while the quality of the interface between concrete and steel was assessed by thermal and microscopy studies. In addition, the internal heat evolution and force-slip relationship were modeled based on energy conservation and stress-strain relationships, respectively using three-dimensional (3D) finite-element software. The results showed the reliability of the proposed models to accurately predict concrete heat evolution as well as bond strength relative to experimental data. The hybrid protection system and nano-modified concrete mixtures produced good quality concrete-steel interface with adequate bond strength, without need for heating operations before casting and during curing under freezing temperatures down to -20℃.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.31-38
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• 2015

In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.2 no.4
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• pp.295-301
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• 2002

In this paper, solenoid-type 3-D passives (inductors and transformers) have been designed, fabricated, and characterized by using electroplating techniques, wire bonding techniques, multi-layer thick photoresist, and low temperature processes which are compatible with semiconductor circuitry fabrication. Two different fabrication approaches are performed to develop the solenoid-type 3-D passives and relationship of performance characteristics and geometry is also deeply investigated such as windings, cross-sectional area of core, spacing between windings, and turn ratio. Fully integrated inductor has a quality factor of 31 at 6 GHz, an inductance of 2.7 nH, and a self resonant frequency of 15.8 GHz. Bonded wire inductor has a quality factor of 120, an inductance of 20 nH, and a self resonant frequency of 8 GHz. Integrated transformers with turn ratios of 1:1 and n:l have the minimum insertion loss of about 0.6 dB and the wide bandwidth of a few GHz.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1349-1354
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• 2008

In this study, we try to find the root cause of water condensing failures in a headlamp using chemical and mechanical analysis. Through the surface inspection by OM, SEM and CT, it was found that water infiltrate into the headlamp through hotmelt adhesive debonding part caused by adhesion force degradation and poor quality. IR spectra shows that adhesion force degradation are characterized by increase of some functional group(1742, 1710, 1649, 1016). Through the ESPI measurement, it is turned out that bonding structural change by thermal expansion and degradation of adhesive can be the cause of void generation. So it is recommended that cooling passage and the bonding part should be redesigned to give a guarantee of less thermal stress and high adhesion quality.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.1
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• pp.52-58
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• 2007

We propose a new contact detection algorithm for fine pitch wire bonding. Fast and stable contact detection of the z-axis in wire bonding is extremely important to maintain the quality of fine pitch gold wire bonding processes, which use a small pad less than $70{\mu}m$ in diameter. A small perturbation in the contact detection time causes a large difference in the size of the formed squashed ball. The new detection method is based on a statistical approach and designed for a discrete Kalman filter. It is faster and has smaller detection time variations than conventional detection methods. Experimental results are presented to demonstrate the advantages of the proposed algorithm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.47-51
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• 2000

A modified direct bonding technique employing a wet chemical deposition of $SiO_2$ film on a wafer surface to be bonded is proposed for the fabrication of Si-$SiO_2$-Si structures. Structural and electrical quality of the bonded wafers is studied. Satisfied insulating properties of interfacial $SiO_2$ layers are demonstrated. Elastic strain caused by surface morphology is investigated. The diminution of strain in the grooved structures is semi-quantitatively interpreted by a model considering the virtual defects distributed over the interfacial region.