• Journal of Welding and Joining
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• v.18 no.1
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• pp.70-76
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• 2000

A rolled steel for structural parts and lead bronze alloy were bonded each other by a new semi-solid diffusion bonding process to investigate the effect of the process parameters, for example bonding temperature and bonding time, on the interface characteristics, and bonding behavior. It can be possible that manufacture of the bonded steel/lead bronze which has a cylindrical shape with inserted the lead bronze alloy into the steel ring by the diffusion bonding process under the semi-solid condition of the lead bronze alloy without any pressure and flux. It has been know that the control of the amount of the liquid phase in semi-solid lead bronze alloy was very important to obtain soundness interface, since the shear strength of the bonded steel/lead bronze at 850℃ for 60 minutes under the condition of about 40% of the liquid phase in the lead bronze alloy shows maximum value, 210 MPa. The shear strength increases with an increase in bonding time and show maximum value, and then decreases.

• Journal of the Korean Ceramic Society
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• v.45 no.10
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• pp.600-604
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• 2008

Although titanium-ceramic systems have gained substantial interests in dental prosthetic field, bonding problem between porcelain and titanium has not been solved. Main obstacle in titanium-porcelain bonding is excessive oxidation of titanium during porcelain firing. The effects of several coating materials on the bonding strength of titanium-porcelain system were investigated in this study. RF sputtering and electroplating of platinum significantly increased the bonding strength of porcelain-titanium specimen. However, coatings of Ni-Au, Ir, and ceramics(zirconia and hydroxyapatite) did not showed a significant effect on bonding strength. Platinum might be a promising material for the protective layer of excessive oxidation of titanium during porcelain firing, resulting in increase in the bonding strength.

• Journal of Information Technology Applications and Management
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• v.29 no.4
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• pp.35-49
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• 2022

Knowledge sharing occurs through voluntary interactions between human actors. In this paper, from the perspective of social interaction, the effect of transactive memory capability and social capital (bridging social capital and bonding social capital) on knowledge sharing intention was analyzed, and tenure was demonstrated as a moderating factor that can strengthen their relationship. Therefore, the results of this study are summarized as follows. First, it was verified that the transactive memory capability had a significant positive effect on the knowledge sharing intention. Second, it was found that the bridging social capital and bonding social capital held by individuals had a significant positive effect on knowledge sharing intention. Social capital is understood to form an individual's voluntary motivation for knowledge sharing. Third, it was verified that the moderating effect of tenure suggested in this study was not significant. Based on the results of this study, implications and future research directions were presented.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.7
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• pp.92-98
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• 1996

parallel bonding wires separaated with a screeing bonding wire are proposed and characterized in order to redue mutual coupling and parasitics of high-speed and high-density device packaging. The mehtod of moments (MoM) with the incorporation of the ohmic loss has been used in a wide range of frequencies. From the calculated results, we have found that the screening bonding wire effectively reduces inductive and capacitive crostalk levels more than 3dB. the parasitic self inductance is also reduced more than 12% by the screening effect. Therefore, for a general VLSi package, the packaging density can be increased more than 30% using the screening bonding wire. This screeing bonding wire and the analysis can be effectively used to reduce crosstalk and increase packaging density of high density devices.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.2
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• pp.148-162
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• 1996

Bonding wires for high frequency device packaging have dominant parasitic inductances which limit the performance of semiconductor lasers. In this paper, the inductance sof bonding wires are claculated by the method of moments with incorporation of ohmic loss, and the wideband modulation characteristics are analyzed for ddifferent wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire is 7 GHz wider than that for 2mm-length bonding wire. We also observed th estatic inductance calculation results in dispersive deviation of the parasitic inductance and the modulation characteristics from the wideband moment methods calculations. The angled bonding wire has much less parasitic inductance and improves the modulation bandwidth more than 6 GHz. This calculation resutls an be widely used for designing and packaging of high-speed semiconductor device.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.549-554
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• 2016

Low melting metals are difficult to weld because it is vaporized. But epoxy resin make bonding possible using low melting material and dismissal materials. This study is to improve the bonding strength of epoxy and substrate by mechanical and electrochemical methods. In case of mechanical work, bonding strength is 17.6MPa and in case of pre-work, bonding strength is 15.3MPa. When anodizing and mechanical work is applied, bonding strength is 25.3Mpa is increased 165%. When anodizing is applied, bonding strength is 27.6Mpa.

• Advances in materials Research
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• v.8 no.1
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• pp.1-10
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• 2019

Roll bonding (RB) process of bi-metal laminates as a new noble method of bonding has been widely used in the production of bimetal laminates. In the present study, asymmetric roll bonding process as a new noble method has been presented to produce Al/Cu bimetallic laminates with the thickness reduction ratios 10%, 20% and 30% together with mismatch rolling diameter ($\frac{R_2}{R_1}$) ratio 1:1, 1:1.1 and 1:1.2. ABAQUS as a finite element simulation software was used to model the deformation of samples. The main attention in this study focuses on the bonding properties of Al/Cu samples. The effect of the $\frac{R_2}{R_1}$ ratios was investigated to improve the bond strength. During the simulation, for samples produced with $\frac{R_2}{R_1}=1:1.2$, the vertical plastic strain of samples was reach the maximum value with a high quality bond. Moreover, the peeling surface of samples after the peeling test was investigated by the scanning electron microscopy (SEM).

• Proceedings of the Korean Institute of Building Construction Conference
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• 2020.11a
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• pp.153-154
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• 2020

This study aims to find out the reason that tile adhesive(type III) for ceramic tile does not harden under some conditions especially high humidity even though long curing time. Bonding strength of adhesive between substrate and ceramic tile is evaluated depending on bonding conditions such as substrate kind(concrete, board), bonding material (tile adhesive, tile cement) and curing condition(humidity 50, 70%). Based on the results, this study aimed to establish the quality of tile adhesion strength under the relevant conditions.