Advances in materials Research

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Bonding evolution of bimetallic Al/Cu laminates fabricated by asymmetric roll bonding

  • Vini, Mohamad Heydari (Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University) ;
  • Daneshmand, Saeed (Department of Mechanical Engineering, Majlesi Branch, Islamic Azad University)
  • Received : 2018.07.19
  • Accepted : 2019.06.20
  • Published : 2019.03.25
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Abstract

Roll bonding (RB) process of bi-metal laminates as a new noble method of bonding has been widely used in the production of bimetal laminates. In the present study, asymmetric roll bonding process as a new noble method has been presented to produce Al/Cu bimetallic laminates with the thickness reduction ratios 10%, 20% and 30% together with mismatch rolling diameter ($\frac{R_2}{R_1}$) ratio 1:1, 1:1.1 and 1:1.2. ABAQUS as a finite element simulation software was used to model the deformation of samples. The main attention in this study focuses on the bonding properties of Al/Cu samples. The effect of the $\frac{R_2}{R_1}$ ratios was investigated to improve the bond strength. During the simulation, for samples produced with $\frac{R_2}{R_1}=1:1.2$, the vertical plastic strain of samples was reach the maximum value with a high quality bond. Moreover, the peeling surface of samples after the peeling test was investigated by the scanning electron microscopy (SEM).

Keywords

References

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