• Journal of Mechanical Science and Technology
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• v.17 no.2
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• pp.269-279
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• 2003

The anti-plane shear problem of bonded elastic materials containing a crack at an arbitrary angle to the graded interfacial zone is investigated in this paper The interfacial zone is modeled as a nonhomogeneous interlayer of finite thickness with the continuously varying shear modulus between the two dissimilar, homogeneous half-planes. Formulation of the crack problem is based upon the use of the Fourier integral transform method and the coordinate transformations of basic field variables. The resulting Cauchy-type singular integral equation is solved numerically to provide the values of mode 111 stress intensity factors. A comprehensive parametric study is then presented of the influence of crack obliquity on the stress intensity factors for different crack size and locations and for different material combinations, in conjunction with the material nonhomogeneity within the graded interfacial zone.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.10
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• pp.1890-1899
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• 1992

In bonded structures, there are V-notched cracks in dissimilar materials and the stress concentration of these V-notched cracks causes to occur interface cracks in dissimilar materials Therefore the strength evaluation of V-notched cracks in dissimliar materials seems to be important. The stress fields of a V-notched cracks is known as .sigma.$_{ij}$ .var. K $r_{p-1}$,where K is the stress intensity factor and p-1 is the stress singularity. When the distance, r, approaches to 0 at the stress fields of V-notched cracks, the stresses become infinites by two more stress singularities of p-1 and p-1 is no more -0.5. Stress singularities and stress intensity factors for V-notched cracks in dissimilar materials are treated and discussed. The Newton-Raphson method which is an efficient numerical method for solving a non-linear equation is used for solving stress sigularities. And stress intensity factors are solved by the collocation method using the Newton-Raphson and least squares method. The effects of stress intensity factors and stress singularities on stress fields of V-notched cracks in dissimilar materials are studied by using photoelasic isochromatic frings patterns obtained from computer graphics.s.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.2
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• pp.186-192
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• 2002

The fatigue crack propagation characteristics were investigated on dissimilar friction weld of two kind of heat-resisting steels (STR3 and STR35) commonly used in valve materials for vehicles. A small circular artificial defect was machined to induce fatigue crack at bonded line, heat affected zone and base metal of the weld on the surface of the specimens. From the results of the experiment, the fatigue limits of the materials STR3 and STR35 were obtained to be 429.0MPa and 409.4MPa respectably. The STR35 base metal and 1.0mm HAZ specimens showed 190% and 82% higher fatigue life than STR3 base metal. And the fatigue life of 1.0mm HAZ specimen was shown 99% on STR3 and 29% on STR35 higher than that of their base metal. But the fatigue life of weld interface specimen was shown 18% on STR3 and 72% on STR35 lower than that of their base metal because of the weld interface separation.

• Journal of the Korean Society for Railway
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• v.14 no.2
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• pp.94-99
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• 2011

In this study, the stress reduction effect was evaluated for GFRP/Mg single lap bonded joints according to six different adherend shapes. Six different types of the single lap joint specimen were modeled and assessed using geometrically nonlinear finite element analysis. Moreover, three dimensional effect of stress distribution for the different adherend shapes was investigated. From the analysis, the dissimilar single lap bonded joint with the normal tapering and without the spew fillet (model 2) showed the highest stress values. In contrast, the peel stress values of both the square ended adherends with the spew fillet (model 3) and the reverse tapered adherends with the spew fillet (model 5) were 65.8% and 65.5% lower than the reference model.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.1
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• pp.11-15
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• 2001

We present the design and strength evaluation of an anodically bonded pressurized cavity array, based on the energy release rate measured from the anodically bonded plates of two dissimilar materials. From a theoretical analysis, a simple fracture mechanics model of the pressurized cavity array has been developed. The energy release rate (ERR) of the bonded cavity with an infinite bonding length has been derived in terms of cavity pressure, cavity size, bonding length, plate size and material properties. The ERR with a finite bonding length has been evaluated from the finite element analysis performed for varying cavity and plate sizes. It is found that, for an inter-cavity bonding length greater than the half of the cavity length, the bonding strength of cavity array approaches to that of the infinite plate. For a shorter bonding length, however, the bonding strength of the cavity array is monotonically decreased with the ratio of the bonding length to the cavity length. The critical ERR of 6.21J/㎡ has been measured from anodically bonded silicon-glass plates. A set of critical pressure curves has been generated for varying cavity array sizes, and a design method of the pressurized cavity array has been developed for the failure-free wafer-level packaging of MEMS devices.

• Journal of the Korean Society for Heat Treatment
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• v.16 no.1
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• pp.2-9
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• 2003

The aluminum alloy which is light and has excellent thermal conductivity and iron base alloy that is remarkable heat-resistece and wear resistence properties were bonded together. The bond was created between a stationary and a rotating member by using the frictional heat generated between them while subjected to high normal forces on the interface of Al alloy and iron base alloy. The microstructure of the bonded interface of friction welding and the strength in the bonded interface formed under various bonding conditions were examined through TEM, SEM with EDX and triple bending test. In interface of bonding materials formed after various heat treatment, bonding strength was substantially different, resulting from formation of intermetallic compound or softening during annealing.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.7
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• pp.1055-1063
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• 2001

When the interfacial crack of isotropic/orthotropic bi-materials is propagated with constant velocity along the interface, stress and displacement components are derived in this research. The dynamic photoelastic experimental hybrid method for the bimaterial is introduced. It is assured that stress components and dynamic photoelastic hybrid developed in this research are valid. Separating method of stress components is introduced from only dynamic photoelastic fringe patterns. Crack propagating velocity of interfacial crack is 69∼71% of Rayleigh wave velocity of epoxy resin. The near-field stress components of bonded interface of bimaterial are similar with those of pure isotopic material and two dissimilar isotropic bimaterials under static or dynamic loading, but very near-field stress components of bonded interface of bimaterial are different from those.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.10
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• pp.2398-2406
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• 1993

Abdi's numerical method(ref.13) for representing a stress singularity by shifting the mid-side nodes of isoparametric elements is reviewed. A simple technique to obtain the optimal position of the mid-side nodes in quadratic isoparametric finite element is presented. From this technique we can directly obtain the position of the side-nodes adjacent to the crack tip. It is also observed that the present technique provides good accuracy for the expression of the opening displacement and the determination of the mid-side nodes for more wide range of material properties than that obtained by Abdicant the finite element method is applied to determine stress intensity factors for pressurized crack perpendicular to and terminating at the interface of two bonded dissimilar materials. A proper definition for stress intensity factors of a crack perpendicular to bimaterial interface is provided. It is based upon a near-tip displacement solutions on the crack surface for interface crack between two dissimilar materials. Numerical testing is carried out with the eight-node and six-node elements. The results obtained are compared with the previous solutions.

• Journal of the Korean Society for Heat Treatment
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• v.36 no.2
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• pp.61-68
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• 2023

Ti and Ti alloys are used in the automobile and aerospace industries due to their high specific strength and excellent corrosion resistance. However their application is limited due to poor formability at room temperature and high unit cost. In order to overcome these issues, dissimilarly jointed materials, such as cladding materials, are widely investigated to utilize them in each industrial field because of an enhanced plasticity and relatively low cost. Among various dissimilar bonding processes, the rolled cladding process is widely used in Ti alloys, but has a disadvantage of low bonding strength. Although this problem can be solved through post-heat treatment, the mechanical properties at the bonded interface are deteriorated due to residual stress generated during post-heat treatment. Therefore, in this study, the microstructure change and residual stress trends at the interfaces of Ti/Al cladding materials were studied with increasing post-heat treatment temperature. As a result, compared to the as-rolled specimens, no difference in microstructure was observed in the specimens after postheat treatment at 300, 400, and 500℃. However, a new intermetallic compound layer was formed between Ti and Al when post-heat treatment was performed at a temperature of 600℃ or higher. Then, it was also confirmed that compressive residual stress with a large deviation was formed in Ti due to the difference in thermal expansion coefficient and modulus of elasticity between Ti Grade II and Al 1050.