• International Journal of Aeronautical and Space Sciences
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• 제11권3호
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• pp.227-233
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• 2010

In this study, a genetic algorithm was utilized to optimize the stacking sequence of a composite plate subjected to a high velocity impact. The aim is to minimize the maximum backplane displacement of the plate. In the finite element model, we idealized the impactor using solid elements and modeled the composite plate by shell elements to reduce the analysis time. Various tests were carried out to investigate the effect of parameters in the genetic algorithm such as the type of variables, population size, number of discrete variables, and mutation probability.

• 한국정보과학회논문지:시스템및이론
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• 제28권1_2호
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• pp.11-19
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• 2001

근래에 들어, 백플레인 버스를 기반으로 하는 멀티프로세서 시스템의 프로세서간 통신에도 TCP/IP와 같은 표준 네트워크 프로토콜을 이용하여 표준 MAC 계층을 구현하는 것이 일반적이다. 본 논문은 이러한 MAC 에뮬레이션 기반 버스 네트워크상에서 내장형 실시간 은용을 지원하기 위한 최악 응답 시간 분석법을 제시한다. 본 논문의 분석법은 구체적으로 MAC 에뮬레이션 방법의 하나인 ANSI BusNet 프로토콜을 대상으로 진행된다. 각 실시간 태스크를 주기, CPU 시간, 종료시한, 메시지 패킷 개수로 모델링하고 스케쥴 가능성, 즉 주어진 종료 시한 내에 작업을 완료할 수 있는지의 여부를 검사하는 수식을 유도한다. 이를 위해 물리적인 버스 특성을 고려한 버스 전송 모델을 제시하고, 버스 중재 방식과 버스 하드웨어의 캐슁 지원 여부에 따른 스케쥴 가능성을 분석한다. 또한 본 논문에서는 실험을 통해 블록 전송이 실시간 통신 성능에 미치는 영향을 살펴본다. 비록 본 논문의 분석법이 BusNet에 기반하여 개발되었지만, BusNet이 대부분의 백플레인 하드웨어가 지원하는 기본적인 기능만을 가정하고 있으므로, 본 논문의 분석법은 다른 종류의 백플레인 네트워크 프로토콜에도 쉽게 적용될 수 있다.

• 정보처리학회논문지C
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• 제8C권4호
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• pp.415-420
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• 2001

VLSI 기술의 빠른 발전으로 디지털 시스템의 동작주파수가 높아짐에 따라 고속 통신시스템 의 하드웨어 설계 시 신호 무결성을 고려한 설계가 필수적이다. 디지털시스템에서의 잡음원 은 전송선에서의 전원장치, 접지 바운스, 실장 재료 등에 관련된다. 본 연구에서는 고속네트 워크/통신시스템의 기가비트 연결 설계기술에 필요한 요소들을 언급하였고, 실제 설계 신호 불연속에 영향을 미치는 커넥터의 누화 및 전송선의 표피 효과, 유전손실 등을 고려한 백플 레인보드를 시뮬레이션 하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(II)
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• pp.1111-1115
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• 1987

This paper describes of VME-BSA which is a tool for the development, mainternance and repair. In micro/mini computer system using VMEbus as a backplane bus, VME-BSA has some good facilities such as acquiring, storing and analyzering the information (address, data, etc.) on VMEbus according to the various condition which is set by users, and therefore it is easy to isolate and find many complete errors on bus.

• 한국고분자학회:학술대회논문집
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• 한국고분자학회 2006년도 IUPAC International Symposium on Advanced Polymers for Emerging Technologies
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• pp.17-18
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• 2006

Flat Panel Displays (FPDs) have made a revolution in the display industry. TFT-LCD (Thin Film Transistor Liquid Crystal Display) has been the main player of FPD for last two decades. As the industry continuously develops the technology for better performance with lower cost is constantly demanded where several post LCD technologies are being developed. One of the prime candidates of post LCD technology is AMOLED (Active Matrix Organic Light Emitting Diode) that is considered to be an ideal FPD due to its extraordinary display performance and potentially low cost display structure. This technology has been accepted to small size display applications, such as cellular phone, PDA and PMP, etc. In this paper it is discussed that how this technology can be extended to large size display applications, such as TV. The technical issues and solutions of TFT backplane and color patterning of OLED materials are discussed and proposed

• Journal of Information Display
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• 제6권3호
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• pp.12-17
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• 2005

The need for low cost, flexible, thin film transistor (TFT) display backplanes has focused attention on new processing techniques and materials. We report the development of TFT backplane technology based entirely on jet-printing, using a combination of additive and subtractive processing, to print active materials or etch masks. The technique eliminates the use of photolithography and has the potential to reduce the array manufacturing cost. The printing technique is demonstrated with both amorphous silicon and polymer semiconductor TFT arrays, and we show results of small prototype displays.

• Journal of Information Display
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• 제11권4호
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• pp.160-164
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• 2010

Organic light-emitting devices (OLEDs) have shown superior characteristics and are expected to dominate the nextgeneration flat-panel displays. Active-matrix organic light-emitting diode (AMOLED) displays, however, have stringent demands on the performance of the backplane. In this paper, the development of thin-film transistors (TFTs) based on indium gallium zinc oxide (IGZO) on both Gen 1 and 6 glasses, and their decent characteristics, which meet the AMOLED requirements, are shown. Further, several display prototypes (e.g., 2.4" AMOLED, 2.4" transparent AMOLED, and 32" AMLCD) using IGZO TFTs are demonstrated to confirm that they can indeed be strong candidates for the next-generation TFT technology not only of AMOLED but also of AMLCD (active-matrix liquid crystal display).

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.171-174
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• 2008

We present results demonstrating that low power consumption phosphorescent AMOLED displays can be fabricated on ultra-thin ($25{\mu}m$) stainless steel substrates, combining an amorphous silicon backplane with a top emission phosphorescent OLED frontplane. We will present preliminary results of flexibility testing on these displays.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.197-200
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• 2008

We propose a novel n-type a-Si:H TFT pixel circuit which is proper to AMOLED display for the large size and high resolution. Proposed pixel circuit will be suit to panel for the high resolution because of different threshold sampling method. Driving method of proposed pixel circuit is very simple like an AMLCD. Our simulation indicates that the proposed pixel circuit can compensate the Vth shift and IR rising of power line so that provide better quality image.

• 전자공학회논문지S
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• 제34S권11호
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• pp.34-42
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• 1997

In this paper, we show an optimal structure of impedance control in high density layouts ina high multilayers PCB. The impedance control in a high multilayers FR-4 PCB is very portant isue because a dielectric layer's thickness is very thin. Especially, odd mode impedance control is more difficult than characteristic impedance control in high multilayers PCB. So, we show an optimal structure of odd mode impedance control in that dielectric thickness is about 0.1mm with limited state and discuss multilayers PCB's for swich circuti pack and backplane in developing algorith scale ATM witching system in next time.