• Journal of KSNVE
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• v.7 no.3
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• pp.511-519
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• 1997

For a number of years it has been known that flexural vibration in a beam and plate can be damped by the application of layer of damping (viscoelastic) material that is in turn constrained by a backing layer or foil. In this study, a quantitative analysis of damping of the sandwich beam has been performed by using impact test. The damping is characterized by the loss factor .etha. in which the damping is normalized by imaginary part of the complex bending stiffiness of the beam. Results show that the relative thickness of the sandwich beam gives more effect on the riatural-frequencies and loss factor than the variation of width does. It is also shown that the Ross-Kerwin-Ungar equation and impact test can be effectively used to identify the damping characteristic of the sandwich beam and viscoelastic material.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.4
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• pp.297-302
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• 2005

Chemical mechanical polishing(CMP) performances can be optimized by several process parameters such as equipment and consumables (pad, backing film and slurry). Pad properties are important in determining removal rate and planarization ability of a CMP process. It is investigated the performance of oxide CMP process using commercial silica slurry after the pad conditioning temperature was varied. Conditioning process with the high temperature made the slurry be unrestricted to flow and be hold, which made the removal rate of oxide film increase. The pad became softer and flexible as the conditioning temperature increases. Then the softer pad provided the better surface planarity of oxide film without defect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.39-40
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• 2006

AE sensor using lead-free ceramics should be developed for prohibiting environment protection. In this study, Langevin type AE sensor was manufactured as air backing structure. Here, the piezoelectic element was used as PZT(EC-65) and NKN, respectively. The resonant frequency of AE sensor using PZT was 143 kHz and the resonant frequency of AE sensor using NKN was 178 kHz. The waveform of AE sensor using NKN was responded more sensitively than that of AE sensor using PZT.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.3
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• pp.218-222
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• 2007

In this study, Acoustic emission(AE) sensors were fabricated using lead-free piezoelectric ceramics for prohibiting environmental pollution. Structure of AE sensors were designed as Langvin type air backing form. Here, the piezoelectic element was used as PZT(EC-65)(AE1) and NKN(AE2), respectively. The measured resonant frequency, the maximum sensitivity frequency and sensitivity of AE sensors were as follows ; 143 kHz, 29.4 kHz and 69.3 dB in AE1 and 179 kHz, 29.4 kHz and 66.3dB in AE2, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.465-470
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• 2003

The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.802-807
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• 2015

This paper describes the development of a piezoelectric level switch, which aims to effectively monitor the level status in high ambient temperatures. In order to adjust the impedance near the resonant frequency and temperature characteristics, the effect of the case and backing layer materials on its performance was analyzed using the finite element method (FEM). The suggested prototype new level switch has three heat-sink plates attached to SUS bar of 230 mm long, and case of PEEK which contains PZT sensing part. To illustrate the validity of this level switch, 10 samples are prepared and investigated the sensing performance through the high and low temperature ambient.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.8
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• pp.613-619
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• 1998

Ultrasonic probes of 400kHz, 1MHz were fabricated using PZT-5Z plates. Epoxy was used for backing layer materials onthe plates. Nondestructive Test was carried using these probes. Pulse lobe width of impulse response was reduced 15.4% compare 1MHz with 400kHz and 96.6% compare 3MHz with 400kHz. The attenuation in aluminum was 2.05[dB/m] at 400kHz, 4/91[dB/m] at 1MHz, 7.35[dB/m] at 3HMz. Hole detection error of the first hole was 22.4% at 1HMz, 9.% at 3HMz, The second hole 11.6% at 1HMz, 4.7% at 3HMz. In the result of experiment of the hole detection error and resolution, 3HMz probe was the best among them.

• Proceedings of the Acoustical Society of Korea Conference
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• autumn
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• pp.325-328
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• 2000

초음파 변환기의 정합을 위해서는 초음파 변환기의 등가회로 구성이 중요하다. 전통적인 등가회로의 경우 비교적 안정적인 등가회로를 예측하게 해 주지만 초음파변환기 구성에서 일어나는 초음파 변환기 외의 구성품 즉 Backing Material, Acoustic Window Material, Radiation Impedance 등에 의한 부가적인 효과를 모델링하는 데는 한계가 있다. 따라서 좀 더 일반적인 방법으로 초음파 변환기를 모델링하는 방법이 필요하다. 그런 방법의 하나로 주파수 영역 측정에 의한 초음파변환기 등가회로 추정법을 제안한다. 이 방법은 초음파 변환기 제작 시 많이 쓰는 임피던스 분석의 결과를 그대로 사용할 수 있고 또 그것이 없어도 일반 함수발생기와 오실로스코프만으로 측정할 수 있어서 랜덤함수를 발생시키고 이에 대한 출력을 저장해야 데이터를 얻을 수 있는 시간영역 추정법에 대해서 장점을 갖는다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.6
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• pp.449-457
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• 2011

Effect of pump combinations on the vacuum characteristics of vacuum system was simulated for optimum design of system. In this investigation, the feasibility of modelling mechanism for VacSimMulti simulator was proposed. Simulation results of various pumping combinations showed the possibilities and reliabilities of simulation for the performance of vacuum system in specific semiconductor processing. Simulation of roughing pump presented the expected pumping behaviors based on commercial specifications of employed pumps. Application of booster pump exhibited the high pumping efficiency for middle vacuum range. Combinations of optimum backing pump for diffusion and turbo vacuum system were obtained. And, the predictable characteristics of process application of both simulated systems were also acquired.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.267-270
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• 2008

Thermo-mechanical simulation of the friction stir butt welding process was performed for AA5083-H18 sheets, utilizing commercial FVM code, STAR-CCM+, which is based on Eulerian formulation. Temperature and strain rate histories along the material flow were calculated under the steady state condition and simulated temperature distributions (profiles and peak values) were compared with experiments for verification. It was found that by including proper thermal properties of the backing plate (anvil) the accuracy of the simulation results increased significantly.