• Journal of the Korean Society for Precision Engineering
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• v.26 no.5
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• pp.142-149
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• 2009

This paper proposes and demonstrates novel flexible contact force sensing devices for 3-dimensional force measurement. To realize the sensor, polyimide and polydimethylsiloxane are used as a substrate, which makes it flexible. Thin-film metal strain gauges, which are incorporated into the polymer, are used for measuring the three-dimensional contact forces. The force sensor characteristics are evaluated against normal and shear load. The fabricated force sensor can measure normal loads up to 4N. The sensor output signals are saturated against load over 4N. Shear loads can be detected by different voltage drops in strain gauges. The device has no fragile structures; therefore, it can be used as a ground reaction force sensor for balance control in humanoid robots. Four force sensors are assembled and placed in the four corners of the robot's sole. By increasing bump dimensions, the force sensor can measure load up to 20N. When loads are exerted on the sole, the ground reaction force can be measured by these four sensors. The measured forces can be used in the balance control of biped locomotion system.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Tribology and Lubricants
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• v.39 no.5
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• pp.203-211
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• 2023

This study experimentally investigates the effects of angular acceleration on the friction and wear performances of a gas foil thrust bearing (GFTB) using a typical GFTB with six pads. The outer radius of the bearing is 31.5 mm, the total bearing area is 2,041 mm² , and the bump foil and incline (ramp) height are both 500 ㎛. The newly developed GFTB test rig for measuring the friction torque and coefficient measures the axial load, drag torque, lift-off speed, and touch-down speed. The experiment is conducted for angular accelerations of 78.5, 314.2, and 328.3 rad/s² at axial loads of 5, 10, and 15 N, respectively. The test shows that the start-up friction coefficient increases with increasing axial load at the same angular acceleration, and the friction coefficient decreases with increasing angular acceleration under the same axial load. As the angular acceleration increases, the lift-off speed at the motor start-up increases, and the touch-down speed at the motor stop decreases. The wear distance of the GFTB for a single on/off cycle increases with increasing axial load at the same angular acceleration and decreases nonlinearly with increasing angular acceleration under the same axial load. The test results suggest that adjusting the rotational angular acceleration helps reduce bearing friction and wear.

• Journal of the Korean Vacuum Society
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• v.20 no.1
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• pp.22-29
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• 2011

An infrared thermographic imaging module of [$320{\times}256$] focal-plane array (FPA) based on [InAs/GaSb] strained-layer superlattice (SLS) was fabricated, and its images were demonstrated. The p-i-n device consisted of an active layer (i) of 300-period [13/7]-ML [InAs/GaSb]-SLS and a pair of p/n-electrodes of (60/115)-period [InAs:(Be/Si)/GaSb]-SLS. FTIR photoresponse spectra taken from a test device revealed that the peak wavelength (${\lambda}_p$) and the cutoff wavelength (${\lambda}_{co}$) were approximately $3.1/2.7{\mu}m$ and $3.8{\mu}m$, respectively, and it was confirmed that the device was operated up to a temperature of 180 K. The $30/24-{\mu}m$ design rule was applied to single pixel pitch/mesa, and a standard photolithography was introduced for [$320{\times}256$]-FPA fabrication. An FPA-ROIC thermographic module was accomplished by using a $18/10-{\mu}m$ In-bump/UBM process and a flip-chip bonding technique, and the thermographic image was demonstrated by utilizing a mid-infrared camera and an image processor.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.47-54
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• 2021

For the bonding of smaller PCB solder bumps of less than 100 microns, an experiment was performed to make up a tin plating solution and find plating conditions in order to produce a bump pattern through tin electroplating, replacing the previous PCB solder bumps process by microballs. After SR patterning, a Cu seed layer was formed, and then, through DFR patterning, a pattern in which Sn can be selectively plated only within the SR pattern was formed on the PCB substrate. The tin plating solution was made based on methanesulfonic acid, and hydroquinone was used as an antioxidant to prevent oxidation of divalent tin ions. Triton X-100 was used as a surfactant, and gelatin was used as a grain refiner. By measuring the electrochemical polarization curve, the characteristics of organic additives in Triton X-100 and gelatin were compared. It was confirmed that the addition of Triton X-100 suppressed hydrogen generation up to -1 V vs. NHE, whereas gelatin inhibited hydrogen generation up to -0.7 V vs. NHE. As the current density increased, there was a general tendency that the grain size became finer, and it was observed that it became finer when gelatin was added.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Journal of Korea Water Resources Association
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• v.47 no.12
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• pp.1177-1185
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• 2014

This study suggests a new hydrostatic pressure distribution corrected for nonuniform flow over a channel of large slope. For analyzing shallow-water flows over large slope accurately, it is developed a finite-volume model incorporating the pressure distribution to the shallow water equations. Traveling speed of the hydraulic jump downstream a parabolic bump in the drain case is quite reduced by the weakened bottom gradient source term in the model with the pressure correction. In simulating the dam-break flow over a triangular sill, it is identified that the model with pressure correction could capture the water surface by the digital imaging measurements more than the model without that. Due to the pressure correction decreasing the reflected flows on and increasing overflows over the sill, there are good agreements in the experiment and the simulation with that. Therefore, this model is expected to be applied to such practical problems as flows in the spillway of dam or run-up on the beach.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.25-31
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• 2010

In this study, we investigated the morphology and thermal stability of interfacial phases in joint between lead free solder(Sn-3.0Ag-0.5Cu) and electroless Ni-W-P under bump metallizations(UBM) with different tungsten contents as a function of thermal aging. Content of phosphorus of each deposits was fixed at 8 wt.%, and content of tungsten was variated each 0, 3, 6 and 9 wt.%. Specimens were prepared by reflowing at $255^{\circ}C$, aging range was $200^{\circ}C$ and up to 2 weeks. After reflow process, in the electroless Ni(W)-P/solder joint, the interfacial intermetallic compound(IMC) was showed both $(Cu,Ni)_6Sn_5$ and $(Ni,Cu)_3Sn_4$. UBM and generated IMC at the interface of lead free solder was proportionally increased with aging time. The thickness of IMC was increased because the generation rate of $Ni(W)_3P$ decreased with increasing contents of W.

• Journal of the Korean GEO-environmental Society
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• v.23 no.8
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• pp.17-22
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• 2022

To reduce the bump of bridge/earthwork transition area caused by the settlement of the soft ground during public use, the road agencies have been continuously overlay or repavement at those areas. In this study, the vehicle-mounted ground penetrating radar with 1GHz air-coupled antenna was used to estimate the settlement amount of those areas for nine bridges built in the soft ground. Results shows that it is possible to effectively measure the thickness of pavement up to a depth of 1 m on an asphalt road with ground penetrating radar technology that can inspect under the road surface. Distinctively deformation of the road surface, the variation in the thickness of the pavement measured at bridge/earth transition areas is equivalent to a minimum of 50 mm and a maximum of 600 mm, and there is a risk of cavity in the ground. The difference in the increased pavement thickness is 50~250 mm for each bridge connection, which may cause the differential settlement. In this study, by using the result of the ground penetration radar, a plan for improving drivability and maintenance of the settlement is suggested and applied to the field.