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Study on Thermal Stability of the Interface between Electroless Ni-W-P Deposits and BGA Lead-Free Solder (Sn-3.0Ag-0.5Cu)  

Shin, Dong-Hee (Department of the Advenced Materials Engineering, Korea Polytechnic University)
Cho, Jin-Ki (Department of the Advenced Materials Engineering, Korea Polytechnic University)
Kang, Seung-Goon (Division of Materials Science Engineering, Hanyang University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.1, 2010 , pp. 25-31 More about this Journal
Abstract
In this study, we investigated the morphology and thermal stability of interfacial phases in joint between lead free solder(Sn-3.0Ag-0.5Cu) and electroless Ni-W-P under bump metallizations(UBM) with different tungsten contents as a function of thermal aging. Content of phosphorus of each deposits was fixed at 8 wt.%, and content of tungsten was variated each 0, 3, 6 and 9 wt.%. Specimens were prepared by reflowing at $255^{\circ}C$, aging range was $200^{\circ}C$ and up to 2 weeks. After reflow process, in the electroless Ni(W)-P/solder joint, the interfacial intermetallic compound(IMC) was showed both $(Cu,Ni)_6Sn_5$ and $(Ni,Cu)_3Sn_4$. UBM and generated IMC at the interface of lead free solder was proportionally increased with aging time. The thickness of IMC was increased because the generation rate of $Ni(W)_3P$ decreased with increasing contents of W.
Keywords
Pb-free; Intermetallic compound; Ni-W-P; Ball grid array; Solder joint;
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