• 한국생산제조학회지
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• 제22권6호
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• pp.1003-1009
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• 2013

This paper presents a simple procedure to obtain the instantaneous cutting force constants needed to predict milling forces. Cutting force data measured in a series of slot milling tests were used to determine the cutting force constants at different feed rates. The values of the cutting force constants were determined directly at the tool rotation angle that maximized the uncut chip thickness. Then, the instantaneous cutting force constant was obtained as a function of the instantaneous uncut chip thickness. This approach can greatly enhance the accuracy of the mechanistic cutting force model for end milling. In addition, the influences of several cutting parameters on the cutting forces, such as the tool helix angle and axial depth of cut, were discussed.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 하계종합학술대회논문집
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• pp.487-490
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• 1998

During driving an automobile, drivers push the clutch and transmit gear by their feeling. At the automobile which have the manually operated gear box by using apart designed equipment, for get the semi-auto function, a lot of research to realize the system which have passive transmission and automotive transmission has developed. In this paper, basically using one chip .mu.-comcontrolled the clutch of automobile by means of LPF, F/V converter and TR driver circuit which is designed. In the past, it was controlled the motor by operating relay which is int eh output system to control the clutch. This system some noises is made by on and off the relay, lessen the motor speed and causes many error due to consume the large power on driving the motor. In this paper, to solve these problems the output TR is operated by using one chip .mu.-com decrease the electic power consumption and designed the actuator to control the clutch by measns of vacuum.

• 오토저널
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• 제14권6호
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• pp.105-112
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• 1992

The turning tests with sintered carbide tools have been conducted on typical high strength SSW2 railway wheel steel and its machinability were examined in terms of the cutting resistance, the roughness of turning surface, the chip disposal and others. Some results obtained in this paper are as follows: (1) The cutting resistance is not affected by the cutting speed (in this paper these were 23-78 m/min). (2) The roughness of finished surface is found to be largely dependent on cutting conditions and tool geometry. (3) There exists the explicit relates between the tool geometry cutting conditions (cutting speed, feedrate, and depth of cut) and independent variables(cutting resistance, surface roughness) are derived.

• Journal of Welding and Joining
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• 제33권3호
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• pp.32-39
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• 2015

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

• 오토저널
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• 제9권2호
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• pp.47-57
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• 1987

The objective of this study is to establish the comprehensive analytical relationship between acoustic emission and fundamental parameters of the orthogonal cutting process. The sources of acoustic emission in the orthogonal metal cutting process was identified as deformation in the shear zone and sliding friction at the chip-tool interface. The validity of this relationship is evaluated by a series of tests varing cutting speed and rake angle for A16063 tube. Strong dependence of the RMS voltage of acoustic emission on cutting speed and rake angle was observed. It was also found that the percentage contribution of AE energy at each zone for the total AE activity is constant in accordance with the change of cutting speed. The relationship between the RMS of acoustic emission and the fundamental cutting parameters was modified in order to be utilized independent of rake angle.

• Transactions on Electrical and Electronic Materials
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• 제11권4호
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• pp.178-181
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• 2010

An automotive IC voltage regulator which consists of one-chip based on a metal-oxide semiconductor field effect transistor (MOSFET) is investigated experimentally with three types of packaging. The closed type is filled with thermal silicone gel and covered with a plastic lid on the MOSFET. The half-closed type is covered with a plastic case but without thermal silicone gel on the MOSFET. Opened type is no lid without thermal silicone gel. In order to simulate the high temperature condition in engine bay, the operating circuit of the MOSFET is constructed and the surrounding temperature is maintained at $100^{\circ}C$. In the overshoot the maximum was mainly found at the half-closed packaging and the magnitude is dependent on the packaging type and the surrounding temperature. Also the impressed current decreased exponentially during the MOSFET operation.

• ETRI Journal
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• 제41권2호
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• pp.262-269
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• 2019

This paper introduces a low-cost, high-performance mmWave antenna array module at 77 GHz. Conventional waveguide transitions have been replaced by 3D CPW-microstrip transitions which are much simpler to realize. They are compatible with low-cost substrate fabrication processes, allowing easy integration of ICs in 3D multi-chip modules. An antenna array is designed and implemented using multilayer coupled-fed patch antenna technology. The proposed $16{\times}16$ array antenna has a fractional bandwidth of 8.4% (6.5 GHz) and a 23.6-dBi realized gain at 77 GHz.

• Journal of Welding and Joining
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• 제33권3호
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• pp.25-31
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• 2015

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at $-40{\sim}125^{\circ}C$ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.

• 한국융합학회논문지
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• 제9권2호
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• pp.1-6
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• 2018

본 연구에서는 전기 자동차용 DC/DC converter 회로의 전도성/복사성 방사 분석 결과를 제시하고 있다. 일반적으로 사용되는 MPQ4433 칩을 이용한 전력 변환회로의 EMI 특성을 개선하기 위해 주파수 확산 회로를 적용하였다. TLV3201칩을 사용한 주파수 확산 회로가 설계되어 전력변환 회로에 적용되었다. EMI 시뮬레이션을 통해 최적의 PCB 제작되었으며, 제작된 회로를 이용하여 원거리 방사, 근거리 전도 및 복사 방출에 대한 시뮬레이션과 측정 결과가 제시되었다. 전도 및 방사 방출은 CISPR 25의 표준화 된 시험 절차에 따라 측정되었으며 주파수 확산이 적용된 경우에 EMI 특성이 약 20% 개선되는 결과를 얻었다. 본 연구에서 제안 된 주파수 확산을 이용한 EMI 저감 기술은 자동차용 전력 컨버터 모듈의 설계에 처음 적용되었으며 향후 EMI 개선에 효과적으로 사용될 수 있을 것으로 예상된다.

• 전기전자학회논문지
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• 제25권4호
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• pp.591-597
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• 2021

본 논문에서는 전자파 방출을 줄이기 위해 필터나 디커플링 캐패시터를 사용하는 대신에 PCB 내의 칩 배치, 배선 모양 등을 변경하여 위험신호의 배선 길이와 귀환경로를 짧게 하는 EMC 고려 PCB 설계 기법을 제안하였다. 제안하는 기법에서는 PCB 상의 여러 가지 신호에 대해 신호속도를 계산하고, 신호속도가 가장 높은 위험신호에 대해 선로를 가능한 짧게 하도록 가장 먼저 칩의 위치를 선정하고 배선도 가장 먼저 수행해야 한다. 또 위험신호의 귀환경로에 불연속이 발생하지 않도록 설계하며 귀환경로의 기준이 되는 전원판과 접지판이 분할되어 있지 않도록 한다. CISPR-32, CISPR-25 등의 전자파 적합성 시험을 통과하지 못했던 차량용 블루투스 지향성 스피커에 이 기법을 적용하여 PCB를 재설계한 후 EMC 측정을 수행하였더니 해당 전자파 적합성 시험을 수월하게 통과할 수 있었다. 제안하는 기법은 EMC 특성이 중요한 전자기기에 유용하게 쓰일 수 있다.