• Title/Summary/Keyword: Applications of SoC

Search Result 426, Processing Time 0.027 seconds

A Power-adjustable Fully-integrated CMOS Optical Receiver for Multi-rate Applications

  • Park, Kangyeob;Yoon, Eun-Jung;Oh, Won-Seok
    • Journal of the Optical Society of Korea
    • /
    • v.20 no.5
    • /
    • pp.623-627
    • /
    • 2016
  • A power-adjustable fully-integrated CMOS optical receiver with multi-rate clock-and-data recovery circuit is presented in standard 65-nm CMOS technology. With supply voltage scaling, key features of the optical receiver such as bandwidth, power efficiency, and optical sensitivity can be automatically optimized according to the bit rates. The prototype receiver has −23.7 dBm to −15.4 dBm of optical sensitivity for 10−9 bit error rate with constant conversion gain around all target bit rates from 1.62Gbps to 8.1 Gbps. Power efficiency is less than 9.3 pJ/bit over all operating ranges.

C++ for CAD/CAM applications

  • Hwang, Il-Kyu;Park, Bum-Joo;Kim, Deok-Soo
    • Proceedings of the Korean Operations and Management Science Society Conference
    • /
    • 1994.04a
    • /
    • pp.58-66
    • /
    • 1994
  • The philosophy of object-oriented has found its role in various applications such as programming languages, databases, distributed systems, etc. Discussed in this paper is an experience of the object-oriented programming technique obtained while developing a particular CAD/CAM system. It has been well-known that the object-oriented programming language has good features enabling the improved reusability and extensibility of an existing code. The features include data abstraction, encapsulation, inheritance, polymorphism, and so on. This paper presents how these features of the object-oriented programming language, C++ in particular, can be applied to the implementation of geometric algorithms as well as graphical user interfaces.

Implementation of Low Power PostPC Terminal (저전력 PostPC 통합 단말기 구현)

  • Kim, Yong-Ho;Cho, Soo-Hyung;Kim, Dae-Hwan
    • Proceedings of the IEEK Conference
    • /
    • 2006.06a
    • /
    • pp.1027-1028
    • /
    • 2006
  • A case study in low-power PostPC Platform is presented. We introduce an S3C2460 Mobile SoC Processor and Implementation of Embedded Linux on out platform. This Processor is designed to Multimedia & Telecommunication Applications. We focuse on the verification of S3C2460 Processor and operation of Embedded Linux OS on it.

  • PDF

Highly Integrated Low-Power Motion Estimation Processor for Mobile Video Coding Applications (이동통신 향 동영상압축을 위한 고집적 저전력 움직임 추정기)

  • Park Hyun Sang
    • Journal of Broadcast Engineering
    • /
    • v.10 no.1 s.26
    • /
    • pp.77-82
    • /
    • 2005
  • We propose a highly Integrated motion estimation processor (MEP) for efficient video compression in an SoC platform. When compressing video by the standards like MPEG-4 and H.263, the macroblock related functions motion compensation. mode decision, motion vector prediction, and motion vector difference calculation require the frequent intervention of MCU. Thus the proposed MEP incorporates those functions with the motion estimation capability to reduce the number of interrupts to MCU, which can lead to a highly efficient SoC system. For low-power consumption, the proposed MEP can prevent the temporally static area from motion estimation or can skip the half-pel motion estimation for those macroblocks whose modes are decided as INTRA.

A New Key Protection Technique of AES Core against Scan-based Side Channel Attack (스캔 기반 사이드 채널 공격에 대한 새로운 AES 코아 키 보호 기술)

  • Song, Jae-Hoon;Jung, Tae-Jin;Park, Sung-Ju
    • Journal of KIISE:Computer Systems and Theory
    • /
    • v.36 no.1
    • /
    • pp.33-39
    • /
    • 2009
  • This paper presents a new secure scan design technique to protect secret key from scan-based side channel attack for an Advanced Encryption Standard(AES) core embedded on an System-on-a-Chip(SoC). Our proposed secure scan design technique can be applied to crypto IF core which is optimized for applications without the IP core modification. The IEEE1149.1 standard is kept, and low area and power consumption overheads and high fault coverage can be achieved compared to the existing methods.

MODELING OF A REPULSIVE TYPE MAGNETIC BEARING FOR FIVE AXIS CONTROL INCLUDING EDDY CURRENT EFFECT

  • Ohji, T.;Mukhopadhyay, S.C.;Iwahara, M.;Yamada, S.
    • Proceedings of the KIPE Conference
    • /
    • 1998.10a
    • /
    • pp.625-629
    • /
    • 1998
  • So far a single-axis controlled repulsive type magnetic bearing system have been designed and fabricated in our laboratory employing the repulsive forces operating between the stator and rotor permanent magnet for levitation. The radial axis is uncontrolled passive one. The higher speed of operation is limited due to the vibration along the uncontrolled axis and the increase of control current due to eddy current interference. This paper will discuss a detailed modeling of the repulsive type magnetic bearing system for five axis control including the eddy current effect and the method of reduction of eddy current effect. Simulation results using Matlab will be presented.

  • PDF

An Extension of the VoiceXML Platform for Push-based Voice Applications (푸쉬형 음성 서비스를 위한 VoiceXML 플랫폼의 확장)

  • 김경란;홍기형
    • The Journal of the Acoustical Society of Korea
    • /
    • v.21 no.1
    • /
    • pp.27-36
    • /
    • 2002
  • VoiceXML is a standard dialog mark-up language for the neat generation voice applications. The current VoiceXML 1.0 specification is silent on who place outbound calls for push-based voice applications. The push-barred voice applications become very important in modern information systems such as CRM. In this paper, we design and implement an extended VoiceXML platform that supports both inbound and outbound voice information services. We also extend the VoiceXML DTD so as to be able to inbound/outbound fax based on Call Control Requirements of W3C.

A Study on Reconfigurable Network Protocol Stack using Task-based Component Design on a SoC Platform (SoC 플랫폼에서 태스크 기반의 조립형 재구성이 가능한 네트워크 프로토콜 스택에 관한 연구)

  • Kim, Young-Mann;Tak, Sung-Woo
    • Journal of Korea Multimedia Society
    • /
    • v.12 no.5
    • /
    • pp.617-632
    • /
    • 2009
  • In this paper we propose a technique of implementing the reconfigurable network protocol stack that allows for partitioning network protocol functions into software and hardware tasks on a SoC (System on Chip) platform. Additionally, we present a method that guarantees the deadline of both an individual task and messages exchanging among tasks in order to meet the deadline of real-time multimedia and networking services. The proposed real-time message exchange method guarantees the deadline of messages generated by multimedia services that are required to meet the real-time properties of multimedia applications. After implementing the networking functions of TCP/IP protocol suite into hardware and software tasks, we verify and validate their performance on the SoC platform. Experimental results indicate that the proposed technique improves the performance of TCP/IP protocol suit as well as application service satisfaction in application-specific real-time.

  • PDF

Corrosion Behavior of Ytterbium Silicates in Water Vapor Atmosphere at High Temperature for Environmental Barrier Coating Applications (환경차폐코팅용 이터븀 실리케이트의 고온 수증기부식 거동)

  • Min-Ji Kim;Jae-Hyeong Choi;Seongwon Kim
    • Journal of the Korean institute of surface engineering
    • /
    • v.56 no.6
    • /
    • pp.443-450
    • /
    • 2023
  • SiC/SiCf CMC is vulnerable to water vapor corrosion at a high temperature of 1500℃. So, EBC (Environmental Barrier Coating) materials are required to protect Si-based CMCs. Ytterbium silicates are reported to have coefficient of thermal expansion (CTE) similar to that of the base material, such as SiC/SiCf CMC. When the EBC are materials exposed to high temperature environment, the interface between ytterbium silicates and SiC/SiCf CMC is not separated, and the coating purpose can be safely achieved. For the perspective of EBC applications, thermally grown oxide (TGO) layer with different CTE is formed by the reaction with water vapor in EBC, which leads to a decrease in life time. In this study, we prepare two types of ytterbium silicates to observe the corrosion behavior during the expose to high temperature and water vapor. In order to observe this behavior, the steam-jet furnace is prepared. In addition, phase formation of these ytterbium silicates is analyzed with microstructures by the before/after steam-jet evaluation at 1500℃ for 100 h.

A Study on Properties of $MgF_2$ antireflection film for solar cell (태양전지용 $MgF_2$ 반사방지막 특성연구)

  • Park, Gye-Choon;Yang, Hyeon-Hun;Baek, Su-Ung;Na, Kil-Ju;So, Soon-Youl;Lee, Jin;Chung, Hae-Deok
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 2009.11a
    • /
    • pp.378-380
    • /
    • 2009
  • $MgF_2$ is a current material for the optical applications in the UV and deep UV range. Process variables for manufacturing the $MgF_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions, and then by changing a number of vapor deposition conditions and substrate temperature, Annealing conditions variously, structural and Optical characteristics were measured. Thereby, optimum process variables were derived. Nevertheless, modern applications still require improvement of the optical and structural quality of the deposited layers. In the present work, the composition and microstructure of $MgF_2$ single layers grown on slide glass substrate by Electro beam Evaporator(KV-660) processes, were analyzed and compared. The surface Substrate temperature having an effect on the quality of the thin film was changed from $200[^{\circ}C]$ to $350[^{\circ}C]$ at intervals of $50[^{\circ}C]$. and annealing temperature an effect on the thin film was changed from $200[^{\circ}C]$ to $400[^{\circ}C]$ at intervals of $50[^{\circ}C]$. Physical properties of the thin film were investigated at various fabrication conditions substrate temperature, annealing and temperature, annealing time by XRD, FE-SEM.

  • PDF