• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Corrosion Science and Technology
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• v.16 no.2
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• pp.49-58
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• 2017

Many research efforts on the effect of nitrogen on the corrosion resistance of stainless steels have been reported, but little research has been conducted on the effect of nitrogen for the weldment of stainless steels by the seal-weld method. Therefore, this work focused on the determining the corrosion resistance of tube/tube sheet mock-up specimen for sea water condensers, and elucidating the effect of shielding nitrogen gas on its resistance. The pitting corrosion of autogenously welded specimen propagated preferentially along the dendritic structure. Regardless of the percent of shielding nitrogen gas, the analyzed nitrogen contents were very much lower than that of the bulk specimen. This can be arisen because the nitrogen in shielding gas may partly dissolve into the weldment, but simultaneously during the welding process, nitrogen in the alloy may escape into the atmosphere. However, the pitting resistance equivalent number (PREN) of the interdendrite area was higher than that of the dendrite arm, regardless of the shielding gas percent; and the PREN of the interdendrite area was higher than that of the base metal; the PREN of the dendrite arm was lower than that of the base metal because of the formation of (Cr, Mo) rich phases by welding.

• Journal of the Korean Magnetics Society
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• v.8 no.5
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• pp.261-269
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• 1998

Induced anisotropy with the energy of $6{\times}10^4\; J/m^3$ is obtained in amorphous Sm-Fe based thin films which are fabricated by rf magnetron sputtering under a magnetic field of 500~600 Oe. Compared with conventional thin films, the anisotropic thin films exhibit a similar "saturation" magnetostriction, but show a very large anisotropy in magnetorstiction which is of significant practical importance due to increased strain at a particular direction. It is shown from a systematic investigation over a wide composition range for binary Sm-Fe alloys that anisotropy is also induced, though small, during a normal sputtering procedure due to the stray field, and the largest anisotropy is observed in the composition range of 25~30 at.% Sm. Furthermore, induced anisotropy is also found to be formed by magnetic annealing, but the anisotropy energy is much smaller than that by magnetic sputtering. This may be because the volume diffusion by which atoms move during magnetic annealing to from induced anisotropy is much slower than the surface diffusion which is expected to be a dominant factor during magnetic sputtering.puttering.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.7
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• pp.573-578
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• 2003

Low temperature selective epitaxial growth of Si and SiGe has been obtained using an industrial single wafer chemical vapor deposition module operating at reduced pressure. Epitaxial Si and heteroepitaxial SiGe deposition with Ge content about 20 % has been studied as extrinsic base for self-aligned heterojunction bipolar transistors(HBTs), which helps to reduce the parasitic resistance to obtain higher maximum oscillation frequencies(f$\_$max/). The dependence of Si and SiGe deposition rates on exposed windows and their evolution with the addition of HCl to the gas mixture are investigated. SiH$_2$Cl$_2$ was used as the source of Si SEG(Selective Epitaxial Growth) and GeH$_4$ was added to grow SiGe SEG. The addition of HCl into the gas mixture allows increasing an incubation time even low growth temperature of 675∼725$^{\circ}C$. In addition, the selectivity is enhanced for the SiGe alloy and it was proposed that the incubation time for the polycrystalline deposit on the oxide is increased probably due to GeO formation. On the other hand, when only SiGe SEG(Selective Epitaxial Growth) layer is used for extrinsic base, it shows a higher sheet resistance with Ti-silicide because of Ge segregation to the interface, but in case of Si or Si/SiGe SEG layer, the sheet resistance is decreased up to 70 %.

• Nuclear Engineering and Technology
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• v.50 no.3
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• pp.416-424
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• 2018

Microstructure of oxide formed on Zr-Nb-Sn tube sample was intensively examined by scanning transmission electron microscopy after exposure to simulated primary water chemistry conditions of various concentrations of Zn (0 or 30 ppb) and dissolved hydrogen ($H_2$) (30 or 50 cc/kg) for various durations without applying desirable heat flux. Microstructural analysis indicated that there was no noticeable change in the microstructure of the oxide corresponding to water chemistry changes within the test duration of 100 days (pretransition stage) and no significant difference in the overall thickness of the oxide layer. Equiaxed grains with nano-size pores along the grain boundaries and microcracks were dominant near the water/oxide interface, regardless of water chemistry conditions. As the metal/oxide interface was approached, the number of pores tended to decrease. However, there was no significant effect of $H_2$ concentration between 30 cc/kg and 50 cc/kg on the corrosion of the oxide after free immersion in water at $360^{\circ}C$. The adsorption of Zn on the cladding surface was observed by X-ray photoelectron spectroscopy and detected as ZnO on the outer oxide surface. From the perspective of $OH^-$ ion diffusion and porosity formation, the absence of noticeable effects was discussed further.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.64-70
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• 2012

Samples of pure Mg, 76.5 wt%Mg-23.5 wt%Ni, and 71.5 wt%Mg-23.5 wt%Ni-5 wt%$Fe_2O_3$ were prepared by reactive mechanical grinding and their hydriding and dehydriding properties were then investigated. The reactive mechanical grinding of Mg with Ni is considered to facilitate nucleation and to shorten diffusion distances of hydrogen atoms. After hydriding-dehydriding cycling, the 76.5 wt%Mg-23.5 wt%Ni and 71.5 wt%Mg-23.5 wt%Ni-5 wt%$Fe_2O_3$ samples contained $Mg_2Ni$ phase. In addition to the effects of the creation of defects and the decrease in particle size, the addition of Ni increases the hydriding and dehydriding rates by the formation of $Mg_2Ni$. Expansion and contraction of the hydride-forming materials (Mg and $Mg_2Ni$) with the hydriding and dehydriding reactions are also considered to increase the hydriding and dehydriding rates of the mixture by forming defects and cracks leading to the fragmentation of particles. The reactive mechanical grinding of Mg-Ni alloy with $Fe_2O_3$ is considered to decrease the particle size.

• Journal of the Korean Magnetics Society
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• v.16 no.5
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• pp.249-254
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• 2006

CoFeNi alloys are some of the most studied soft magnetic materials because of their superial properties over FeNi alloys as write head core materials in HDD and MEMS. We studied the effect of magnetic property according to size and orientation of crystal for electroplated Co-Fe-Ni alleys. In case of heat treated ternary alloy, it affect the change of crystal size and structure. In this study, it intends to improve the magnetic properties of CoFeNi thin film by heat treatment. Minimized coercivity and increased magnetization are due to heat treatment from $300^{\circ}C\;to\;400^{\circ}C$. As a bcc phase formation, it grow to amount of magnetization.

• Journal of the Korean institute of surface engineering
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• v.52 no.2
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• pp.62-71
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• 2019

Al1050 and Al7075 alloy specimens were exposed to atmospheric conditions for 24 months and analyzed by Transmission Electron Microscopy to characterize their corrosion behavior and oxide film characteristics, especially focusing on intergranular corrosion or oxidation. In general, the intergranular oxygen penetration depth of Al1050 was deeper than Al7075. Since O and Si signals were overlapped at the oxidized grain boundaries of Al1050 and Mg is not included in Al1050, it is concluded that Si segregated along the grain boundaries directly impacts on the intergranular corrosion of Al1050. Cr-Si or Mg-Si intermetallic particles were not observed along the grain boundaries of Al7050, but Mg-Si particle was barely observed in the matrix. 10-nm size Mg-Zn particles were also found all over the matrix. Mg was mainly observed along the oxidized grain boundary of Al7075, but Si was not detected due to the Mg-Si particle formation in the matrix and relatively low concentration of Si in Al7075. Therefore, it is thought that Mg plays an important role in the intergranular corrosion of Al7075 under atmospheric corrosion conditions.

• Metals and materials international
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• v.24 no.6
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• pp.1213-1220
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• 2018

The effects of Cr and Fe addition on the mechanical properties of Ti-6Al-4V alloys prepared by direct energy deposition were investigated. As the Cr and Fe concentrations were increased from 0 to 2 mass%, the tensile strength increased because of the fine-grained equiaxed prior ${\beta}$ phase and martensite. An excellent combination of strength and ductility was obtained in these alloys. When the Cr and Fe concentrations were increased to 4 mass%, extremely fine-grained martensitic structures with poor ductility were obtained. In addition, Fe-added Ti-6Al-4V resulted in a partially melted Ti-6Al-4V powder because of the large difference between the melting temperatures of the Fe eutectic phase (Ti-33Fe) and the Ti-6Al-4V powder, which induced the formation of a thick liquid layer surrounding Ti-6Al-4V. The ductility of Fe-added Ti-6Al-4V was thus poorer than that of Cr-added Ti-6Al-4V.