• 한국초전도학회:학술대회논문집
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• v.10
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• pp.165-168
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• 2000

We fabricated ramp-edge Josephson junctions with barriers formed by interface treatments instead of epitaxially grown barrier layers. A low-dielectric Sr$_2$AlTaO$_6$(SAT) layer was used as an ion-milling mask as well as an insulating layer for the ramp-edge junctions. An ion-milled YBa$_2$Cu$_3$O$_{7-x}$ (YBCO)-edge surface was not exposed to solvent through all fabrication procedures. The barriers were produced by structural modification at the edge of the YBCO base electrode using high energy ion-beam treatment prior to deposition of the YBCO counter electrode. We investigated the effects of high energy ion-beam treatment, annealing, and counter electrode deposition temperature on the characteristics of the interface-controlled Josephson junctions. The junction parameters such as T$_c$, I$_c$c, R$_n$ were measured and discussed in relation to the barrier layer depending on the process parameters.

• Journal of Powder Materials
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• v.25 no.1
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• pp.43-47
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• 2018

Carbon nanofibers (CNF) are widely used as active agents for electrodes in Li-ion secondary battery cells, supercapacitors, and fuel cells. Nanoscale coatings on CNF electrodes can increase the output and lifespan of battery devices. Atomic layer deposition (ALD) can control the coating thickness at the nanoscale regardless of the shape, suitable for coating CNFs. However, because the CNF surface comprises stable C-C bonds, initiating homogeneous nuclear formation is difficult because of the lack of initial nucleation sites. This study introduces uniform nucleation site formation on CNF surfaces to promote a uniform $SnO_2$ layer. We pretreat the CNF surface by introducing $H_2O$ or $Al_2O_3$ (trimethylaluminum + $H_2O$) before the $SnO_2$ ALD process to form active sites on the CNF surface. Transmission electron microscopy and energy-dispersive spectroscopy both identify the $SnO_2$ layer morphology on the CNF. The $Al_2O_3$-pretreated sample shows a uniform $SnO_2$ layer, while island-type $SnO_x$ layers grow sparsely on the $H_2O$-pretreated or untreated CNF.

• Journal of the Korean institute of surface engineering
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• v.47 no.4
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• pp.186-191
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• 2014

Double layer films which consisted of aluminum(Al) and magnesium(Mg) have been prepared by e-beam deposition. The structure, alloy phase, and corrosion resistance of the prepared films were investigated before and after heat treatment. The first (bottom) layer fixed with Al, and the thickness ratio between Al and Mg layers has been changed from 1 : 1 to 5 : 1, respectively. Total thickness of Al-Mg film was fixed at $3{\mu}m$. The cold-rolled steel sheet was used as a substrate. Heat treatment was fulfilled in an nitrogen atmosphere at the temperature of $400^{\circ}C$ for 2, 3 and 10 min. Surface morphology of as-deposited Al-Mg film having Mg top layer showed plate-like structure. The morphology was not changed even after heat treatment. However, cross-sectional morphology of Al-Mg films was drastically changed after heat treatment, especially for the samples heat treated for 10 min. The morphology of as-deposited films showed columnar structure, while featureless structure of the films appeared after heat treatment. The x-ray diffraction data for as-deposited Al-Mg films showed only pure Al and Mg peaks. However, Al-Mg alloy peaks such as $Al_3Mg_2$ and $Al_{12}Mg_{17}$ appeared after heat treatment of the films. It is believed that the formation of Al-Mg alloy phase affected the structure change of Al-Mg film. It was found that the corrosion resistance of Al-Mg film was increased after heat treatment.

• Journal of the Korean Vacuum Society
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• v.20 no.1
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• pp.63-69
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• 2011

In this study, we report on the novel lithographic patterning method to fabricate organic thin film field effect transistors (OTFTs) based on photo and e-beam lithography with well-known silicon technology. The method is applied to fabricate pentacene-based organic field effect transistors. Owing to their solubility, sub-micron sized patterning of P3HT and PEDOT has been well established via micromolding in capillaries and inkjet printing techniques. Since the thermally deposited pentacene cannot be dissolved in solvents, other approach was done to fabricate pentacene FETs with a very short channel length (~30 nm), or in-plane orientation of pentacene molecules by using nanometer-scale periodic groove patterns as an alignment layer for high-performance pentacene devices. Here, we introduce $Al_2O_3$ film grown via atomic layer deposition method onto pentacene as a passivation layer. $Al_2O_3$ passivation layer on OTFTs has some advantages in preventing the penetration of water and oxygen and obtaining the long-term stability of electrical properties. AZ5214 and ma N-2402 were used as a photo and e-beam resist, respectively. A few micrometer sized lithography patterns were transferred by wet and dry etching processes. Finally, we fabricated micron sized pentacene FETs and measured their electrical characteristics.

• Electronic Materials Letters
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• v.14 no.6
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• pp.669-677
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• 2018

In this work, the high ${\kappa}$ $Zr_xAl_{1-x}O_y$ films with a different Zr concentration have been deposited by atomic layer deposition, and the effect of Zr concentrations on the structure, chemical composition, surface morphology and dielectric properties of $Zr_xAl_{1-x}O_y$ films is analyzed by Atomic force microscopy, X-ray diffraction, X-ray photoelectron spectroscopy and capacitance-frequency measurement. The effect of Zr concentrations of $Zr_xAl_{1-x}O_y$ gate insulator on the electrical property and stability under negative bias illumination stress (NBIS) or temperature stress (TS) of ZnSnO (ZTO) TFTs is firstly investigated. Under NBIS and TS, the much better stability of ZTO TFTs with $Zr_xAl_{1-x}O_y$ film as a gate insulator is due to the suppression of oxygen vacancy in ZTO channel layer and the decreased trap states originating from the Zr atom permeation at the $ZTO/Zr_xAl_{1-x}O_y$ interface. It provides a new strategy to fabricate the low consumption and high stability ZTO TFTs for application.

• Progress in Superconductivity
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• v.12 no.2
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• pp.114-117
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• 2011

We report our efforts on the development of Nb-based non-hysteretic Josephson junction fabrication process for quantu device applications. By adopting and modifying the existing Nb-aluminum oxide tunnel junction process, we develop a process for non-hysteretic Josephson junction circuits using metal-silicide as metallic barrier material. We use sputter deposition of Nb and $MoSi_2$, PECVD deposition of silicon oxide as insulator material, and ICP-RIE for metal and oxide etch. The advantage of the metal-silicide barrier in the Nb junction process is that it can be etched in $SF_6$ RIE together with Nb electrode. In order to define a junction area precisely and uniformly, end-point detection for the RIE process is critical. In this paper, we employed thin Al layer for the etch stop, and optimized the etch condition. We have successfully demonstrated that the etch stop properties of the inserted Al layer give a uniform etch profile and a precise thickness control of the base electrode in Nb trilayer junctions.

• Journal of the Korean Vacuum Society
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• v.16 no.5
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• pp.377-382
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• 2007

In this study, we report the synthesis of the single-walled carbon nanotubes(SWCNTs) using laminated catalyst(Al/Fe/Al) layer deposited by sputter on Si(001). SWCNTs are grown by thermal chemical vapor deposition (TCVD) method. As the results of scanning electron microscopy(SEM), high resolution transmission electron microscopy(HR-TEM) and Raman spectroscopy, we confirmed the SWCNTs bundles with narrow diameter distribution of $1.14{\sim}1.32\;nm$ and average G&D ratio of 22.76. Compare to the sample having Fe/Al catalyst layer, it can be proposed that the top-aluminum incorporated with iron catalyst plays an important role in growing process of CNTs as a agglomeration barrier of the Fe catalyst. Thus, we suggest that a proper quantity of aluminium metal incorporated in Fe catalyst induce small and uniform iron catalysts causing SWCNTs with narrow diameter distribution.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.286-286
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• 2010

The lack of homogeneously sized single-walled carbon nanotubes (SWNTs) hinders their many applications because properties of SWNTs, in particular electrical conduction, are highly dependent on the diameter and chirality. Therefore, the preferential growth of SWNTs with predetermined diameters is an ultimate objective for applications of SWNTs-based nanoelectronics. It has been previously emphasized that a catalyst size is the one crucial factor to determine the CNTs diameter in chemical vapor deposition (CVD) process, giving rise to several attempts to obtain size-controllable catalyst by diverse methods, such as solid supported catalyst, metal-containing molecular nanoclusters, and nanostructured catalytic layer. In this work, diameter-controlled CNTs were synthesized using a nanostructured catalytic layer consisting of Fe/Al2O3/Si substrate. The CNTs diameter was controlled by structural modification of Al2O3 supporting layer, because Al2O3 supporting layer can affect agglomeration phenomenon induced by heat-driven surface diffusion of Fe catalytic nanoparticles at growth temperature.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.1-4
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• 2017

Encapsulation of organic based devices is essential issue due to easy deterioration of organic material by water vapor. Atomic layer deposition (ALD) is a promising solution because of its low temperature deposition and quality of the deposited film. Moisture permeation has a mechanism to pass through defects, Thin Film Encapsulation using inorganic / organic / inorganic hybrid film has been used as promising technology. $Al_2O_3$ / Polymer / $Al_2O_3$ multilayer film has shown excellent environmental protection characteristics despite of thin thicknesses of the films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.356-356
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• 2007

Plasma immersion ion beam deposition (PIIBD) technique is a cost-effective process for the deposition of diamond like carbon thin film, the possible solid lubricant on large surface and a complex shape. We used PIIB process for the preparation of DLC thin film on $Al_2O_3$ with deposition conditions of deposition temperature range $200^{\circ}C$, working gas pressure of 1.310-1Pa. DLC thin films were coated by $C_2H_2$ ion beam deposition on $Al_2O_3$ after the ion bombardment of SiH4 as the bonding layer. Energetic bombardment of $C_2H_2$ ions during the DLC deposition to ceramic materials generated mixed layers at the DLC-Si interface which enhanced the interface to be highly bonded. Wear test showed that the low coefficient of friction of around 0.05 with normal load 2.9N and proved the advantage of the low energy ion bombardment in PIIBD process which improved the tribological properties of DLC thin film coated alumina ceramic. Furthermore, PIIBD was recognized as a useful surface modification technique for the deposition of DLC thin film on the irregular shape components, such as molds, and for the improvement of wear and adhesion problems of the DLC thin film, high temperature solid lubricant.