• 한국재료학회지
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• 제20권1호
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• pp.19-24
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• 2010

The current study examined Ag migration from the Ag paste bump in the SABiT technology-applied PCB. A series of experiments were performed to measure the existence/non-existence of Ag in the insulating prepreg region. The average grain size of Ag paste was 30 nm according to X-ray diffraction (XRD) measurement. Conventional XRD showed limitations in finding a small amount of Ag in the prepreg region. The surface morphology and cross section view in the Cu line-Ag paste bump-Cu line structure were observed using a field emission scanning electron microscope (FE-SEM). The amount of Ag as a function of distance from the edge of Ag paste bump was obtained by FE-SEM with energy dispersive spectroscopy (EDS). We used an electron probe micro analyzer (EPMA) to improve the detecting resolution of Ag content and achieved the Ag distribution function as a function of the distance from the edge of the Ag paste bump. The same method with EPMA was applied for Cu filled via instead of Ag paste bump. We compared the distribution function of Ag and Cu, obtained from EPMA, and concluded that there was no considerable Ag migration effect for the SABiT technology-applied printed circuit board (PCB).

• 한국재료학회지
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• 제29권1호
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• pp.37-42
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• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• 한국인쇄학회지
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• 제30권2호
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• pp.1-12
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• 2012

In this experiment, we have manufactured thermal-curable silver pastes for direct printing. And to enhance conductivity, printability, adhesion and hardness during polymer direct-gravure prints, we have manufactured Ag pastes by adding variety of filter contents. Then we have investigated characteristics of rheology in paste according to the gravure printability and the properties of printed conductive patterns. Depending on a variety of Ag powder, there was a big difference in sharpness of printed pattern. And also by the use of carbon, there was a big difference in amount of solvent used, conductivity and in hardness. We could improve doctoring and the sharpness of a pattern by adding Ag paste in carbon particle, but as we have used nano-sized particle, there was an increase in the amount of solvent used and also we have found out that it gives a bad effect as adhesive and hardness becomes weaker. Even though Ag particle has the same spherical shape, the surface treatments could differ from one another. And by the appropriate choice and with the suitable combination of Ag powder, excellent printability and conductivity could be obtained.

• 한국분말재료학회지
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• 제24권5호
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• pp.395-399
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• 2017

Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.546-546
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• 2012

Traditional screen printing is still a dominant method to print electrodes on c-Si solar cells. In order to achieve higher efficiency for c-Si solar cells, improvement of the electrode material is one of the key approaches. Shadowing loss can be reduced by using high aspect ratio finger electrode with width of finger electrode less than 80um. The rheological properties of Ag paste for applying c-Si solar cells are improved by using Ag nanowires. The printing properties including the aspect ratio of printed electrode can be improved with higher Thixotropic index (T.I.) values.

• Bulletin of the Korean Chemical Society
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• 제33권12호
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• pp.3987-3992
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• 2012

Silver nanopowders were prepared from silver 2-ethylhexylcarbamate (Ag-EHCB) complexes by simple thermal reduction at $85^{\circ}C$ without any reducing agent in organic solvent. 2-Ethylhexylammonium 2-ethylhexylcarbamate (EHAEHC) was investigated in terms of their abilities to stabilize the silver nanoparticles (Ag-NPs) and its subsequent effects on the preventing aggregation between Ag-NPs. Conditions (concentration of stabilizer and reaction time) used to reduce Ag-EHCB complex were systematically varied to determine their effects on the sizes of Ag-NPs. The formation of the stabilized Ag-NPs were easily monitored by UV-vis spectroscopy and characterized by TGA, TEM, SEM and XRD. When EHAEHC was used as a stabilizer, Ag-NPs of 10-30 nm in diameter were easily obtained in high yield. Silver patterns were obtained from a silver nano-paste by heat treatment at $200^{\circ}C$ in air and were found to have resistivity values of $2.9{\times}10^{-8}\;{\Omega}{\cdot}m$.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.61.2-61.2
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• 2010

Ag thick-film has usually been used for the front electrode of Si solar cells with the outstanding electrical properties. Ag paste consists of Ag powers, vehicles, frits and additives. Ag paste has broadly been screen-printed on the front side of Si wafer with the merits of low cost and simplicity. The optimal contact formation between Ag electrodes and Si wafer in the front electrode during a fast firing has been considered as the key factor for high efficiency. Although the content of frit in Ag pastes is less than 5wt%, it can profoundly influence the contact formation between Ag and Si under the fast firing. In this study, the effects of lead-free frits on the contacts between Ag and Si were studied with the thermal properties and compositions of various frits. Our experimental results showed that the electrical properties of cells were related to the interface structures between Ag and Si. It was found that current path of electrons from Si to Ag would be possible through the tunneling mechanism assisted by tens of nano-Ag recrystals on $n^+$ emitter as well as Ag recrystals penetrated into $n^+$ emitter layers. These preliminary studies will be helpful for designing the proper frits for the Ag pastes with considering the properties of various Si wafers.

• 한국분말재료학회지
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• 제24권6호
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• pp.464-471
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• 2017

A metal mesh TCE film is fabricated using a series of processes such as UV imprinting of a transparent trench pattern (with a width of $2-5{\mu}m$) onto a PET film, filling it with silver paste, wiping of the surface, and heat-curing the silver paste. In this work nanosized (40-50 nm) silver particles are synthesized and mixed with submicron (250-300 nm)-sized silver particles to prepare silver paste for the fabrication of metal mesh-type TCE films. The filling of these silver pastes into the patterned trench layer is examined using a specially designed filling machine and the rheological testing of the silver pastes. The wiping of the trench layer surface to remove any residual silver paste or particles is tested with various mixture solvents, and ethyl cellosolve acetate (ECA):DI water = 90:10 wt% is found to give the best result. The silver paste with 40-50 nm Ag:250-300 nm Ag in a 10:90 wt% mixture gives the highest electrical conductance. The metal mesh TCE film obtained with this silver paste in an optimized process exhibits a light transmittance of 90.4% and haze at 1.2%, which is suitable for TSP application.

• 한국진공학회지
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• 제18권2호
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• pp.79-84
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• 2009

삼극형(triode type) 전자 방출원을 프린팅된 CNT(Carbon Nanotube) 에미터를 이용하여 제작하였다. 후면노광(Back Exposure)방법으로 CNT 에미터의 높이를 균일하게 하고, 나노 Ag를 첨가하여 CNT와 전극 사이의 접착력 및 전기전도성을 높임으로써 고전압, 고전류 구동 시 신뢰성을 확보하였다. 게이트 높이가 에미터 길이에 비해 비교적 높은 매크로 게이트 구조를 사용하여 누설 전류가 적고 안정적인 구동이 가능하였다. 제작된 삼극형 전자 방출원은 DC 전압이 인가된 상태에서 일정시간동안 전계방출 전류를 측정하여 신뢰성을 평가하였다. 가열 배기 에이징(Aging) 과정을 거친 경우 약 12 시간동안 안정적인 전계방출 특성을 보였다. 이 때 게이트 누설전류는 약 10 % 미만이었다.

• 마이크로전자및패키징학회지
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• 제29권1호
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• pp.35-41
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• 2022

5G 시대를 맞아, 인공지능, 클라우드 컴퓨팅, 자율주행 차량, 스마트 제조 등의 기술 소요가 증가하고 있다. 전자기기의 고효율을 위해 고집적회로 및 패키징 연구는 중요하다. 전해도금된 솔더는 범프 조성의 균일성에 한계가 있다. 작은 크기의 솔더 파우더로 구성된 솔더 페이스트는 고집적 패키징에 일반적으로 사용되는 솔더 중 하나이다. 솔더 페이스트에 나노 입자를 첨가하거나 기판 표면 마감 처리를 하여 젖음성을 향상시키고, 금속 패드 계면에서 금속간화합물의 성장을 억제하는 연구가 진행중이다. 본 논문은 나노 입자 첨가를 통한 솔더 페이스트의 젖음성 향상과 계면 금속간화합물의 성장을 억제하는 원리에 대하여 설명한다.