• Elastomers and Composites
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• v.57 no.1
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• pp.1-8
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• 2022

In this study, the photo-deposition method was used to introduce Ag onto the surface of TiO₂ to synthesize an Ag-TiO₂ composite. The effects of the varying amounts of AgNO₃ precursor and annealing time periods on the Ag content in the composites, as well as their antibacterial characteristics under visible light conditions were studied. SEM analysis revealed the spherical morphology of the Ag-TiO₂ composite. Compared with TiO₂, the Ag particles were too small to be observed. An XPS analysis of the Ag-TiO₂ surface confirmed the Ag content and showed the peak intensities for elements such as Ag, Ti, O, C, and Si. The highest Ag content was observed when 33.3 wt.% of AgNO₃ and an annealing time of 6 h were employed; this was the optimum annealing time for Ti-Ag-O bonding, in that the lowest number of O bonds and the highest number of Ag bonds were confirmed by XPS analysis. Superior antibacterial properties against Bacillus and Escherichia coli, in addition to the widest inhibition zones were exhibited by the Ag-TiO₂ composite with an increased Ag content in a disk diffusion test, the bacterial reduction rate against Staphylococcus aureus and Escherichia coli being 99.9%.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.106-109
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• 2003

With the variation of Ag concentration in bath, current density, additive and agitation for electroplating of Sn-Ag solder, the compositions and the morphologies of solder were studied. It was possible to control Ag content in Sn-Ag solder by varying Ag concentration in bath and current density The microstructure size of Sn-Ag solder decreased with increasing current density. Duty cycle of pulse electroplating and quantity of additive affected on Ag content of deposit and surface roughness. In this work eutectic Sn-Ag solder bumps with fine pitch of 30m and height of 15m was formed successfully. The Ag content of electrodeposited solder was confirmed by EDS and WDS analyses and the surface morphologies was analyzed by SEM and 3D surface analyzer.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.169-171
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• 2006

Solderability and reaction properties were investigated for four Pb-free alloys as a function of Ag contents; Sn-4.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu, Sn-2.5Ag-0.5Cu, and Sn-1.0Ag-0.5Cu. The alloy of the lowest Ag content, i.e., Sn-1.0Ag-0.5Cu, showed poor wetting properties as the reaction temperature decreased to 230oC. Variation of Ag concentration in the Sn-xAg-0.5Cu alloy shifted exothermic peaks indicating the undercooling temperature in DSC curve. For the aging process at 170oC, the thickness of IMCs at the board-side solder/Cu interface increased with the Ag concentration.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.73-79
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• 2003

With the variation of Ag concentration in bath, current density, duty cycle, additive and agitation for electroplating of Sn-Ag solder, the compositions and the morphologies of solder were studied. It was possible to controll Ag content in Sn-Ag solder by varying Ag concentration in bath and current density. The microstructure size of Sn-Ag solder decreased with increasing current density. Duty cycle of pulse electroplating and quantity of additive affected on Ag content of deposit and surface roughness. In this work eutectic Sn-Ag solder bumps with fine pitch of 30 $\mu\textrm{m}$ and height of 15 $\mu\textrm{m}$ was formed successfully. The Ag content of electrodeposited solder was confirmed by EDS and WDS analyses and the surface morphologies was analyzed by SEM and 3D surface analyzer.

• Journal of the Korean Society for Heat Treatment
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• v.23 no.1
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• pp.10-16
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• 2010

The microstructure of Cu-Mg-P alloy sheet consisted of Cu matrix and very fine MgP precipitate, and it has been observed that the microstructure remains virtually unchanged by Ag additions up to 2%. Ag solutes were dissolved into the matrix and hardly found in the precipitates. The hardness increased with increase of the Ag content, while the conductivity slightly decreased. Strain hardening through cold rolling was found to be effective in improving the hardness, especially in high-Ag alloys. Aging treatment was conducted either before the first cold rolling or between the first and the final cold rolling, and the conductivity was significantly higher at the former case, regardless of the Ag content. Softening of Cu-Mg-P alloy sheet was remarkable above $400^{\circ}C$ and the Ag content did not show any significant effect on it.

• Journal of the Korean GEO-environmental Society
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• v.20 no.11
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• pp.5-10
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• 2019

For the development of long-wavelength responding photocatalyst, Ag was applied to commercial $TiO_2$ to produce $Ag/TiO_2$ photocatalyst. Moreover, micro-emulsion method was used in order to increase the efficiency of the photocatalyst by enhancing the dispersion of Ag. Physical properties of the manufactured catalyst were analyzed by scanning electron microscopy (SEM), field emission transmission electron microscopy (FE-TEM) and diffuse reflectance spectroscopy (DRS). For the catalytic performance measurement, RO 16 (Reactive Orange 16) removal was performed with 25 ppm RO 16 under UV-A (365 nm) irradiation. In addition, ball milling and dip-coating method were used to synthesize the photocatalyst for the comparison of the outcomes of using different synthesis methods. In addition, catalytic performance was improved by varying the Ag content and surfactant content. The highest catalytic performance was shown at $Ag/TiO_2$ synthesized by micro-emulsion method with 2 wt% of Ag content, and 0.5 g of the surfactant.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.33-37
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• 2011

In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.

• Journal of Electrochemical Science and Technology
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• v.14 no.1
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• pp.59-65
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• 2023

Sodium hydroxide solutions are often employed as sterilization agents in the pharmaceutical industry. Here, the chloride content is considered as a critical impurity. In this study, an electrochemical method was developed to remove chloride ions (Cl^-) through the oxidative deposition of AgCl on a Ag anode. The Cl^- content in the commercially available 50% w/w NaOH solution employed was approximately 100 mg Cl^-/kg NaOH. As the OH^- content is approximately 18,000 times higher than the Cl^- content, the formation of AgCl may be expected to be thermodynamically less favorable than the formation of Ag₂O. However, activation energies for AgCl and Ag₂O formation have been reported to be approximately 3.8 and 31.2 kJ/mol, respectively, and indicate that AgCl formation is favored. AgCl can be selectively produced by controlling the anode potential. Here, the Cl^- concentration was reduced to less than 50 mg Cl^-/kg NaOH when an anode potential of 0.18 or 0.19 V vs. Hg/HgO (reference electrode) was applied for one hour at 50℃. XRD analysis and visual monitoring of the Ag anode confirmed the oxidative deposition of AgCl on the anode surface as well as the electrochemical desalination of the concentrated NaOH solution.

• Journal of Life Science
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• v.29 no.10
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• pp.1086-1095
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• 2019

This research was performed to develop a new material consisting of a mixture of Red Allium cepa (RA) Cucurbita moschata duch (CM), and Angelica gigas Nakai (AG). RA and CM have low storage stability because of their high moisture content. Therefore, their major components were extracted and used for the research after a content analysis. In order to overcome these limitations, the quercetin from RA, ${\beta}-carotene$ from CM, and decursin/decursinol angelate (D/DA) from AG were separately extracted, and the biochemical activity of each extract and mixture was compared. RA was bioconverted by the Bacillus subtillis KJ-3 (BS3) after ethanol extraction. After bioconversion, the quercetin content of RA was increased by 128.9%. ${\beta}-carotene$ was detected in the CM ethanol extract and its content was very low concentrations at 0.2 mg/g. The AG ethanol extract (1 mg) contained 0.4146 mg and 0.3659 mg of D/DA, respectively. The purity of the D/DA was found to be about 78%. The flavonoid and polyphenol content of each extract and their mixtures (mixture 1 (RA:CM:AG = 5:2:3), mixture 2 (RA:CM: AG = 3:5:2), and mixture 3 (RA:CM:AG = 3:2:5)) were measured. In addition, the cell survival rate, anti-inflammatory activity, and antioxidant ability were also evaluated. In all the results, the antioxidant activity of mixture 3 was most effective. Therefore, these findings provide basic data for future food development using a 3:2:5 mixture of RA, CM, and AG.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.49-55
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• 2011

The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.