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http://dx.doi.org/10.6117/kmeps.2011.18.3.033

Effect of Cl Content on Interface Characteristics of Isotropic Conductive Adhesives/Sn Plating Interface  

Kim, Keun-Soo (Fusion Technology Lab., Hoseo University)
Lee, Ki-Ju (ISIR, Osaka University)
Suganuma, Katsuaki (ISIR, Osaka University)
Huh, Seok-Hwan (ACI divisions, Samsung Electro-Mechanics)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.3, 2011 , pp. 33-37 More about this Journal
Abstract
In this study, the degradation mechanism of mounted chip resistors with Ag-epoxy isotropic conductive adhesives (ICAs) under the humidity exposure ($85^{\circ}C$/85%RH) was examined by electrical resistance change and microstructural study. The effect of the chloride content in Ag-epoxy ICA on joint stability was also examined. The increasing range of the electrical resistance in the typical ICA joint was greater than that in the low Cl content ICA joint. In the case of the typical ICA joint, Sn oxides such as SnO, $SnO_2$, and Sn-Cl-O were formed inhomogeneously on the surface of the Sn plating during the $85^{\circ}C$/85%RH test. In contrast, no Sn-Cl-O was found in the low Cl content ICA joint during the $85^{\circ}C$/85%RH. It is suggested that Cl in Ag-epoxy ICA accelerate the electrical degradation of Sn plated chip components joined with Ag-epoxy ICA.
Keywords
Ag-epoxy; conductive adhesive; Cl; Sn plating; $85^{\circ}C$/85%RH;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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