Effect of Cl Content on Interface Characteristics of Isotropic Conductive Adhesives/Sn Plating Interface |
Kim, Keun-Soo
(Fusion Technology Lab., Hoseo University)
Lee, Ki-Ju (ISIR, Osaka University) Suganuma, Katsuaki (ISIR, Osaka University) Huh, Seok-Hwan (ACI divisions, Samsung Electro-Mechanics) |
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