Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
권호 표지

Effects of electroplating parameters on the compositions and morphologies of Sn-Ag bumps

Sn-Ag 범프의 조성과 표면 형상에 영향을 미치는 도금 인자들에 관한 연구

  • 김종연 (한국과학기술원 재료공학과) ;
  • 유진 (한국과학기술원 재료공학과) ;
  • 배진수 (홍익대학교 신소재공학과) ;
  • 이재호 (홍익대학교 신소재공학과)
  • Published : 2003.11.01
Download PDF
⟨ Previous Next ⟩

Abstract

With the variation of Ag concentration in bath, current density, additive and agitation for electroplating of Sn-Ag solder, the compositions and the morphologies of solder were studied. It was possible to control Ag content in Sn-Ag solder by varying Ag concentration in bath and current density The microstructure size of Sn-Ag solder decreased with increasing current density. Duty cycle of pulse electroplating and quantity of additive affected on Ag content of deposit and surface roughness. In this work eutectic Sn-Ag solder bumps with fine pitch of 30m and height of 15m was formed successfully. The Ag content of electrodeposited solder was confirmed by EDS and WDS analyses and the surface morphologies was analyzed by SEM and 3D surface analyzer.

Keywords