• International Journal of Aerospace System Engineering
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• 제1권1호
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• pp.44-47
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• 2014

This study proposes a development for the nano silver adhesive, which is applicable to high efficiency LED(light-emitting diode) light. The important issue of LED light is heat exhaust from LED. Generally, the middle area of LED light is increased up to 380K. Therefore, the bottleneck between LED chip and heat sink are caused by high temperature. In this work, the adhesive material between LED Chip and heat sink was newly developed for improvement of bottleneck. The nano silver was adopted to solve heat problem of chip on board package for LED light. In order to evaluate the performance of the nano silver adhesive, the thermal analysis was performed. Moreover both adhesive performance and heat exhaust were verified through the prototype test. From the experimental test results, it is found that the developed nano silver adhesive has the high performance.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2006년도 추계 학술논문 발표대회 논문집
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• pp.61-65
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• 2006

Urethane, epoxy, acrylic have common property to adhere on the concrete dried surface in the waterproofing materials at present. In the wet condition, however, the materials such as urethane, epoxy, acrylic need a long hardening time and it become a reason of water leakage as the materials breaking down. it is one of the problem to adhere to the substrate. Therefore, in this thesis, I focused to assure the structural safety and durability and quality for waterproofing and safe of construction cost by cut down the cost of labor and reduce the term of works as searching the application of field condition for hish adhesive spray type of degenerated and rubberized asphalt membrane material.

• Journal of Welding and Joining
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• 제33권5호
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Architectural research
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• 제14권3호
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• pp.93-98
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• 2012

The objective of the study is to analyze the relative performance of factors affecting indoor air quality in multi-residential buildings in Korea. A study of the factors affecting indoor air quality is essential for establishing indoor air quality management strategies effectively. To observe the indoor air quality response following a modification of a given parameter, a sensitivity analysis was performed. The factors examined for the analysis include; wall/ceiling paper, adhesive for wall/ceiling paper, floor material, adhesive for floor material, and ventilation rate. The Experimental Design which identifies main effects among the design parameters with a few experiments was used to decrease the number of experiments. The simulation for indoor air quality was undertaken using a validated equation. Then, ANOVA(Analysis of Variance) was performed to evaluate the relative importance of each parameter affecting the indoor air quality. The result of the study indicates that the indoor air quality may be influenced most by adhesive for wall/ceiling paper, followed by ventilation rate and adhesive for floor material.

• 한국전산구조공학회논문집
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• 제16권4호
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• pp.401-406
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• 2003

접착제와 피착재의 물성치는 고정된 값을 가지기보다 항상 어느 정도의 불확실성을 내포하고 있으며, 이는 결합부의 성능에 영향을 미치게 된다. 본 논문에서는 컨벤스 모델링을 이용하여 불확실한 물성치를 갖는 단일 겹치기 이음의 응력해석을 수행하였다. 불확실성을 고려한 수치해석 결과, 결합부에 작용하는 전단 및 수직 응력은 증가하였으며 이는 결합부의 강도 해석에 불확실성이 반드시 고려되어야 함을 보여준다. 또한 컨벡스 모델링의 신뢰성과 효율성을 입증하기 위해 몬테카를로 기법에 의한 응력 해석 결과와 비교하였으며, 두 방법에 의한 결과는 잘 일치함을 알 수 있었다.

• 한국재료학회지
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• 제32권10호
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• pp.442-447
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• 2022

Sealing treatment is a post-surface treatment of the plasma spray coating process to improve the corrosion resistance of the coating material. In this study, the effect of the sealing on the corrosion resistance and adhesive strength of the plasma spray-coated alumina coatings was analyzed. For sealing, an epoxy resin was applied to the surface of the coated specimen using a brush. The coated specimen was subjected to a salt spray test for up to 48 hours and microstructural analysis revealed that corrosion in the coating layer/base material interface was suppressed due to the resin sealing. Measurement of the adhesive strength of the specimens subjected to the salt spray test indicated that the adhesive strength of the sealed specimens remained higher than that of the unsealed specimens. In conclusion, the resin sealing treatment for the plasma spray-coated alumina coatings is an effective method for suppressing corrosion in the coating layer/base material interface and maintaining high adhesive strength.

• Composites Research
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• 제33권6호
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• pp.401-407
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• 2020

공학 및 산업 분야에서는 구조적인 부분들에서 경량 복합 소재가 강과 같은 금속 소재를 대체해 오고 있다. 이러한 복합 소재는 리벳, 용접이나 볼트 및 너트를 이용한 체결 방법을 대신하여 접착제 체결 방법을 적용하고 있다. 복합 소재에 접착제 체결 방법을 적용하기 위해서는 접착계면에 대한 강도 특성 연구가 필수적으로 요구된다. 섬유 강화 플라스틱 복합 소재인 CFRP를 용이하게 가공하여 본 연구를 수행하였다. CFRP와 알루미늄(Al6061), 알루미늄 폼(Al-foam)을 가진 이종 복합 소재로 된 경사진 이중외팔보(TDCB) 시험편들로서 면내 전단과 면외 전단의 하중 조건들하에서 정적 실험을 수행하였다. 본 연구 결과를 통하여 이중외팔보들의 파괴 특성과 그 파단 시점을 파악하여 접착계면을 가진 이종 복합 소재 구조물에 관한 내구성을 검토하였다.

• 대한치과보철학회지
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• 제38권5호
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• pp.650-658
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• 2000

This study was investigated to compare the bond strength of polysulfide adhesive between tray resin and border molding materials and to evaluate the effect of saliva contamination on them. We made the 135 resin tray secimens with a dimension of $1{\times}1{\times}1cm$ and divided them into 3 groups by the materials 1) Quicky group, 2) Compound group, and 3) Impregum group Each group was subdivided by saliva contimination. Group S1 : applied adhesive without saliva contamination Group S2 : applied adhesive after drying 15seconds after saliva contamination Group S3 : applied adhesive no after saliva contamination. Tensile tests were performed with a Universal Load testing machine. Results showed Impregum group significantly higher bond strength than Quicky group, but there was no significant difference in adhesive bond strength between Compound group and Quicky group in experimental group by materials In experimental group by saliva contamination, S1 group is significantly higher bond strength than S2 group and S2 group is significantly higher bond strength than S3 group in Quicky group and S1, S2 group is significantly higher bond strength than S3 group in Compound group and Impregum group. Impression compound and Impregum F which are usually used as an individual tray border mold-ing material can be said to be satisfied in adhesive bond strength to polysulfide impression materials. After try-in and clinical adjustment are performed, a custom tray should be properly rinsed and air dried before tray adhesive was placed.

• 보존과학회지
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• 제37권6호
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• pp.801-806
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• 2021

전통 접착 소재인 아교의 사용성과 해초 추출물 카라기난의 겔화 현상을 개선하기 위해 두 재료를 혼합하여 목재 보존용 액상형 접착제를 제조하였으며, 9종의 천연 및 합성 접착제와의 물성 비교를 통해 적용 가능성을 확인하였다. 제조한 목재 접착제는 15 wt% 아교 수용액과 λ-carrageenan, 항균제, 소포제 등을 혼합하였으며, 1.80 Mpa의 최대 접착 강도를 확인하였다. 비교 결과 5종의 전통 천연 접착 성분(수용액)과 Polyvinyl acetate 기반 접착제 1종보다 우수한 접착 강도가 나타났으며, 총호기성생성균수와 유해성(TVOC, HCHO, 중금속) 시험 결과 불검출로 항균성과 안정성을 확인하였다.

• 대한소아치과학회지
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• 제28권2호
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• pp.228-237
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• 2001

본 연구의 목적은 와동 충전시 충전재와 치질 사이에 개재되는 상아질 결합제가, 수복물에서 유리되는 불소가 와동 벽으로 침투하는 과정에 어떠한 영향을 주는지를 조사함이었고, 부가적으로 레진 강화형-글라스 아이오노머 시멘트의 접착에도 상아질 결합제를 도포 하는것이 치질과의 결합력을 강화시킬 수 있는지에 대해 평가하고자 하였다. Fuji II $LC^{(R)}$와 Dyract $AP^{(R)}$를 선정하여 상아질 결합제의 도포 여부에 따른 불소 유리량 측정과 전단 결합 강도를 비교분석하였으며, 치질 내로의 불소 침투 양상은 교환 시기에 있는 제2유구치에 Fuji II $LC^{(R)}$와 Dyract $AP^{(R)}$를 충전하고 3주내에 발거하여 EPMA로 분석하였다. 상아질 결합제는 불소 유리량을 현저하게 감소시키는 것으로 나타났으며(p<0.05) Fuji II $LC^{(R)}$의 경우 상아질 결합제의 도포가 결합강도를 증가시키지 못하였다. EPMA 분석결과 상아질 결합제는 충전재로부터 유리되어 나오는 불소가 치질 내로 확산되는 것을 방해하는 것으로 확인되었다.