• Journal of Pharmaceutical Investigation
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• 제29권2호
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• pp.137-143
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• 1999

Ketoprofen together with various permeation enhancers was incorporated into a novel soft hydrogel which is semi-solid in a container and to form a thin film within a few minutes after applying on the skin. The effect of various enhancers on the skin permeation of ketoprofen from a soft hydrogel was investigated using in vitro and in vivo method. In vitro rat skin permeation of ketoprofen from soft hydrogel was conducted using modified Keshary-Chien diffusion cells. In vivo ketoprofen absorption was also investigated in rats, and the results were compared with that of commercial products. Anti-inflammatory activities were determined using carrageenan-induced paw edema method and adjuvant-induced arthritis method in rats. The anti-inflammatory activity of ketoprofen soft hydrogel formulation with that of commercial products were compared. In vitro as well as in vivo studies showed that $HPE-101^{\circledR}$ was the most effective skin permeation enhancer among those used in this study. Addition of an adhesive (polyisobutylene) in the soft hydrogel decreased skin permeation of ketoprofen. Paw edema and anti-arthritis tests showed that soft hydrogel containing $HPE-101^{\circledR}$ was more effective than the commercial products, which was consistent with the in vivo absorption experiment results.

• 대한전자공학회논문지SD
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• 제45권2호
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• pp.13-20
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• 2008

본 논문에서는 CMOS 이미지 센서의 웨이퍼 레벨 어셈블리를 위한 스페이스 제작 방법을 설명하였다. 스페이스 제작을 위해서 SU-8, PDMS, Si-interposer를 이용하는 세 가지 방법을 제안하였다. SU-8 스페이스에서는 균일한 두께 특성을 위해서 웨이퍼 회전 장치를 고안했으며, PDMS 스페이스에서는 glass/PDMS/glass 구조의 정렬 접합을 위해서 새로운 접합 방법을 제안하였다. Si-interposer를 이용한 스페이스 제작에서는 DRF을 이용한 접합 조건을 확립하였다. 세 가지의 실험 결과 Si-interposer를 이용한 스페이스 제작 시 glass/스페이스/glass 구조의 접합력이 가장 뛰어났으며, 접합력의 크기는 32.3MPa의 전단응력을 나타내었다.

• 대한기계학회논문집 C: 기술과 교육
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• 제1권2호
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• pp.187-192
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• 2013

노즐을 이용한 인쇄 기법은 주로 전자 소자의 봉지를 위한 접착제의 인쇄분야에 적용되어 왔다. 노즐 인쇄를 통한 기능성 물질의 필름 형성은 커다란 도전이 될 수 있다. 본 논문에서는 노즐을 이용한 유기 잉크의 인쇄 특성을 실험을 통하여 알아보았다. 본 연구의 노즐 인쇄 실험에서 패턴을 형성하기 위한 잉크는 유기 발광 물질인 TAPC를 사용하였다. 인쇄된 패턴 폭은 잉크 공급 유량의 증가와 기판의 온도의 상승에 따라 증가하였다. 또한 인쇄된 패턴은 건조 후 커피링 형상을 나타내었다.

• 보존과학회지
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• 제24권
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• pp.43-56
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• 2008

현재 철제유물 강화처리 시 사용하는 아크릴계 수지인 Parabid NAD10은 용제로 VM&P Naphtha만을 사용하고 있다. 그러나 이를 사용하여 강화처리 할 경우 코팅 후의 광택이 높아 전시 및 관람에 불편함을 준다는 문제가 제기되고 있다. 이러한 단점 보완을 위해 대체 용제로 YK-VMP를 선정하여 각 용제별 코팅 특성을 비교 분석하였다. 표면관찰, 박막 두께, 접착력, 접촉각 및 표면에너지, 광택도, 황변실험, EIS 평가 등의 일련의 분석을 통해 용제별 코팅 특성을 비교한 결과, 기존의 VM&P Naphtha를 대신하여 YK-VMP를 사용하여도 강화처리 효과에는 큰 영향을 주지 않으면서도 광택을 더 낮춰주는 효과가 나타나는 것을 확인하였다.

• 반도체디스플레이기술학회지
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• 제16권1호
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• pp.106-111
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• 2017

When a substrate with a pixel-defining layer (bank) is coated, there arises capillary force due to surface tension and adhesive forces between a solvent and the bank layer. It brings in a degradation of film thickness and emission uniformities within pixels. With an attempt to suppress it, we have performed fluid flow simulations of capillary arise by varying the contact angle of bank and the bank structure. We have first demonstrated that the fluid flow model can reproduce the capillary phenomenon that was observed experimentally. It has been found that capillary arise can be suppressed using a hydrophobic material for the bank layer. Furthermore, it was suppressed by tilting the sidewalls outwardly (i.e., using a positive photoresistor). We can obtain very uniform films when the slope is $50^{\circ}$ with the contact angle of $40^{\circ}$.

• 대한전자공학회논문지SD
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• 제40권7호
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• pp.481-485
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• 2003

25㎛ 두께의 폴리이미드 박핀 기판을 glass 기판에 부착하여 최대 온도 150℃에서 비정질 실리콘 TFT를 제작하였다. 본 논문은 plastic 기판 위에 TFT가 제작되는 공정 절차를 요약하고 glass 위에 제작된 TFT와 ON/OFF 전달특성과 전계효과 이동도를 서로 비교해 보았다. a-SiN:H 코팅층은 plastic 기판의 표면 거칠기를 감소시키는 중요한 역할을 하여 TFT의 누설전류를 감소시키고 전계효과 이동도를 증가시켰다. 따라서 a-SiN:H 코팅층을 이용하여 plastic 기판에 양철의 TFT를 제작하였다.

• 한국전기전자재료학회논문지
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• 제31권7호
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• pp.475-480
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• 2018

We investigated the tribological properties of amorphous carbon (a-C) films deposited with CrC interlayers of various thicknesses as the adhesive layer. A-C and CrC thin films were deposited using the unbalanced magnetron (UBM) sputtering method with graphite and chromium as the targets. CrC films as the interlayer were fabricated under a-C films, and various structural, surface, and tribological properties of a-C films deposited with various CrC interlayer thicknesses were investigated. With various CrC interlayer thicknesses under a-C films, the tribological properties of CrC/a-C films were improved; the increased film thickness exhibited a maximum high hardness of over 27.5 GPa, high elastic modulus of over 242 GPa, critical load of 31 N, residual stress of 1.85 GPa, and a smooth surface below 0.09 nm at the condition of 30-nm CrC thickness.

• 한국전기전자재료학회논문지
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• 제17권4호
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• pp.378-383
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• 2004

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten(W) on SiO$_2$ layer, the Ti/TiN barrier layer is usually deposited onto SiO$_2$ for increasing adhesion ability with W film. Generally, for the W-CMP(chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidant on the polishing selectivity of W/Ti/TiN layer was investigated. The alumina(A1$_2$O$_3$)-based slurry with $H_2O$$_2$ as the oxidizer was used for CMP applications. As an experimental result, for the case of 5 wt％ oxidizer added, the removal rates were improved and polishing selectivity of 1.4:1 was obtained. It was also found that the CMP characteristics of W and Ti metal layer including surface roughness were strongly dependent on the amounts of $H_2O$$_2$ oxidizer.

• Journal of Information Display
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• 제6권4호
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• pp.45-48
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• 2005

By applying a critical field treatment instead of the conventional surface treatments such as soft rubber roller, ion beam irradiation, adhesive taping, and laser irradiation, electron emission properties of screen-printed carbon nanotubes (CNTs) were enhanced and investigated based on the emission current-voltage characteristics through scanning electron microscopy. After nanotube emitters were activated at the applied electric-field of 2.5 V/um, the electron emission current density with good uniform emission sites reached the value of 2.13 mA/$cm^2$ , which is 400 times higher than that of the untreated sample, and the turn-on voltage decreased markedly from 700 to 460 V. In addition, enhancement of the alignment of CNTs to the vertical direction was observed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.422-426
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• 2003

Cu thin films of $6000{\AA}$ thickness were deposited by Electron Beam Evaporation(EBE) method on the glass. The resistivity properties and adhesion of Cu thin films were investigated by various annealing and substrate temperature. Cu thin films were annealed in the air and vacuum condition for 10 min after the deposition. The resistivity and adhesion(the force required to separate films from substrates) was measured by 4-point probe and scratch testing. The resistivity of non-annealing Cu thin films was distinguished more substrate temperature loot than substrate temperature R.T, $200^{\circ}C$. In the case of air condition annealing, as heating temperature was increased, the resistivity was decreased. In the case of vacuum condition annealing, the resistivity was increased at heating temperature $200^{\circ}C$. The best resistivity($1.72\;{\mu}{\Omega}{\cdot}cm$) of Cu thin films was obtained by the air condition heating temperature $200^{\circ}C$ at the substrate heating temperature $100^{\circ}C$. As a result of scratch testing, adhesion was increased by annealing. And maximum adhesion had 600 gf.