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A study on forming a spacer for wafer-level CIS(CMOS Image Sensor) assembly  

Kim, Il-Hwan (School of Electrical Engineering and Computer Science, Seoul National University)
Na, Kyoung-Hwan (School of Electrical Engineering and Computer Science, Seoul National University)
Kim, Hyeon-Cheol (School of Electrical Engineering and Computer Science, Seoul National University)
Chun, Kuk-Jin (School of Electrical Engineering and Computer Science, Seoul National University)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.45, no.2, 2008 , pp. 13-20 More about this Journal
Abstract
This paper describes the methods of spacer-fabrication for wafer-level CIS(CMOS Image Sensor) assembly. We propose three methods using SU-8, PDMS and Si-interposer for the spacer-fabrication. For SU-8 spacer, novel wafer rotating system is developed and for PDMS(poly-dimethyl siloxane) spacer, new fabrication-method is used to bond with alignment of glass/PDMS/glass structure. And for Si-interposer, DFR(Dry Film Resist) is used as adhesive layer. The spacer using Si-interposer has the strongest bonding strength and the strength is 32.3MPa with shear.
Keywords
spacer; CIS; SU-8; PDMS; DFR;
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1 C. T. Pan and P. J. Cheng, "Intermediate wafer level bonding and interface behavior", Microelectronics Reliablility, Vol. 45, pp. 657-663, 2005   DOI   ScienceOn
2 B. Bilenberg and T. Nielsen, "PMMA to SU-8 bonding for polymer based lab-on-a-chip systems with integrated optics", Journal of Micromechanics and Microengineering, Vol. 14, pp. 814-818, 2004   DOI   ScienceOn
3 Sumitomo Bakelite Co. Ltd., "CMOS image sensor/New Low Cost Production process/Dam on Glass & Dam on Wafer", 2006
4 E. H. Conradie and D. F. Moore, "SU-8 thick photoresist processing as a functional material for MEMS applications", Journal of Micromechanics and Microengineering, Vol. 12, pp. 368-374, 2002   DOI   ScienceOn