• 한국표면공학회지
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• 제35권3호
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• pp.165-171
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• 2002

TiN coating were deposited onto different WC-Co substrates using arc ion plating (AIP) technique. The structure and morphology for the deposited coating were characterized by x-ray diffraction (XRD) and scanning electron microscopy (SEM). The adhesion behavior of the deposited TiN coating was investigated with a conventional scratch test. Effects of WC particle size and Co content on the adhesion strength between the deposited TiN coating and substrate were studied. During the scratch test, the value of critical load was dependent of WC particle size and Co content on substrate. As the WC particle size and Co content on substrate decreased, the critical load increased. The highest critical load, approximately 110N, was obtained at WC particle size of 1$\mu\textrm{m}$ and Co content of 10wt.%.

• 한국표면공학회지
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• 제49권6호
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• pp.575-579
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• 2016

The metal mesh films with thickness of 1.0, 1.5, $2.0{\mu}m$ were prepared by photolithography using Ag, Al, and Cu metals. Every metal films were showed C(111) preferred orientation and Ag showed the lowest resistivity and followed by Al and Cu. The transmittance of almost films were higher than 90%. But, the Ag film with thickness of $2.0{\mu}m$ was delaminated during photolithography process due to low adhesion. So, Cu and Ti metal films were introduced under Ag film to improve adhesion property. The Cu film showed higher adhesion properties compared to Ti film. Furthermore, the Ti films that deposited on Ag film showed higher acid resistance.

• Elastomers and Composites
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• 제50권4호
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• pp.304-313
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• 2015

In this study, the anionic emulsified asphalt was prepared by dispersing asphalt particles evenly into water with combination of anionic and nonionic surfactants. Effects of NaOH and $CaCl_2$ on the phase stability of the emulsified asphalt were also investigated through zeta potential value and rheology behavior; the emulsified asphalt added with NaOH and $CaCl_2$ showed higher zeta potential value than that the asphalt with addition of only anionic and nonionic surfactants. In addition, with regard to shear thinning behaviors, it was found that pH of the emulsified anionic asphalt and $Ca^{2+}$, counter ion, affected the phase stability. SBR (styrene-butadiene-rubber) latex, EPD (water dispersed Epoxy), PU (polyurethane) and RI-10S, SBS (styrene-butadiene-styrene)-based property improvement additive, were used and studied to enhance the adhesion properties with the aggregates. RI-10S, however, was found to be only compatible with the anionic emulsified asphalt; the coating rate, adhesion and compression strength were increased with the RI-10S content.

• 로봇학회논문지
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• 제17권3호
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• pp.282-287
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• 2022

High shear adhesion on wet and rough surfaces and tactile feedback of gripping forces are highly important for realizing robotic gripper systems. Here, we propose a bioinspired robotic gripper with highly shear adhesion and sensitive pressure sensor for tactile feedback systems. To achieve them, we fabricated multi-walled carbon nanotube sensing layer on a thin polymeric adhesive layer of polydimethylsiloxane. With densely hexagonal-packed microstructures, the pressure sensor achieved 9 times the sensing property of a sensor without microstructures. We then assembled hexagonal microstructures inspired by the toe pads of a tree frog, giving strong shear adhesion under both dry and wet surfaces such as silicon (42 kPa for dry and ~30 kPa for underwater conditions) without chemical-residues after detachment. Our robotic gripper can prevent damage to weak or smooth surfaces that can be damaged at low pressure through pressure signal feedback suggesting a variety of robotic applications.

• 펄프종이기술
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• 제38권2호
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• pp.43-51
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• 2006

Starch is widely used as an adhesive material in the paper and corrugated board industry. The adhesion problem of corrugated board is categorized by two main parts called zipper board and white glue line. The object of this research is to investigate the factors affecting the adhesion problem by the gelatinization of various starch solutions and dynamic penetration properties measurements of various commercial base paper and handsheets. Flow property of starch solution is affected by sodium hydroxide addition and reaction level. Absorption property of commercial base papers and handsheets is affected by sizing and stock composition. Optimum bonding between top/bottom liners and corrugated medium is accomplished by acceptable flow viscosity of mixed starch solution and proper adsorption characteristic of base paper.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.83-86
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• 2005

In this study, SAM (self-assembled monolayer) was applied as an anti-adhesion layer in the nano molding process, to reduce the surface energy between the nano-stamper and the moldeded polymeric nano patterns. Before depositing SAM on the stamper, the nickel stamper was pretreated to remove oxide on the nickel stamper surface. Then, using the solution deposition method, alkanethiol SAM as an anti-adhesion layer was deposited on nickel surface. To examine the effectiveness of the SAM deposition on the metallic nano stamper, the contact angle and the lateral friction force were measured at the actual processing temperature and pressure for the case of nano compression molding and at the actual UV dose for the case of nano UV molding. The surface energy due to SAM deposition on the nickel nano stamper markedly decreased and the high hydrophobic quality of SAM on the nickel stamper maintained under the actual molding environments.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2004년도 제23회 추계학술대회 논문집
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• pp.215-222
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• 2004

본 논문에서는 고분자의 바인더와 고체불질 사이의 결합력을 증진시켜 물성을 향상시키는 역할과 화학결합에 의한 두 재질간의 접착력을 향상시킬 목적으로 사용되는 Aziridine계 bonding agent를 합성하여 이화학 특성을 분석하고 이를 라이너에 적용하였을 때 불성 및 접착력 특성에 관한 연구를 하였다. 비교 실험을 진행하기 위해 미국 3M사에서 제조한 HX-868을 통일한 조건에서 사용했고 미국규격에 규정된 항목과 각 항목에 대한 표준화된 방법으로 분석하였다. 그 결과 국내기술로 합성한 HX-868이 미국에서 제조된 HX-868과 통일한 품질 수준으로 갖는 것으로 평가되었다.

• 접착 및 계면
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• 제10권2호
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• pp.84-89
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• 2009

The objective of this research was to investigate the curing behavior and adhesion performance of urea-melamine-formaldehyde (UMF) resin for the four types of UMF-1, UMF-2, UMF-3, and UMF-4 which synthesized by the staged addition of melamine. Also, various network structures of these resin types were discussed based on their different curing behavior and adhesion performance. The curing behavior was evaluated by DMTA and thermal stability was checked by TGA. Adhesion performance was evaluated by dry and wet shear strengths and the pH value of each cured resin was checked to see its effect on the adhesion performance. The results indicated that the UMF-1 resin type by the addition of melamine initially with the urea and formaldehyde at the same F/(U+M) rate showed the lowest thermal stability, rigidity (${\Delta}E^{\prime}$), temperature of tan ${\delta}$ maximum ($T_{tan}\;_{\delta}$), and wet shear strength, and pH value of cured resin. In wet shear strength, however, the UMF-4 resin type appears to be slightly higher than UMF-1 resin type.

• 접착 및 계면
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• 제15권3호
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• pp.109-115
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• 2014

본 연구에서는 내부에 이소시아네이트를 포함하는 microcapsule을 합성하였으며, 제조된 microcapsule에 대한 분석 및 폴리우레탄 수지와 병용했을 때의 기계적 물성과 접착특성에 대해서 고찰하였다. 전자현미경을 사용해서 합성된 microcapsule이 구형의 외관을 갖는 것을 확인하였으며, FT-IR과 TGA 분석을 통해서 microcapsule의 core 물질이 IPDI인 것과 각 구성요소들의 성분비를 확인하였다. 폴리우레탄 수지 자체 및 microcapsule을 포함한 경우의 접착력 및 물성을 평가한 결과 접착수지 내에 포함된 microcapsule 내 IPDI의 가교반응에 의해서 폴리우레탄 수지 자체에 비해 접착력, 인장강도, 내마모 특성이 크게 향상되는 것을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 방전 플라즈마 유기절연재료 초전도 자성체연구회
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• pp.11-14
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and AFM. Adhesion was obtained from T-peel tests of semiconductive layer having different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the the creation of O-H and C=O. It is observed that adhesion performance was determined by not surface energy but roughness level of silicone surface. It is found that ac dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.