References
- J. E. Sundgren and H.T.G. Hentzell : J. Vac.Sci. Technol., A4 (1986) 2259
- T. Cselle, A. Barimani : Surf. Coat. Technol.,76-77 (1995) 712 https://doi.org/10.1016/0257-8972(96)80011-9
- T. Nsongo, M. Gillet : Int. J. Adhesion Adhe-sives., 15 (1995) 191 https://doi.org/10.1016/0143-7496(95)91631-F
- Sangeeta Srivastav, Amitabh Jain, D. Kanjila-1 : Nucl. Instr. Meth. Phys. Res., B 101 (1995)400 https://doi.org/10.1016/0168-583X(95)00497-1
- P. Richard, J. Thomas, D. Landolt, G. Gremaud : Surf. Coat. Technol, 91 (1997) 83 https://doi.org/10.1016/S0257-8972(96)03179-9
- H. Ollendorf, D. Schneider : Surf. Coat. Te-chnol., 113 (1999) 86 https://doi.org/10.1016/S0257-8972(98)00827-5
- Naoto Kuratani, Yasuo Murakami, OsamuImai, Kiyoshi Ogata : Mater. Chem. Phys., 54(1998) 313 https://doi.org/10.1016/S0254-0584(98)00069-8
- Emmanuelle Harry, Andre Rouzaud, PierreJuliet, Yves Pauleau : Thin Solid Films., 342(1999) 207 https://doi.org/10.1016/S0040-6090(98)01499-0
- N. J. M. Carvalho, A. J. Huis in't Veld and J.Th. De Hosson : Surf. Coat. Technol., 105(1998) 109 https://doi.org/10.1016/S0257-8972(98)00466-6
- S. Ma, K. Xu and J. He : Surf. Coat. Technol,142-144 (2001) 1023 https://doi.org/10.1016/S0257-8972(01)01188-4
- M. Sakaki, T. Sakakibara : IEEE Trans. Plasma Sci., 22 (1994) 1049 https://doi.org/10.1109/27.370251
- Anthony J. Perry, James R. Treglio, Albert F.Tian : Surf. Coat. Technol., 76-77 (1995) 815 https://doi.org/10.1016/0257-8972(95)02628-2
- G.H. Kang, H. Uchida, E.S. Koh : Surf. Coat Technol., 86-87 (1996) 421 https://doi.org/10.1016/S0257-8972(96)02980-5
- M. I. Jones, I. R. McColl, D. M. Grant, Surf Coat. Technol., 132 (2000) 143
- P.A. Steinmann and H.E. Hmtermann : J Vac.Sci.Technol.,A7(3) (1989) 2267
- A. Kelly and N.H. MacMillan : 'Strong Solids,' 3rd. edn., Clarendon, Oxford (1986)
- H. Engqvist, S. Jacobson, N. Axen : Wear.,9023 (2001) 1
- L. Makhele-Lekala, S. Luyckx, F.R.N. Naba-rro : Int. J. Refractory Met. Hard Mater., 19(2001) 245 https://doi.org/10.1016/S0263-4368(01)00022-1
- Binghai Liu, Yue Zhang, Shixi OuyangMater. Chem. Phys., 62 (2000) 35 https://doi.org/10.1016/S0254-0584(99)00152-2