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Thin Metal Meshes for Touch Screen Panel Prepared by Photolithography

포토리소그래피 공정으로 제작된 터치스크린패널용 금속메시

  • Kim, Seo-Han (Department of Materials Science and Engineering, Pusan National University) ;
  • Song, Pung-Keun (Department of Materials Science and Engineering, Pusan National University)
  • Received : 2016.12.23
  • Accepted : 2016.12.30
  • Published : 2016.12.31

Abstract

The metal mesh films with thickness of 1.0, 1.5, $2.0{\mu}m$ were prepared by photolithography using Ag, Al, and Cu metals. Every metal films were showed C(111) preferred orientation and Ag showed the lowest resistivity and followed by Al and Cu. The transmittance of almost films were higher than 90%. But, the Ag film with thickness of $2.0{\mu}m$ was delaminated during photolithography process due to low adhesion. So, Cu and Ti metal films were introduced under Ag film to improve adhesion property. The Cu film showed higher adhesion properties compared to Ti film. Furthermore, the Ti films that deposited on Ag film showed higher acid resistance.

Keywords

References

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