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http://dx.doi.org/10.17702/jai.2014.15.3.109

Study on Adhesion and Mechanical Properties of Adhesive Resin Using Microcapsule with Isocyanate Compound  

Kim, Dong Ho (Korea Institute of Footwear & Leather Technology)
Kim, Gu Ni (Korea Institute of Footwear & Leather Technology)
Publication Information
Journal of Adhesion and Interface / v.15, no.3, 2014 , pp. 109-115 More about this Journal
Abstract
In this study, we synthesized and identified microcapsule containing isocyanate, and investigated the mechanical and adhesion properties of polyurethane resin by adding microcapsule. We found out that the core material of microcapsule and the component weight fraction of microcapsule from the FT-IR and TGA analysis. From the results of adhesion and mechanical property tests, we confirmed that in case of using microcapsule for adhesive resin composition, adhesion strength, tensile strength and abrasion were improved by cross-linking reaction between urethane and IPDI in microcapsule.
Keywords
microcapsule; interfacial polymerization; polyurethane shell; core material;
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1 R. C. Brown, J. D. Rasberry, and S. P. Overmann, Powder Technol., 98, 217 (1998).   DOI   ScienceOn
2 I. S. Sim, J. W. Kim, H. J. Choi, and M. S. Jhon, Chem. Mater., 13, 1243 (2001).   DOI   ScienceOn
3 Y. H. Lee, C. A. Kim, W. H. Jang, and M. S. Jhon, Polymer, 42, 8277 (2001).   DOI   ScienceOn
4 S. Y. Kim and Y. M. Lee, J. Ind. Eng. Chem., 5, 306 (1999).
5 J. Matsumoto, Y. Nakada, K. Sakurai, T. Nakamura, and Y. Takahashi, Int. J. Pharm., 185, 93 (1999).   DOI   ScienceOn
6 I. Genta, P. Perugini, F. Pavanetto, K. Maculotti, T. Modena, B. Casado, A. Lupi, P. Iadarola, and B. Conti, J. Control. Release, 77, 287 (2001).   DOI   ScienceOn
7 H. S. Tan, T. H. Ng, and H. K. Mahabadi, J. Microencapulation, 8, 525 (1991).   DOI
8 A. R. Kulkarni, K. S. Soppimath, and T. M. Aminabhavi, Journal of microencapsulation, 17, 449 (2000).   DOI
9 H. Y. Lee, S. J. Lee, I. W. Cheong, and J. H. Kim, Journal of microencapsulation, 19(5), 559 (2002).   DOI
10 M. J. Hsu, B. J. Chen, C. Y. Chen, and W. F. Lu, inProc. 4th Asian Textile Conference, E20 (1997).
11 A. Lamprecht, U. Schafer, and C. M. Lehr, Journal of microencapsulation, 18(3), 347 (2001).   DOI
12 Cornelus G. De Kruif, Fanny Weinbreck, and Genko De Vries, Current opinion in colloid and interface science, 9, 340 (2004).   DOI   ScienceOn
13 R. Bodmeier and J. W. McGinity, Int. J. Pharm., 43, 179 (1988).   DOI   ScienceOn
14 R. Arshady, J. Control. Release, 17, 1 (1991).   DOI   ScienceOn
15 J. Yang, T. S. Chung, and N. N. Ping, Biomaterials, 22, 231 (2001).   DOI   ScienceOn
16 Y. Jinglei, W. M. W. Keller, J. S. Moore, S. R. White and N. R. Sottos, Macromolecules, 41, 9650, (2008).   DOI   ScienceOn
17 R. Arshady, J. Control. Release, 14, 111, (1990).   DOI   ScienceOn
18 S. J. Park, Y. S. Shin, and J. R. Lee, J. Colloid Interface Sci., 241, 502 (2001).   DOI   ScienceOn
19 C. L. Chang and H. S. Fogler, Langmuir, 13, 3295 (1997).   DOI   ScienceOn
20 F. L. Jin and S. J. Park, J. Ind. Eng. Chem., 13, 608 (2007).
21 A. Dalpiaz, A. Scatturin, B. Pavan, C. Biondi, M. A. Vandelli, and F. Forni, J. Control. Release, 73, 303 (2001).   DOI   ScienceOn
22 P. Caliceti, F. M. Veronese, and S. Lora, Int. J. Pharm., 211, 57 (2000).   DOI   ScienceOn