• Transactions on Electrical and Electronic Materials
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• v.7 no.2
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• pp.62-66
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• 2006

Advanced CMP conditioner design requires investigations of key conditioner manufacturing parameters and their effects on pad surface and then wafer performance. In the present investigation, diamond shape, concentration, distribution, and other key manufacturing parameters are considered to improve CMP process stability and conditioner life. Self avoiding random distribution ($SARD^{TM}$) of diamond abrasives has been developed and both numerical simulation and experimental results show very stable and reliable polishing performance.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.206-209
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• 2002

The fixed abrasive pad(FAP) has been introduced in chemical mechanical polishing(CMP) field recently. In comparison with the general CMP which uses the slurry including abrasives, FAP takes advantage of planarity. resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of $Al_2$O$_3$-FAP using hydrophilic polymers with swelling characteristic in water and explains the self.texturing phenomenon. It also focuses on the chemical effects on tungsten film and the FAP is evaluated on the removal rate as a function of chemicals such as oxidizer, catalyst, and acid. The removal rate is achieved up to 1000A1min as about 70 percents of the general one. In the future. the research has a plan of the advanced FAP and chemicals in tungsten CMP considering micro-scratch, life-time, and within wafer non-uniformity.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.231-234
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• 2002

Ultrasonic machining technology has been developed over recent years for the manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile. Ultrasonic machining process is an efficient and economical means of precision machining of ceramic materials. The process is non-thermal, non-chemical and non-electric and hardly creates changes to the mechanical properties of the brittle materials machined. This paper describes the characteristics of the micro-hole of $\textrm{Al}_2\textrm{O}_3$ by ultrasonic machining with tungsten carbide tool. The effects of various parameters of ultrasonic machining, including abrasives, machining force and pressure, on the material removal rate, hole quality, and tool wear presented and discussed. The ultrasonic Machining of micro-holes in ceramics has been under taken and the machining mechanism in the ultrasonic machining of ceramics based on the fracture-mechanics concept has been analyzed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.227-230
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• 2002

New polishing technique for small parts has been tried out using the principle of particle electromechanics. Common fine abrasives such as alumina, diamond, silicon carbide are dielectric materials which are polarized under an electric field, and a non-uniform electric field makes abrasive particles translate along the field line. Using this principle, We make abrasive particles aggregate in the vicinity of the micro tool which is fir the surface finishing of a small part without contact with it. The behavior of particles is optically measured, and the machined depth of glass is examined.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1267-1268
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry (MAS). In order to save the costs of slurry, the original silica slurry was diluted by do-ionized water (DIW). And then, $ZrO_2,CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1271-1272
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• 2006

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40%. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

• Special Issue of the Society of Naval Architects of Korea
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• 2005.06a
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• pp.198-205
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• 2005

Reduction of labor hour for cleaning up of the used abrasives after blasting. is attempted by improving the efficiency of abrasive recovery process in the protective coating of ship's block, For this purpose, the theoretical background for pneumatic transport technology in the abrasive recovery system as well as experimental evaluation on the effect of design parameters such as flow pattern, saltation velocity and pressure drop on the efficiency of the abrasive recovery system are employed . By optimizing the operating parameters such as the length and diameter of the suction hose, specification of recovery device and recovery mouth, a new method which can dramatically increase the efficiency of abrasive recovery system, is proposed.

• Journal of the Semiconductor & Display Technology
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• v.3 no.1
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• pp.15-20
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• 2004

Through shallow trench isolation (STI) chemical mechanical polishing (CMP) tests, we investigated the dependence of pad surface temperature on the abrasive and additive concentrations in ceria slurry under varying pressure using blanket film wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surfaces during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increasing the additive concentration. This difference in temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, meaning the higher friction coefficient.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.85-86
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• 2006

Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables arc relatively high because of expensive slurry. In this paper, in order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, abrasives were added in the diluted silica slurry (DSS) in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry (MAS) for the oxide CMP application.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.22-28
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• 2009

In order to optimize the polishing process, Run to Run control scheme has been applied to the micro mold polishing in this study. Also, to fully understand the effect of parameters on the surface roughness a design of experiment is performed. By linear approximation of main factors such as gap and rotational speed of micro quill, EWMA (Exponential Weighted Moving Average) gradual mode controller is adopted as a optimizing tool. Consequently, the process converged quickly at a target value of surface roughness Ra 10nm and Rmax 50nm, and was hardly affected by unwanted process noises like initial surface quality and wear of magnetic abrasives.