Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2006.10a
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- Pages.85-86
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- 2006
A Study on the Oxide CMP Characteristics using $ZrO_2$ -Diluted Silica Slurry($ZrO_2$ -DSS)
$ZrO_2$ - DSS의 CMP 특성에 관한 연구
- Lee, Sung-Il (Daebul University) ;
- Park, Sung-Woo (Daebul University) ;
- Lee, Woo-Sun (Chosun University) ;
- Seo, Yong-Jin (Daebul University)
- Published : 2006.10.27
Abstract
Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables arc relatively high because of expensive slurry. In this paper, in order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then,
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