1 |
L. Borucki, 'Mathematical modeling of polish-rate decay in chemical-mechanical polishing', J. of Eng. Math., Vol. 43, p. 105, 2003
|
2 |
A. S. Lawing, 'Pad conditioning and pad surface characterization in oxide chemical mechanical polishing', MRS Proceedings, 2002
|
3 |
J. C. Angus, 'History and current status of diamond growth at metastable conditions', Proceedings of the First International Symposium on Diamond and Diamond-like Films, p. 1, 1989
|
4 |
T. W. Hwang, C. J. Evans, and S. Malkin 'High speed grinding of silicon nitride with electroplated diamond wheels, Part 2: Wheel topography and grinding mechanisms', ASME J. of Manuf. Sci. and Eng., Vol. 122, p. 42, 2000
DOI
ScienceOn
|
5 |
T. W. Hwang, G. Baldoni, A. Tanikella, and T. Puthanangady, 'Innovations in abrasives technology for electronic applications', Center for Advanced Material Proceeding (CAMP) CMP Symposium, Lake Placid, N.Y., 2004
|
6 |
A. S. Lawing, 'Polish rate, pad surface morphology and pad conditioning in oxide chemical mechanical polishing', The Electrochemical Soc. Proc., Vol. PV 2002-1, p. 46, 2002
|
7 |
T. W. Hwang, G. Baldoni, R. Hall, A. Tanikella, and T. Puthanangady, 'Advances in CMP pad conditioner design', Center for Advanced Material Proceeding (CAMP) CMP Symposium, Lake Placid, N.Y., 2005
|