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http://dx.doi.org/10.4313/TEEM.2006.7.2.062

Advanced Pad Conditioner Design for Oxide/Metal CMP  

Hwang Tae-Wook (Saint-Gobain High Performance Materials)
Baldoni Gary (Saint-Gobain High Performance Materials)
Tanikella Anand (Saint-Gobain High Performance Materials)
Puthanangady Thomas (Saint-Gobain High Performance Materials)
Publication Information
Transactions on Electrical and Electronic Materials / v.7, no.2, 2006 , pp. 62-66 More about this Journal
Abstract
Advanced CMP conditioner design requires investigations of key conditioner manufacturing parameters and their effects on pad surface and then wafer performance. In the present investigation, diamond shape, concentration, distribution, and other key manufacturing parameters are considered to improve CMP process stability and conditioner life. Self avoiding random distribution ($SARD^{TM}$) of diamond abrasives has been developed and both numerical simulation and experimental results show very stable and reliable polishing performance.
Keywords
CMP; Conditioner; Oxide; Metal; Cu;
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