Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2006.07b
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- Pages.1267-1268
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- 2006
A Study on the Oxide CMP Characteristics of using Mixed Abrasive Slurry(MAS)
혼합 연마제 슬러리를 이용한 Oxide CMP 특성에 관한 연구
- Lee, Sung-Il (Daebul Univ.) ;
- Park, Sung-Woo (Daebul Univ.) ;
- Lee, Woo-Sun (ChoSun Univ.) ;
- Seo, Yong-Jin (Daebul Univ.)
- Published : 2006.07.12
Abstract
Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry (MAS). In order to save the costs of slurry, the original silica slurry was diluted by do-ionized water (DIW). And then,
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