Transactions on Electrical and Electronic Materials

  • 제7권2호
  • /
  • Pages.62-66
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  • 2006
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  • 1229-7607(pISSN)
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  • 2092-7592(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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Advanced Pad Conditioner Design for Oxide/Metal CMP

  • 발행 : 2006.04.01
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초록

Advanced CMP conditioner design requires investigations of key conditioner manufacturing parameters and their effects on pad surface and then wafer performance. In the present investigation, diamond shape, concentration, distribution, and other key manufacturing parameters are considered to improve CMP process stability and conditioner life. Self avoiding random distribution ($SARD^{TM}$) of diamond abrasives has been developed and both numerical simulation and experimental results show very stable and reliable polishing performance.

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참고문헌

  1. T. W. Hwang, G. Baldoni, A. Tanikella, and T. Puthanangady, 'Innovations in abrasives technology for electronic applications', Center for Advanced Material Proceeding (CAMP) CMP Symposium, Lake Placid, N.Y., 2004
  2. A. S. Lawing, 'Polish rate, pad surface morphology and pad conditioning in oxide chemical mechanical polishing', The Electrochemical Soc. Proc., Vol. PV 2002-1, p. 46, 2002
  3. L. Borucki, 'Mathematical modeling of polish-rate decay in chemical-mechanical polishing', J. of Eng. Math., Vol. 43, p. 105, 2003
  4. A. S. Lawing, 'Pad conditioning and pad surface characterization in oxide chemical mechanical polishing', MRS Proceedings, 2002
  5. T. W. Hwang, G. Baldoni, R. Hall, A. Tanikella, and T. Puthanangady, 'Advances in CMP pad conditioner design', Center for Advanced Material Proceeding (CAMP) CMP Symposium, Lake Placid, N.Y., 2005
  6. J. C. Angus, 'History and current status of diamond growth at metastable conditions', Proceedings of the First International Symposium on Diamond and Diamond-like Films, p. 1, 1989
  7. T. W. Hwang, C. J. Evans, and S. Malkin 'High speed grinding of silicon nitride with electroplated diamond wheels, Part 2: Wheel topography and grinding mechanisms', ASME J. of Manuf. Sci. and Eng., Vol. 122, p. 42, 2000 https://doi.org/10.1115/1.538909