Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2002.10a
- /
- Pages.206-209
- /
- 2002
- /
- 2005-8446(pISSN)
Evaluation on Tungsten CMP Characteristic using Fixed Abrasive Pad with Alumina
알루미나 고정입자패드를 이용한 텅스텐 CMP 특성 평가
Abstract
The fixed abrasive pad(FAP) has been introduced in chemical mechanical polishing(CMP) field recently. In comparison with the general CMP which uses the slurry including abrasives, FAP takes advantage of planarity. resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of
Keywords