• 제목/요약/키워드: ALD Co

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원자층 증착법을 이용한 고 단차 Co 박막 증착 및 실리사이드 공정 연구

  • 송정규;박주상;이한보람;윤재홍;김형준
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.83-83
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    • 2012
  • 금속 실리사이드는 낮은 비저항, 실리콘과의 좋은 호환성 등으로 배선 contact 물질로 널리 연구되고 있다. 특히 $CoSi_2$는 선폭의 축소와 관계없이 일정하고 낮은 비저항과 열적 안정성이 우수한 특성 등으로 배선 contact 물질로 활발히 연구되고 있다. 금속 실리사이드를 실리콘 평면기판에 형성시키는 방법으로는 열처리를 통한 금속박막과 실리콘 기판 사이에 확산작용을 이용한 SALICIDE (self-algined silicide) 기술이 대표적이며 CoSi2도 이와 같은 방법으로 형성할 수 있다. Co 박막을 증착하는 방법에는 물리적 기상증착법 (PVD)과 유기금속 화학 증착법 등이 보고되어있지만 최근 급격하게 진행 중인 소자구조의 나노화 및 고 단차화에 따라 기존의 증착 기술은 낮은 단차 피복성으로 인하여 한계에 부딪힐 것으로 예상되고 있다. ALD(atomic layer deposition)는 뛰어난 단차 피복성을 가지고 원자단위 두께조절이 용이하여 나노 영역에서의 증착 방법으로 지대한 관심을 받고 있다. 앞선 연구에서 본 연구진은 CoCp2 전구체과 $NH_3$ plasma를 사용하여 Plasma enhanced ALD (PE-ALD)를 이용한 고 순도 저 저항 Co 박막 증착 공정을 개발 하고 이를 SALICIDE 공정에 적용하여 $CoSi_2$ 형성 연구를 보고한 바 있다. 하지만 이 연구에서 PE-ALD Co 박막은 플라즈마 고유의 성질로 인하여 단차 피복성의 한계를 보였다. 이번 연구에서 본 연구진은 Co(AMD)2 전구체와 $NH_3$, $H_2$, $NH_3$ plasma를 반응 기체로 사용하여 Thermal ALD(Th-ALD) Co 및 PE-ALD Co 박막을 증착 하였다. 고 단차 Co 박막의 증착을 위하여 Th-ALD 공정에 초점을 맞추어 Co 박막의 특성을 분석하였으며, Th-ALD 및 PE-ALD 공정으로 증착된 Co 박막의 단차를 비교하였다. 연구 결과 Th-ALD Co 박막은 95% 이상의 높은 단차 피복성을 가져 PE-ALD Co 박막의 단차 피복성에 비해 크게 향상되었음을 확인하였다. 추가적으로, Th-ALD Co 박막에 고 단차 박막의 증착이 가능한 Th-ALD Ru을 capping layer로 이용하여 CoSi2 형성을 확인하였고, 기존의 PVD Ti capping layer와 비교하였다. 이번 연구에서 Co 박막 및 $CoSi_2$ 의 특성 분석을 위하여 X선 반사율 분석법 (XRR), X선 광전자 분광법 (XPS), X선 회절 분석법 (XRD), 주사 전자 현미경 (SEM), 주사 투과 전자 현미경 (STEM) 등을 사용하였다.

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PEALD 장치 제작 및 Co박막 증착 (Construction of a PEALD System and Fabrication of Cobalt Thin Films)

  • 이두형;노승정
    • 한국진공학회지
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    • 제16권2호
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    • pp.110-115
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    • 2007
  • Atomic layer deposition(ALD)에 유도결합 플라즈마 소스를 채용하여 plasma enhanced ALD(PEALD)장치를 제작하고 플라즈마 발생 실험을 수행하였다. ALD와 PEALD를 이용하여 기판온도 $230^{\circ}C$에서 p-type Si(100)기판 위에 Co박막을 증착하였다. 이때, $Co_{2}(CO)_{6}$을 Co전구체로, 암모니아를 반응가스로, 아르곤을 캐리어(carrier) 및 퍼지(purge)가스로 사용하였다. 증착된 Co박막의 구성성분과 박막의 두께를 auger electron spectroscopy(AES)와 field emission scanning electron microscopy(FESEM)을 이용하여 분석하였다. ALD와 PEALD를 이용하여 증착된 Co박막에서 모두 불순물이 발견되었는데, PEALD의 경우 ALD에 비해 불순물의 양이 약 반으로 감소되었다. 암모니아 플라즈마가 Co전구체에 포함된 탄소와의 반응을 매우 효과적으로 유도하는 것으로 확인되었다.

Enhanced Stability of LiCoO2 Cathodes in Lithium-ion Batteries Using Surface Modification by Atomic Layer Deposition

  • Jung, Yoon-S.;Cavanagh, Andrew S.;Dillon, Anne C.;Groner, Markus D.;George, Steven M.;Lee, Se-Hee
    • 한국세라믹학회지
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    • 제47권1호
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    • pp.61-65
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    • 2010
  • Ultrathin atomic layer deposition (ALD) coatings were found to enhance the performance of lithium-ion batteries (LIBs). Previous studies have demonstrated that $LiCoO_2$ cathode powders coated with metal oxides with thicknesses of $\sim100-1000{\AA}$ grown using wet chemical techniques improved LIB performance. In this study, $LiCoO_2$ powders were coated with conformal $Al_2O_3$ ALD films with thicknesses of only $\sim3-4{\AA}$ established using 2 ALD cycles. The coated $LiCoO_2$ powders exhibited a capacity retention of 89% after 120 charge-discharge cycles in the 3.3~4.5 V (vs. $Li/Li^+$) range. In contrast, the bare $LiCoO_2$ powders displayed only a 45% capacity retention. This dramatic improvement may result from the ultrathin $Al_2O_3$ ALD film acting to minimize Co dissolution or to reduce surface electrolyte reactions.

Low Temperature Plasma-Enhanced Atomic Layer Deposition Cobalt

  • 김재민;김형준
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2009년도 추계학술발표대회
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    • pp.28.2-28.2
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    • 2009
  • Cobalt thin film was fabricated by a novel NH3-based plasma-enhanced atomic layer deposition(PE-ALD) using Co(CpAMD) precursor and $NH_3$ plasma. The PE-ALD Co thin films were produced well on both thermally grown oxide (100 nm) $SiO_2$ and Si(001) substrates. Chemical bonding states and compositions of PE-ALD Co films were analyzed by XPS and discussed in terms of resistivity and impurity level. Especially, we successfully developed PE-ALD Code position at very low growth temperature condition as low as $T_s=100^{\circ}C$, which enabled the fabrication of Co patterns through lift-off method after the deposition on PR patterned substrate without any thermal degradation.

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ALD 장비의 Al2O3 공정 안정화를 위한 저온 트랩 장치의 특성 평가 (Characterizations of a Cold Trap System for the Process Stabilization of Al2O3 by ALD Equipment)

  • 서용혁;이원우;김인환;한지은;이연주;조재효;전용민;조의식;권상직
    • 반도체디스플레이기술학회지
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    • 제23권1호
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    • pp.92-96
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    • 2024
  • The application of the technology for forming Al2O3 thin films using ALD(atomic layer deposition) method is rapidly increasing in the semiconductor and display fields. In order to increase the efficiency of the ALD process in a mass production line, metallic by-products generated from the ALD process chamber must be effectively collected. By collecting by-products flowing out of the chamber with a cold trap device before they go to the vacuum pump, damage to the vacuum pump can be prevented and the work room can be maintained stably, resulting in increased process flow rate. In this study, a cold trap was installed between the ALD process chamber and the dry pump to measure and analyze by-products generated during the Al2O3 thin film deposition process. As a result, it was confirmed that Al and O elements were discharged, and the collection forms were two types: bulk and powder. And the binding energy peaked at 73.7 ~ 74.3 eV, the binding energy of Al 2p, and 530.7 eV, the binding energy of O 1s, indicating that the binding structure was Al-O.

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Atomic Layer Deposition for Energy Devices and Environmental Catalysts

  • Kim, Young Dok
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.77.2-77.2
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    • 2013
  • In this talk, I will briefly review recent results of my group related to application of atomic layer deposition (ALD) for fabricating environmental catalysts and organic solar cells. ALD was used for preparing thin films of TiO2 and NiO on mesporous silica with a mean pore size of 15 nm. Upon depositing TiO2 thin films of TiO2 using ALD, the mesoporous structure of the silica substrate was preserved to some extent. We show that efficiency for removing toluene by adsorption and catalytic oxidation is dependent of mean thickness of TiO2 deposited on silica, i.e., fine tuning of the thickness of thin film using ALD can be beneficial for preparing high-performing adsorbents and oxidation catalysts of volatile organic compound. NiO/silica system prepared by ALD was used for catalysts of chemical conversion of CO2. Here, NiO nanoparticles are well dispersed on silica and confiend in the pore, showing high catalytic activity and stability at 800oC for CO2 reforming of methane reaction. We also used ALD for surface modulation of buffer layers of organic solar cell. TiO2 and ZnO thin films were deposited on wet-chemically prepared ZnO ripple structures, and thin films with mean thickness of ~2 nm showed highest power conversion efficiency of organic solar cell. Moreover, performance of ALD-prepared organic solar cells were shown to be more stable than those without ALD. Thin films of oxides deposited on ZnO ripple buffer layer could heal defect sites of ZnO, which can act as recombination center of electrons and holes.

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Quantum Mechanical Simulation for the Analysis, Optimization and Accelerated Development of Precursors and Processes for Atomic Layer Deposition (ALD)

  • Mustard, Thomas Jeffrey Lomax;Kwak, Hyunwook Shaun;Goldberg, Alexander;Gavartin, Jacob;Morisato, Tsuguo;Yoshidome, Daisuke;Halls, Mathew David
    • 한국세라믹학회지
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    • 제53권3호
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    • pp.317-324
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    • 2016
  • Continued miniaturization and increasingly exact requirements for thin film deposition in the semiconductor industry is driving the search for new effective, efficient, selective precursors and processes. The requirements of defect-free, conformal films, and precise thickness control have focused attention on atomic layer deposition (ALD). ALD precursors so far have been developed through a trial-and-error experimental approach, leveraging the expertise and tribal knowledge of individual research groups. Precursors can show significant variation in performance, depending on specific choice of co-reactant, deposition stage, and processing conditions. The chemical design space for reactive thin film precursors is enormous and there is urgent need for the development of computational approaches to help identify new ligand-metal architectures and functional co-reactants that deliver the required surface activity for next-generation thin-film deposition processes. In this paper we discuss quantum mechanical simulation (e.g. density functional theory, DFT) applied to ALD precursor reactivity and state-of-the-art automated screening approaches to assist experimental efforts leading toward optimized precursors for next-generation ALD processes.

Silicide Formation of Atomic Layer Deposition Co Using Ti and Ru Capping Layer

  • Yoon, Jae-Hong;Lee, Han-Bo-Ram;Gu, Gil-Ho;Park, Chan-Gyung;Kim, Hyung-Jun
    • 한국재료학회지
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    • 제22권4호
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    • pp.202-206
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    • 2012
  • $CoSi_2$ was formed through annealing of atomic layer deposition Co thin films. Co ALD was carried out using bis(N,N'-diisopropylacetamidinato) cobalt ($Co(iPr-AMD)_2$) as a precursor and $NH_3$ as a reactant; this reaction produced a highly conformal Co film with low resistivity ($50\;{\mu}{\Omega}cm$). To prevent oxygen contamination, $ex-situ$ sputtered Ti and $in-situ$ ALD Ru were used as capping layers, and the silicide formation prepared by rapid thermal annealing (RTA) was used for comparison. Ru ALD was carried out with (Dimethylcyclopendienyl)(Ethylcyclopentadienyl) Ruthenium ((DMPD)(EtCp)Ru) and $O_2$ as a precursor and reactant, respectively; the resulting material has good conformality of as much as 90% in structure of high aspect ratio. X-ray diffraction showed that $CoSi_2$ was in a poly-crystalline state and formed at over $800^{\circ}C$ of annealing temperature for both cases. To investigate the as-deposited and annealed sample with each capping layer, high resolution scanning transmission electron microscopy (STEM) was employed with electron energy loss spectroscopy (EELS). After annealing, in the case of the Ti capping layer, $CoSi_2$ about 40 nm thick was formed while the $SiO_x$ interlayer, which is the native oxide, became thinner due to oxygen scavenging property of Ti. Although Si diffusion toward the outside occurred in the Ru capping layer case, and the Ru layer was not as good as the sputtered Ti layer, in terms of the lack of scavenging oxygen, the Ru layer prepared by the ALD process, with high conformality, acted as a capping layer, resulting in the prevention of oxidation and the formation of $CoSi_2$.

다양한 조건의 플라즈마 원자층 증착법으로 증착된 Mo 금속의 전기적 특성 (Electrical Properties of Molybdenum Metal Deposited by Plasma Enhanced - Atomic Layer Deposition of Variation Condition)

  • 임태완;장효식
    • 한국재료학회지
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    • 제29권11호
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    • pp.715-719
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    • 2019
  • Molybdenum is a low-resistivity transition metal that can be applied to silicon devices using Si-metal electrode structures and thin film solar cell electrodes. We investigate the deposition of metal Mo thin film by plasma-enhanced atomic layer deposition (PE-ALD). $Mo(CO)_6$ and $H_2$ plasma are used as precursor. $H_2$ plasma is induced between ALD cycles for reduction of $Mo(CO)_6$ and Mo film is deposited on Si substrate at $300^{\circ}C$. Through variation of PE-ALD conditions such as precursor pulse time, plasma pulse time and plasma power, we find that these conditions result in low resistivity. The resistivity is affected by Mo pulse time. We can find the reason through analyzing XPS data according to Mo pulse time. The thickness uniformity is affected by plasma power. The lowest resistivity is $176{\mu}{\Omega}{\cdot}cm$ at $Mo(CO)_6$ pulse time 3s. The thickness uniformity of metal Mo thin film deposited by PE-ALD shows a value of less than 3% below the plasma power of 200 W.

원자층증착법을 이용한 수소 생성용 광전기화학 전극 소재 개발 동향 (Recent Developments in H2 Production Photoelectrochemical Electrode Materials by Atomic Layer Deposition)

  • 한정환
    • 한국분말재료학회지
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    • 제25권1호
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    • pp.60-68
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    • 2018
  • The design and fabrication of photoelectrochemical (PEC) electrodes for efficient water splitting is important for developing a sustainable hydrogen evolution system. Among various development approaches for PEC electrodes, the chemical vapor deposition method of atomic layer deposition (ALD), based on self-limiting surface reactions, has attracted attention because it allows precise thickness and composition control as well as conformal coating on various substrates. In this study, recent research progress in improving PEC performance using ALD coating methods is discussed, including 3D and heterojunction-structured PEC electrodes, ALD coatings of noble metals, and the use of sulfide materials as co-catalysts. The enhanced long-term stability of PEC cells by ALD-deposited protecting layers is also reviewed. ALD provides multiple routes to develop improved hydrogen evolution PEC cells.