• Journal of the Institute of Electronics and Information Engineers
• /
• v.54 no.6
• /
• pp.25-29
• /
• 2017

This paper presents a hetero-integration of electrostatically actuated RF MEMS Switch and step up DC-DC converter on a redistribution layer using commercial PCB process. RF characteristics of Duroid with $56{\Omega}$ impedance GCPW transmission line and that of FR4 with $59{\Omega}$ impedance CPW transmission line were analyzed. From DC to 6GHz, RF characteristics of Duroid were better than that of FR4, insertion loss was 2.08dB lower, return loss was 3.91dB higher, and isolation was 3.33dB higher.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.4
• /
• pp.37-46
• /
• 2015

In this paper, the heat transfer characteristics of PCB (Printed Circuit Board) with cabon CCL (Copper Claded Layer) were studied through experiments and numerical analysis to compare of PCBs with conventional the FR-4 core and heavy copper cores. For study, samples are producted with HDI (High Density Interconnection) PCB of mobile phone with variations of thickness of core materials and grades of carbon material to evaluate heat transfer characteristics respectively. From this research results, heat transfer characteristics of the carbon core was rather low than heavy copper, but better than FR-4 core. In addition, even though the carbon and heavy copper core contributed on the heat transfer characteristics as their thickness increases, FR-4 cores disturbed heat transfer characteristics as it's thickness increases. Therefore, carbon core is recommendable to improve the heat transfer characteristics of the PCB because heavy copper core has much disadvantages such as increasing of wear of drill, the weight of PCB, and manufacturing cost by additional insulation materials for electrical insulation.

• Journal of The Institute of Information and Telecommunication Facilities Engineering
• /
• v.4 no.1
• /
• pp.31-36
• /
• 2005

In this paper, a planar type bandpass filter in multilayered PCB is presented. The multilayered PCB structure has some advantages on fabricating microwave devices such as the size reduction and ability of tight coupling by folding or embedding. The proposed BPF has two transmission zeros at the both sides of the center frequency by using independent electric and magnetic coupling structure. The designed BPF with four layer teflon PCBs of dielectric constant 2.94 has dimensions of 24x20x1.524 in mm, center frequency of 2.47GHz and bandwidth of about l00MHz. A good agrement is achieved between the measured result and the simulated one. The influences of air gaps between the layers are also analyzed and presented.

• Journal of the Korean Institute of Telematics and Electronics S
• /
• v.34S no.11
• /
• pp.34-42
• /
• 1997

In this paper, we show an optimal structure of impedance control in high density layouts ina high multilayers PCB. The impedance control in a high multilayers FR-4 PCB is very portant isue because a dielectric layer's thickness is very thin. Especially, odd mode impedance control is more difficult than characteristic impedance control in high multilayers PCB. So, we show an optimal structure of odd mode impedance control in that dielectric thickness is about 0.1mm with limited state and discuss multilayers PCB's for swich circuti pack and backplane in developing algorith scale ATM witching system in next time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.14-15
• /
• 2006

Application of the parallel Build-up is increasing continuously. This report presents about the PCB Build-up technology since 2000. Among the parallel build-up technologies, PALAP application - after making the via, filling the via with electric conductive paste, then expose to make wiring pattern and put them by layer without any glue or middle - is actively developing, especially DENSO company.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.22 no.11
• /
• pp.1133-1136
• /
• 2011

In this paper, we proposed a collinear antenna with a stripline structure for IEEE 802.11b/g applications in ISM (Industrial, Scientific, Medical) band of 2.4~2.5 GHz, which supplements disadvantages of COCO(Coaxial Collinear) antenna and OMA(Omnidirectional planar Microstrip Antenna). By using the proposed 4-layer substrate, we obtained improved performances and advantages in production compared with the existing antenna. In order to get antenna arrays, the same phase structure is designed by alternatively connecting outer conductor to inner conductor with ${\lambda}$/2 antenna element, and the substrate of FR4 epoxy (${\epsilon}_r$=4.4, tan${\delta}$=0.02) was used for the actual implementation. The maximum gain of about 4.93 dBi was measured, which leaded to a little improved gain of 0.33 dBi in comparison to the existing OMA structure.

• Journal of the Institute of Electronics Engineers of Korea TE
• /
• v.42 no.4
• /
• pp.1-6
• /
• 2005

Recently embedded passive technology which fabricate passive elements such as resistors and capacitors at the inner layer of PCB(Printed Circuit Board) is used to make high performance IT products. However, embedded capacitor has limit in full range circuit applications because of the low capacitance density. In this paper, a new embedded capacitor which has wrinkled electrodes and dielectric layer was proposed to overcome the limits. FEM(Finite Elements Method) technique was used to evaluate capacitance density of the wrinkled type embedded capacitor. Capacitance density of the wrinkled type embedded capacitor is larger than that of conventional planar type embedded capacitor by about 25.6%$\sim$39.6%. In case of thin film type embedded capacitor, proposed wrinkled structure has more enhanced effect on the capacitance density.

• Korean Journal of Fisheries and Aquatic Sciences
• /
• v.30 no.4
• /
• pp.679-686
• /
• 1997

In order to investigate the distribution characteristics of polychlorinated Biphenyls (PCBs) at the southern of Korean East Sea, vertical measurements of temperature, salinity, DO and PCBs were performed by each depth of 5 stations during August - October 1996. Thermocline and salinocline were generally existed at depth of 30 m and water mass current of midwater in the southern of Korean East Sea was distributed below 30 m depth. The distribution of surface water mass in this area was extended to Tsusima area from the southern offshore of the Korean last Sea. In August 1996, concentration range of PCBs had $0.22\~0.36\;ng/\ell$ at surface layer and their concentrations at near Tsusima offshore were relatively decreased. Total mean concentration of PCBs was $0.29\;ng/\ell$ in the sea surface and $0.31\;ng/\ell$ in the middle layer. PCBs seemed to correlate well with suspended particles. And vortical and horizontal distribution of their concentrations showed comparatively uniform pattern. Relatively high compositional ratio of Di- and Tri-PCBs could be found at the sea surface, while compositional ratio of Penta-PCBs dominates over other congener at deep layer.

• Journal of Satellite, Information and Communications
• /
• v.9 no.4
• /
• pp.42-46
• /
• 2014

In this paper, a coil typed electromagnetic band gap (EBG) structure to be inserted in the printed circuit board (PCB) inner layer in order to stabilize the PCB power line is proposed and implemented for global-navigation satellite service (GNSS) with the bandwidth from 1.55GHz to 1.81GHz. From the measurement result of the PCB board including EBG structure, the insertion loss(S21) was measured below about -50dB. From these results, it is expected that the stabilization of power delivery network (PDN) structure in the PCB circuit design should be improved and the preparation to EMI will be effective.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1999.05a
• /
• pp.708-711
• /
• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.