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http://dx.doi.org/10.5573/ieie.2017.54.6.25

A Study on a Hetero-Integration of RF MEMS Switch and DC-DC Converter Using Commercial PCB Process  

Jang, Yeonsu (DRAM Design Division, SK Hynix)
Yang, Woo-Jin (Dept. of Electrical and Computer Engineering, Seoul National University, Inter-university Semiconductor Research Center)
Chun, Kukjin (Dept. of Electrical and Computer Engineering, Seoul National University, Inter-university Semiconductor Research Center)
Publication Information
Journal of the Institute of Electronics and Information Engineers / v.54, no.6, 2017 , pp. 25-29 More about this Journal
Abstract
This paper presents a hetero-integration of electrostatically actuated RF MEMS Switch and step up DC-DC converter on a redistribution layer using commercial PCB process. RF characteristics of Duroid with $56{\Omega}$ impedance GCPW transmission line and that of FR4 with $59{\Omega}$ impedance CPW transmission line were analyzed. From DC to 6GHz, RF characteristics of Duroid were better than that of FR4, insertion loss was 2.08dB lower, return loss was 3.91dB higher, and isolation was 3.33dB higher.
Keywords
hetero-integration; redistribution layer; RF MEMS switch; DC-DC converter; flipchip bonding;
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